SG148976A1 - Method and apparatus for inspection and fault analysis - Google Patents
Method and apparatus for inspection and fault analysisInfo
- Publication number
- SG148976A1 SG148976A1 SG200804893-6A SG2008048936A SG148976A1 SG 148976 A1 SG148976 A1 SG 148976A1 SG 2008048936 A SG2008048936 A SG 2008048936A SG 148976 A1 SG148976 A1 SG 148976A1
- Authority
- SG
- Singapore
- Prior art keywords
- signal
- lsi chip
- inspection
- fault analysis
- amplifier
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/30—Marginal testing, e.g. by varying supply voltage
- G01R31/3004—Current or voltage test
- G01R31/3008—Quiescent current [IDDQ] test or leakage current test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007172555A JP4917975B2 (ja) | 2007-06-29 | 2007-06-29 | 検査故障解析方法及び検査故障解析装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG148976A1 true SG148976A1 (en) | 2009-01-29 |
Family
ID=40020150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200804893-6A SG148976A1 (en) | 2007-06-29 | 2008-06-27 | Method and apparatus for inspection and fault analysis |
Country Status (7)
Country | Link |
---|---|
US (1) | US8090191B2 (ja) |
EP (1) | EP2012353A3 (ja) |
JP (1) | JP4917975B2 (ja) |
KR (1) | KR20090004481A (ja) |
CN (1) | CN101349664A (ja) |
SG (1) | SG148976A1 (ja) |
TW (1) | TW200921126A (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5272804B2 (ja) * | 2009-03-02 | 2013-08-28 | 富士ゼロックス株式会社 | 情報処理装置及びプログラム |
FR2978559B1 (fr) * | 2011-07-29 | 2014-03-21 | Centre Nat Etd Spatiales | Procede et dispositif d'analyse d'un assemblage a remplissage aleatoire des points de test par les parametres mesures |
CN102338857A (zh) * | 2011-08-03 | 2012-02-01 | 上海华碧检测技术有限公司 | 一种卡类产品芯片碎裂的无损检测方法 |
WO2013128234A1 (en) * | 2012-02-27 | 2013-09-06 | Freescale Semiconductor, Inc. | Method of detecting irregular current flow in an integrated circuit device and apparatus therefor |
CN103929128B (zh) * | 2014-04-22 | 2015-12-02 | 哈尔滨工业大学 | 一种硅片与硅基太阳能电池的少数载流子传输特性检测方法 |
CN105092995B (zh) * | 2014-04-30 | 2017-11-14 | 中芯国际集成电路制造(北京)有限公司 | 芯片中静态电流失效器件的检测方法和装置 |
CN105717170A (zh) * | 2016-02-18 | 2016-06-29 | 工业和信息化部电子第五研究所 | 激光诱导阻抗变化测试方法和系统 |
US10755404B2 (en) | 2017-12-07 | 2020-08-25 | International Business Machines Corporation | Integrated circuit defect detection using pattern images |
JP7158224B2 (ja) | 2018-09-26 | 2022-10-21 | 浜松ホトニクス株式会社 | 半導体デバイス検査方法及び半導体デバイス検査装置 |
WO2021241007A1 (ja) * | 2020-05-26 | 2021-12-02 | 浜松ホトニクス株式会社 | 半導体デバイス検査方法及び半導体デバイス検査装置 |
WO2021241008A1 (ja) * | 2020-05-26 | 2021-12-02 | 浜松ホトニクス株式会社 | 半導体デバイス検査方法及び半導体デバイス検査装置 |
JP2022093970A (ja) * | 2020-12-14 | 2022-06-24 | トヨタ自動車株式会社 | 異常診断システム、異常診断方法及びプログラム |
CN113009319B (zh) * | 2021-02-25 | 2022-06-07 | 湖北工业大学 | 一种图像压缩光学芯片的实时在线制作检测系统及方法 |
CN116594700B (zh) * | 2023-07-17 | 2023-12-12 | 合肥康芯威存储技术有限公司 | 一种克隆eMMC芯片的方法、装置、电子设备及存储介质 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3531129A1 (de) * | 1985-08-30 | 1987-03-12 | Siemens Ag | Verfahren und anordnung zum betrieb eines rastermikroskopes |
JP2900858B2 (ja) * | 1995-09-28 | 1999-06-02 | 日本電気株式会社 | Cmos論理回路の故障箇所特定方法 |
JP2970505B2 (ja) | 1995-11-21 | 1999-11-02 | 日本電気株式会社 | 半導体デバイスの配線電流観測方法、検査方法および装置 |
JP2900877B2 (ja) * | 1996-03-22 | 1999-06-02 | 日本電気株式会社 | 半導体デバイスの配線電流観測方法、配線系欠陥検査方法およびその装置 |
US6078183A (en) * | 1998-03-03 | 2000-06-20 | Sandia Corporation | Thermally-induced voltage alteration for integrated circuit analysis |
JPH11310266A (ja) | 1998-04-30 | 1999-11-09 | Canon Inc | インクカートリッジの包装形態 |
JP2000031228A (ja) * | 1998-07-10 | 2000-01-28 | Ricoh Co Ltd | 半導体装置の製造方法及び検査方法 |
US6549022B1 (en) * | 2000-06-02 | 2003-04-15 | Sandia Corporation | Apparatus and method for analyzing functional failures in integrated circuits |
JP2002313859A (ja) * | 2001-02-09 | 2002-10-25 | Nec Corp | 非破壊検査方法および装置ならびに半導体チップ |
US6617862B1 (en) * | 2002-02-27 | 2003-09-09 | Advanced Micro Devices, Inc. | Laser intrusive technique for locating specific integrated circuit current paths |
US6967491B2 (en) * | 2003-07-11 | 2005-11-22 | Credence Systems Corporation | Spatial and temporal selective laser assisted fault localization |
JP4557526B2 (ja) * | 2003-11-10 | 2010-10-06 | パナソニック株式会社 | 半導体集積回路及び半導体集積回路の故障検出方法 |
JP2007017255A (ja) | 2005-07-07 | 2007-01-25 | Ngk Spark Plug Co Ltd | 静電式液体状態検知センサ |
JP2007127590A (ja) * | 2005-11-07 | 2007-05-24 | Nec Electronics Corp | 半導体装置の検査方法および装置 |
-
2007
- 2007-06-29 JP JP2007172555A patent/JP4917975B2/ja not_active Expired - Fee Related
-
2008
- 2008-05-28 KR KR1020080049644A patent/KR20090004481A/ko not_active Application Discontinuation
- 2008-06-26 EP EP08011597A patent/EP2012353A3/en not_active Withdrawn
- 2008-06-27 CN CNA2008101285417A patent/CN101349664A/zh active Pending
- 2008-06-27 SG SG200804893-6A patent/SG148976A1/en unknown
- 2008-06-27 TW TW097124197A patent/TW200921126A/zh unknown
- 2008-06-30 US US12/164,594 patent/US8090191B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP4917975B2 (ja) | 2012-04-18 |
KR20090004481A (ko) | 2009-01-12 |
CN101349664A (zh) | 2009-01-21 |
US8090191B2 (en) | 2012-01-03 |
JP2009008627A (ja) | 2009-01-15 |
EP2012353A3 (en) | 2013-02-20 |
EP2012353A2 (en) | 2009-01-07 |
US20090003685A1 (en) | 2009-01-01 |
TW200921126A (en) | 2009-05-16 |
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