SG159567A1 - Automated throughput control system and method of operating the same - Google Patents

Automated throughput control system and method of operating the same

Info

Publication number
SG159567A1
SG159567A1 SG201001254-0A SG2010012540A SG159567A1 SG 159567 A1 SG159567 A1 SG 159567A1 SG 2010012540 A SG2010012540 A SG 2010012540A SG 159567 A1 SG159567 A1 SG 159567A1
Authority
SG
Singapore
Prior art keywords
control system
operating
same
performance characteristics
throughput control
Prior art date
Application number
SG201001254-0A
Other languages
English (en)
Inventor
Gunnar Flach
Thomas Quarg
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of SG159567A1 publication Critical patent/SG159567A1/en

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31336—Store machines performance; use it to control future machining
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32184—Compare time, quality, state of operators with threshold value
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32191—Real time statistical process monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32201—Build statistical model of past normal proces, compare with actual process
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/10—Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
SG201001254-0A 2005-02-28 2006-01-27 Automated throughput control system and method of operating the same SG159567A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005009022A DE102005009022A1 (de) 2005-02-28 2005-02-28 Automatisches Durchsatzsteuerungssystem und Verfahren zum Betreiben desselben
US11/247,373 US20060195212A1 (en) 2005-02-28 2005-10-11 Automated throughput control system and method of operating the same

Publications (1)

Publication Number Publication Date
SG159567A1 true SG159567A1 (en) 2010-03-30

Family

ID=36847981

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001254-0A SG159567A1 (en) 2005-02-28 2006-01-27 Automated throughput control system and method of operating the same

Country Status (6)

Country Link
US (2) US20060195212A1 (ja)
JP (1) JP5384009B2 (ja)
CN (1) CN101128786B (ja)
DE (1) DE102005009022A1 (ja)
SG (1) SG159567A1 (ja)
TW (1) TWI414917B (ja)

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DE102006004408B4 (de) * 2006-01-31 2010-03-18 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Analysieren von standardmäßigen Anlagennachrichten in einer Fertigungsumgebung
JP4607157B2 (ja) * 2007-07-25 2011-01-05 株式会社日立ハイテクノロジーズ 観察装置、観察装置のレシピ設定方法
US8233494B2 (en) * 2008-01-22 2012-07-31 International Business Machines Corporation Hierarchical and incremental multivariate analysis for process control
US8170704B2 (en) * 2008-03-31 2012-05-01 Globalfoundries Inc. Method and system for automatic generation of throughput models for semiconductor tools
US7962234B2 (en) * 2008-06-09 2011-06-14 International Business Machines Corporation Multidimensional process window optimization in semiconductor manufacturing
CN102177576B (zh) * 2008-10-08 2013-12-18 应用材料公司 检测处理设备闲置模式的方法及装置
EP2237197A1 (en) * 2009-03-31 2010-10-06 Siemens Aktiengesellschaft Method for evaluating key production indicators (KPI) in a manufacturing execution system (MES)
JP5523753B2 (ja) * 2009-07-10 2014-06-18 株式会社日立製作所 生産指標情報生成装置、プログラム及び生産情報生成方法
US10101735B2 (en) * 2012-07-10 2018-10-16 Matitiahu Tiano Modular system for real-time evaluation and monitoring of a machining production-line overall performances calculated from each given workpiece, tool and machine
WO2014050808A1 (ja) * 2012-09-26 2014-04-03 株式会社日立国際電気 統合管理システム、管理装置、基板処理装置の情報表示方法及び記録媒体
US9128721B2 (en) * 2012-12-11 2015-09-08 Apple Inc. Closed loop CPU performance control
WO2014189045A1 (ja) * 2013-05-22 2014-11-27 株式会社日立国際電気 管理装置、基板処理システム、装置情報更新方法、及び記録媒体
CN103353954A (zh) * 2013-06-04 2013-10-16 上海华力微电子有限公司 动态产能分配系统及方法
TW201600981A (zh) * 2014-06-27 2016-01-01 力晶科技股份有限公司 監控根據複數個製程配方運作之製程狀態的方法暨其系統
FR3029620B1 (fr) * 2014-12-05 2019-06-14 Safran Aircraft Engines Procede de suivi de la fabrication de pieces base sur l'analyse simultanee d'indicateurs statistiques
FR3029622B1 (fr) * 2014-12-05 2019-06-14 Safran Aircraft Engines Procede de suivi de la fabrication de pieces base sur l'analyse de coefficients de centrage
US10067905B2 (en) * 2015-05-26 2018-09-04 Plasmability, Llc Digital interface for manufacturing equipment
CN108363362B (zh) * 2017-01-26 2022-04-19 台湾积体电路制造股份有限公司 半导体机台产能模拟方法及半导体机台产能模拟系统
TWI661326B (zh) * 2017-01-26 2019-06-01 台灣積體電路製造股份有限公司 半導體機台產能模擬方法及半導體機台產能模擬系統
TWI663569B (zh) * 2017-11-20 2019-06-21 財團法人資訊工業策進會 多工作站系統的品質預測方法及其系統
TWI693564B (zh) * 2018-01-05 2020-05-11 竹陞科技股份有限公司 機台自動化管理系統及其方法
US20220019203A1 (en) * 2020-07-16 2022-01-20 Changxin Memory Technologies, Inc. Method and device for processing semiconductor manufacturing information

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JP2541544B2 (ja) * 1987-04-14 1996-10-09 株式会社日立製作所 半導体製造装置
JPH07141019A (ja) * 1993-11-13 1995-06-02 Mitsubishi Chem Corp プラント監視装置
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Also Published As

Publication number Publication date
TWI414917B (zh) 2013-11-11
CN101128786A (zh) 2008-02-20
TW200636411A (en) 2006-10-16
US20090292385A1 (en) 2009-11-26
US7783372B2 (en) 2010-08-24
JP5384009B2 (ja) 2014-01-08
JP2008532312A (ja) 2008-08-14
US20060195212A1 (en) 2006-08-31
CN101128786B (zh) 2013-04-24
DE102005009022A1 (de) 2006-09-07

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