SG151232A1 - Box cleaner for cleaning wafer shipping box - Google Patents

Box cleaner for cleaning wafer shipping box

Info

Publication number
SG151232A1
SG151232A1 SG200807194-6A SG2008071946A SG151232A1 SG 151232 A1 SG151232 A1 SG 151232A1 SG 2008071946 A SG2008071946 A SG 2008071946A SG 151232 A1 SG151232 A1 SG 151232A1
Authority
SG
Singapore
Prior art keywords
box
shipping box
cleaner
ultrasonic cleaning
cleaning bath
Prior art date
Application number
SG200807194-6A
Other languages
English (en)
Inventor
Oh Se-Youl
Original Assignee
Siltron Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltron Inc filed Critical Siltron Inc
Publication of SG151232A1 publication Critical patent/SG151232A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/08—Cleaning containers, e.g. tanks
    • B08B9/0861—Cleaning crates, boxes or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200807194-6A 2007-09-28 2008-09-24 Box cleaner for cleaning wafer shipping box SG151232A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070097817A KR100958793B1 (ko) 2007-09-28 2007-09-28 웨이퍼 쉽핑박스의 세정을 위한 박스 크리너

Publications (1)

Publication Number Publication Date
SG151232A1 true SG151232A1 (en) 2009-04-30

Family

ID=40340683

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200807194-6A SG151232A1 (en) 2007-09-28 2008-09-24 Box cleaner for cleaning wafer shipping box

Country Status (5)

Country Link
US (1) US7976642B2 (ko)
EP (1) EP2042245B1 (ko)
JP (1) JP5203868B2 (ko)
KR (1) KR100958793B1 (ko)
SG (1) SG151232A1 (ko)

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CN101947524B (zh) * 2010-09-19 2012-07-04 南车株洲电机有限公司 高速重载交流牵引电机定子机座超声清洗方法及设备
CN102029274B (zh) * 2010-12-31 2012-08-22 山西华能食品包装机械有限公司 超声波洗箱机
KR101367582B1 (ko) * 2011-11-14 2014-02-26 주식회사 엘지실트론 박스 클리너
CN103934234B (zh) * 2014-04-11 2016-01-06 元亮科技有限公司 一种抛光片载片盒的清洗工艺
CN108043813A (zh) * 2017-11-30 2018-05-18 芜湖戎征达伺服驱动技术有限公司 钢板自动清洗机
CN108262305A (zh) * 2017-12-19 2018-07-10 无锡其宏包装材料厂 一种台式超声波清洗机
CN108746056A (zh) * 2018-04-12 2018-11-06 陈志煌 一种石油开采用探头清洗装置
CN108714605B (zh) * 2018-07-14 2024-02-06 青岛环速科技有限公司 一种可任意拆卸组合的多用途洗筐机
CN109092745A (zh) * 2018-08-17 2018-12-28 天马（安徽）国药科技股份有限公司 一种具有烘干功能的中药清洗装置
CN109107992B (zh) * 2018-10-30 2020-08-14 麻城市大恒汽车零部件股份有限公司 一种膜片弹簧生产整理用装置
CN110128033A (zh) * 2019-05-23 2019-08-16 深圳市华星光电技术有限公司 一种烘烤设备
CN112792041A (zh) * 2019-11-14 2021-05-14 新邵县鸿远金属加工有限公司 一种再生铝加工用前处理装置
CN111715642A (zh) * 2020-07-02 2020-09-29 重庆凯益特种气体有限公司 一种气瓶清洗方法
CN112775097B (zh) * 2020-12-23 2022-02-01 南京晓庄学院 一种pan基碳纤维材料超声波水洗装置
CN114289406A (zh) * 2022-01-11 2022-04-08 南京乾锋机械设备有限公司 一种硬质合金机械刀片涂层表面除尘装置

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Also Published As

Publication number Publication date
US7976642B2 (en) 2011-07-12
EP2042245A3 (en) 2010-04-21
EP2042245A2 (en) 2009-04-01
KR20090032505A (ko) 2009-04-01
EP2042245B1 (en) 2016-07-20
JP2009088513A (ja) 2009-04-23
KR100958793B1 (ko) 2010-05-18
JP5203868B2 (ja) 2013-06-05
US20090084416A1 (en) 2009-04-02

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