SG161273A1 - Non-aqueous photoresist stripper that inhibits galvanic corrosion - Google Patents
Non-aqueous photoresist stripper that inhibits galvanic corrosionInfo
- Publication number
- SG161273A1 SG161273A1 SG201002616-9A SG2010026169A SG161273A1 SG 161273 A1 SG161273 A1 SG 161273A1 SG 2010026169 A SG2010026169 A SG 2010026169A SG 161273 A1 SG161273 A1 SG 161273A1
- Authority
- SG
- Singapore
- Prior art keywords
- cleaning compositions
- amine group
- aqueous
- independently
- galvanic corrosion
- Prior art date
Links
- 230000007797 corrosion Effects 0.000 title abstract 3
- 238000005260 corrosion Methods 0.000 title abstract 3
- 229920002120 photoresistant polymer Polymers 0.000 title abstract 3
- 238000004140 cleaning Methods 0.000 abstract 3
- 239000000203 mixture Substances 0.000 abstract 3
- -1 alkane diols Chemical class 0.000 abstract 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 abstract 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 abstract 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 2
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 abstract 2
- 125000001302 tertiary amino group Chemical group 0.000 abstract 2
- 239000005725 8-Hydroxyquinoline Substances 0.000 abstract 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 abstract 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 abstract 1
- HEBKCHPVOIAQTA-QWWZWVQMSA-N D-arabinitol Chemical compound OC[C@@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-QWWZWVQMSA-N 0.000 abstract 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 abstract 1
- 239000004386 Erythritol Substances 0.000 abstract 1
- UNXHWFMMPAWVPI-UHFFFAOYSA-N Erythritol Natural products OCC(O)C(O)CO UNXHWFMMPAWVPI-UHFFFAOYSA-N 0.000 abstract 1
- 229930195725 Mannitol Natural products 0.000 abstract 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 125000004103 aminoalkyl group Chemical group 0.000 abstract 1
- 150000001565 benzotriazoles Chemical class 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 235000019414 erythritol Nutrition 0.000 abstract 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 abstract 1
- 229940009714 erythritol Drugs 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 239000000594 mannitol Substances 0.000 abstract 1
- 235000010355 mannitol Nutrition 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 150000002772 monosaccharides Chemical class 0.000 abstract 1
- 230000009972 noncorrosive effect Effects 0.000 abstract 1
- 229960003540 oxyquinoline Drugs 0.000 abstract 1
- 239000003495 polar organic solvent Substances 0.000 abstract 1
- 229920000768 polyamine Polymers 0.000 abstract 1
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical group C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 abstract 1
- 239000000600 sorbitol Substances 0.000 abstract 1
- 150000005846 sugar alcohols Polymers 0.000 abstract 1
- 239000000811 xylitol Substances 0.000 abstract 1
- 235000010447 xylitol Nutrition 0.000 abstract 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 abstract 1
- 229960002675 xylitol Drugs 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3723—Polyamines or polyalkyleneimines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Laminated Bodies (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Pens And Brushes (AREA)
- Golf Clubs (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67292305P | 2005-04-19 | 2005-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG161273A1 true SG161273A1 (en) | 2010-05-27 |
Family
ID=36754183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG201002616-9A SG161273A1 (en) | 2005-04-19 | 2006-03-16 | Non-aqueous photoresist stripper that inhibits galvanic corrosion |
Country Status (20)
| Country | Link |
|---|---|
| US (1) | US20080280235A1 (de) |
| EP (1) | EP1877870B1 (de) |
| JP (1) | JP4677030B2 (de) |
| KR (1) | KR101088568B1 (de) |
| CN (1) | CN101164016B (de) |
| AT (1) | ATE498859T1 (de) |
| BR (1) | BRPI0610852A2 (de) |
| CA (1) | CA2605236A1 (de) |
| DE (1) | DE602006020125D1 (de) |
| DK (1) | DK1877870T3 (de) |
| ES (1) | ES2361271T3 (de) |
| IL (1) | IL186565A0 (de) |
| MY (1) | MY145299A (de) |
| NO (1) | NO20075935L (de) |
| PL (1) | PL1877870T3 (de) |
| PT (1) | PT1877870E (de) |
| SG (1) | SG161273A1 (de) |
| TW (1) | TW200700549A (de) |
| WO (1) | WO2006112994A1 (de) |
| ZA (1) | ZA200706296B (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5236217B2 (ja) * | 2006-06-22 | 2013-07-17 | 東進セミケム株式会社 | レジスト除去用組成物 |
| US7851655B2 (en) * | 2006-12-19 | 2010-12-14 | Nalco Company | Functionalized amine-based corrosion inhibitors for galvanized metal surfaces and method of using same |
| WO2009111719A2 (en) * | 2008-03-07 | 2009-09-11 | Advanced Technology Materials, Inc. | Non-selective oxide etch wet clean composition and method of use |
| JP4903242B2 (ja) * | 2008-10-28 | 2012-03-28 | アバントール パフォーマンス マテリアルズ， インコーポレイテッド | 多金属デバイス処理のためのグルコン酸含有フォトレジスト洗浄組成物 |
| US8110535B2 (en) * | 2009-08-05 | 2012-02-07 | Air Products And Chemicals, Inc. | Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same |
| US8518865B2 (en) | 2009-08-31 | 2013-08-27 | Air Products And Chemicals, Inc. | Water-rich stripping and cleaning formulation and method for using same |
| JP6231017B2 (ja) * | 2012-02-06 | 2017-11-15 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | 特定の硫黄含有化合物および糖アルコールまたはポリカルボン酸を含む、ポスト化学機械研磨（ポストｃｍｐ）洗浄組成物 |
| CN103389627A (zh) * | 2012-05-11 | 2013-11-13 | 安集微电子科技(上海)有限公司 | 一种光刻胶清洗液 |
| US11168288B2 (en) * | 2018-02-14 | 2021-11-09 | Merck Patent Gmbh | Photoresist remover compositions |
| JP7176089B2 (ja) | 2018-07-20 | 2022-11-21 | インテグリス・インコーポレーテッド | 腐食防止剤を含む洗浄組成物 |
| CN109557774A (zh) * | 2019-01-22 | 2019-04-02 | 上海华虹宏力半导体制造有限公司 | 光刻胶去除方法及铝制程工艺方法 |
| CN110967946A (zh) * | 2019-12-04 | 2020-04-07 | 苏州博洋化学股份有限公司 | 一种高效碱性光刻胶剥离液 |
| EP4440252A1 (de) * | 2023-03-31 | 2024-10-02 | Atotech Deutschland GmbH & Co. KG | Verfahren zum entfernen eines organischen harzes von einer oberfläche eines substrats |
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| US4478827A (en) * | 1983-05-09 | 1984-10-23 | The General Hospital Corporation | Renin inhibitors |
| KR890004583B1 (ko) * | 1984-06-29 | 1989-11-16 | 히다찌가세이고오교 가부시끼가이샤 | 금속표면 처리공정 |
| US4671251A (en) * | 1984-09-24 | 1987-06-09 | Ohio State University | Fluidized bed combustor |
| DE3537441A1 (de) * | 1985-10-22 | 1987-04-23 | Hoechst Ag | Loesemittel zum entfernen von photoresists |
| US4824763A (en) * | 1987-07-30 | 1989-04-25 | Ekc Technology, Inc. | Triamine positive photoresist stripping composition and prebaking process |
| US5166039A (en) * | 1988-02-25 | 1992-11-24 | Hoya Corporation | Peeling solution for photo- or electron beam-sensitive resin and process for peeling off said resin |
| US5037724A (en) * | 1988-02-25 | 1991-08-06 | Hoya Corporation | Peeling solution for photo- or electron beam-sensitive resin |
| US4921571A (en) * | 1989-07-28 | 1990-05-01 | Macdermid, Incorporated | Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces |
| US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
| US5988186A (en) * | 1991-01-25 | 1999-11-23 | Ashland, Inc. | Aqueous stripping and cleaning compositions |
| US5753601A (en) * | 1991-01-25 | 1998-05-19 | Ashland Inc | Organic stripping composition |
| US5556482A (en) * | 1991-01-25 | 1996-09-17 | Ashland, Inc. | Method of stripping photoresist with composition containing inhibitor |
| US5496491A (en) * | 1991-01-25 | 1996-03-05 | Ashland Oil Company | Organic stripping composition |
| JP3160344B2 (ja) * | 1991-01-25 | 2001-04-25 | アシュランド インコーポレーテッド | 有機ストリッピング組成物 |
| US5472823A (en) * | 1992-01-20 | 1995-12-05 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition |
| US6825156B2 (en) * | 2002-06-06 | 2004-11-30 | Ekc Technology, Inc. | Semiconductor process residue removal composition and process |
| US5597678A (en) * | 1994-04-18 | 1997-01-28 | Ocg Microelectronic Materials, Inc. | Non-corrosive photoresist stripper composition |
| US5545353A (en) * | 1995-05-08 | 1996-08-13 | Ocg Microelectronic Materials, Inc. | Non-corrosive photoresist stripper composition |
| US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US5498293A (en) * | 1994-06-23 | 1996-03-12 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| US5554312A (en) * | 1995-01-13 | 1996-09-10 | Ashland | Photoresist stripping composition |
| US5561105A (en) * | 1995-05-08 | 1996-10-01 | Ocg Microelectronic Materials, Inc. | Chelating reagent containing photoresist stripper composition |
| US5507978A (en) * | 1995-05-08 | 1996-04-16 | Ocg Microelectronic Materials, Inc. | Novolak containing photoresist stripper composition |
| US5612304A (en) * | 1995-07-07 | 1997-03-18 | Olin Microelectronic Chemicals, Inc. | Redox reagent-containing post-etch residue cleaning composition |
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| SG77710A1 (en) * | 1998-09-09 | 2001-01-16 | Tokuyama Corp | Photoresist ashing residue cleaning agent |
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| US6531436B1 (en) | 2000-02-25 | 2003-03-11 | Shipley Company, L.L.C. | Polymer removal |
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| US6455479B1 (en) * | 2000-08-03 | 2002-09-24 | Shipley Company, L.L.C. | Stripping composition |
| US6558879B1 (en) * | 2000-09-25 | 2003-05-06 | Ashland Inc. | Photoresist stripper/cleaner compositions containing aromatic acid inhibitors |
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| US20040256358A1 (en) * | 2001-11-02 | 2004-12-23 | Hidetaka Shimizu | Method for releasing resist |
| US6943142B2 (en) | 2002-01-09 | 2005-09-13 | Air Products And Chemicals, Inc. | Aqueous stripping and cleaning composition |
| JP2004101849A (ja) * | 2002-09-09 | 2004-04-02 | Mitsubishi Gas Chem Co Inc | 洗浄剤組成物 |
| JP4165208B2 (ja) * | 2002-12-24 | 2008-10-15 | 東ソー株式会社 | レジスト剥離方法 |
| US7119052B2 (en) * | 2003-06-24 | 2006-10-10 | Advanced Technology Materials, Inc. | Compositions and methods for high-efficiency cleaning/polishing of semiconductor wafers |
| DK1787168T3 (da) * | 2004-07-15 | 2010-08-09 | Mallinckrodt Baker Inc | Ikke-vandige mikroelektroniske rengøringssammensætninger indeholdende fruktose |
| JP4625842B2 (ja) * | 2004-08-03 | 2011-02-02 | マリンクロッド・ベイカー・インコーポレイテッド | マイクロエレクトロニクスの基板用の洗浄組成物 |
| KR20060064441A (ko) * | 2004-12-08 | 2006-06-13 | 말린크로트 베이커, 인코포레이티드 | 비수성 비부식성 마이크로전자 세정 조성물 |
| PT1828848E (pt) * | 2004-12-10 | 2010-05-21 | Mallinckrodt Baker Inc | Composições de limpeza para microelectrónica, não aquosas e não corrosivas, contendo inibidores da corrosão poliméricos |
-
2005
- 2005-05-12 KR KR1020050039700A patent/KR101088568B1/ko active IP Right Grant
-
2006
- 2006-03-16 CA CA002605236A patent/CA2605236A1/en not_active Abandoned
- 2006-03-16 AT AT06738451T patent/ATE498859T1/de active
- 2006-03-16 EP EP06738451A patent/EP1877870B1/de not_active Not-in-force
- 2006-03-16 SG SG201002616-9A patent/SG161273A1/en unknown
- 2006-03-16 PL PL06738451T patent/PL1877870T3/pl unknown
- 2006-03-16 JP JP2008507660A patent/JP4677030B2/ja not_active Expired - Fee Related
- 2006-03-16 BR BRPI0610852-0A patent/BRPI0610852A2/pt not_active IP Right Cessation
- 2006-03-16 ES ES06738451T patent/ES2361271T3/es active Active
- 2006-03-16 WO PCT/US2006/009389 patent/WO2006112994A1/en active Application Filing
- 2006-03-16 US US11/910,281 patent/US20080280235A1/en not_active Abandoned
- 2006-03-16 CN CN2006800132023A patent/CN101164016B/zh active Active
- 2006-03-16 DK DK06738451.1T patent/DK1877870T3/da active
- 2006-03-16 DE DE602006020125T patent/DE602006020125D1/de active Active
- 2006-03-16 PT PT06738451T patent/PT1877870E/pt unknown
- 2006-03-29 MY MYPI20061377A patent/MY145299A/en unknown
- 2006-03-31 TW TW095111632A patent/TW200700549A/zh unknown
-
2007
- 2007-07-30 ZA ZA200706296A patent/ZA200706296B/xx unknown
- 2007-10-10 IL IL186565A patent/IL186565A0/en not_active IP Right Cessation
- 2007-11-19 NO NO20075935A patent/NO20075935L/no not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| DE602006020125D1 (de) | 2011-03-31 |
| BRPI0610852A2 (pt) | 2010-08-03 |
| KR101088568B1 (ko) | 2011-12-05 |
| MY145299A (en) | 2012-01-13 |
| WO2006112994A1 (en) | 2006-10-26 |
| PT1877870E (pt) | 2011-05-24 |
| ATE498859T1 (de) | 2011-03-15 |
| EP1877870B1 (de) | 2011-02-16 |
| JP4677030B2 (ja) | 2011-04-27 |
| CA2605236A1 (en) | 2006-10-26 |
| CN101164016A (zh) | 2008-04-16 |
| ES2361271T3 (es) | 2011-06-15 |
| ZA200706296B (en) | 2008-09-25 |
| IL186565A0 (en) | 2008-01-20 |
| EP1877870A1 (de) | 2008-01-16 |
| NO20075935L (no) | 2008-01-18 |
| TW200700549A (en) | 2007-01-01 |
| DK1877870T3 (da) | 2011-05-02 |
| JP2008537182A (ja) | 2008-09-11 |
| CN101164016B (zh) | 2010-12-01 |
| KR20060110712A (ko) | 2006-10-25 |
| US20080280235A1 (en) | 2008-11-13 |
| PL1877870T3 (pl) | 2011-07-29 |
Similar Documents
| Publication | Publication Date | Title |
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