SG144891A1 - Image sensor package with die receiving opening and method of the same - Google Patents
Image sensor package with die receiving opening and method of the sameInfo
- Publication number
- SG144891A1 SG144891A1 SG200800894-8A SG2008008948A SG144891A1 SG 144891 A1 SG144891 A1 SG 144891A1 SG 2008008948 A SG2008008948 A SG 2008008948A SG 144891 A1 SG144891 A1 SG 144891A1
- Authority
- SG
- Singapore
- Prior art keywords
- die
- hole
- image sensor
- receiving opening
- same
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 239000011241 protective layer Substances 0.000 abstract 1
Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L27/144—Devices controlled by radiation
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- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
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Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/703,663 US20080191333A1 (en) | 2007-02-08 | 2007-02-08 | Image sensor package with die receiving opening and method of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG144891A1 true SG144891A1 (en) | 2008-08-28 |
Family
ID=39597778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200800894-8A SG144891A1 (en) | 2007-02-08 | 2008-01-31 | Image sensor package with die receiving opening and method of the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080191333A1 (zh) |
JP (1) | JP2008244437A (zh) |
KR (1) | KR20080074773A (zh) |
CN (1) | CN101262002A (zh) |
DE (1) | DE102008007237A1 (zh) |
SG (1) | SG144891A1 (zh) |
TW (1) | TW200834938A (zh) |
Families Citing this family (52)
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KR100866619B1 (ko) * | 2007-09-28 | 2008-11-03 | 삼성전기주식회사 | 웨이퍼 레벨의 이미지센서 모듈 및 그 제조방법, 그리고카메라 모듈 |
US7964945B2 (en) * | 2007-09-28 | 2011-06-21 | Samsung Electro-Mechanics Co., Ltd. | Glass cap molding package, manufacturing method thereof and camera module |
TWI480935B (zh) * | 2008-12-24 | 2015-04-11 | Nanchang O Film Optoelectronics Technology Ltd | 將玻璃黏著在影像感測器封裝體中之技術 |
JP5244848B2 (ja) | 2009-05-01 | 2013-07-24 | 日東電工株式会社 | 偏光子の製造方法 |
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US8647963B2 (en) * | 2009-07-08 | 2014-02-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method of wafer level chip molded packaging |
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US9276023B2 (en) | 2011-11-30 | 2016-03-01 | Kyocera Corporation | Image pickup element housing package, and image pickup device |
TWI469332B (zh) * | 2011-12-07 | 2015-01-11 | Pixart Imaging Inc | 晶圓級影像晶片封裝及光機結構 |
CN103151362B (zh) | 2011-12-07 | 2016-03-23 | 原相科技股份有限公司 | 晶圆级图像芯片封装及包含所述封装的光学结构 |
WO2013118501A1 (ja) * | 2012-02-07 | 2013-08-15 | 株式会社ニコン | 撮像ユニットおよび撮像装置 |
EP2873031B1 (en) * | 2012-07-12 | 2018-08-22 | Assa Abloy Ab | Method of manufacturing a functional inlay |
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US9219091B2 (en) | 2013-03-12 | 2015-12-22 | Optiz, Inc. | Low profile sensor module and method of making same |
KR101630009B1 (ko) * | 2013-03-29 | 2016-06-13 | 삼성전기주식회사 | 카메라 모듈 |
US9543354B2 (en) * | 2013-07-30 | 2017-01-10 | Heptagon Micro Optics Pte. Ltd. | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules |
JP2015032653A (ja) * | 2013-08-01 | 2015-02-16 | 株式会社東芝 | 固体撮像装置 |
US9371982B2 (en) * | 2013-08-15 | 2016-06-21 | Maxim Integrated Products, Inc. | Glass based multichip package |
US9231124B2 (en) * | 2013-09-25 | 2016-01-05 | Delphi Technologies, Inc. | Ball grid array packaged camera device soldered to a substrate |
JP2015115522A (ja) * | 2013-12-13 | 2015-06-22 | ソニー株式会社 | 固体撮像装置および製造方法、並びに電子機器 |
CN104078479B (zh) * | 2014-07-21 | 2017-03-15 | 格科微电子(上海)有限公司 | 图像传感器的晶圆级封装方法和图像传感器封装结构 |
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WO2020098214A1 (zh) * | 2018-11-12 | 2020-05-22 | 通富微电子股份有限公司 | 一种半导体芯片封装方法及半导体封装器件 |
WO2020098211A1 (zh) * | 2018-11-12 | 2020-05-22 | 通富微电子股份有限公司 | 一种半导体芯片封装方法及半导体封装器件 |
KR102252490B1 (ko) | 2019-04-08 | 2021-05-17 | 하나 마이크론(주) | 이미지 센서 패키지, 모듈, 및 그 제조 방법 |
CN112310127B (zh) * | 2019-07-26 | 2022-05-10 | 中芯集成电路(宁波)有限公司 | 摄像组件的封装方法 |
CN111415954B (zh) * | 2020-04-26 | 2023-05-23 | 上海微阱电子科技有限公司 | 一种背照式图像传感器芯片的封装结构及方法 |
TWI785663B (zh) * | 2020-07-03 | 2022-12-01 | 張菊華 | 感測模組之結構及其製造方法 |
US11869912B2 (en) | 2020-07-15 | 2024-01-09 | Semiconductor Components Industries, Llc | Method for defining a gap height within an image sensor package |
KR20220018698A (ko) | 2020-08-07 | 2022-02-15 | 삼성전자주식회사 | 언더필이 구비된 이미지 센서 패키지 및 이를 포함하는 이미지 센서 모듈 |
US20220270960A1 (en) * | 2021-02-23 | 2022-08-25 | Texas Instruments Incorporated | Open-Cavity Package for Chip Sensor |
TWI778829B (zh) * | 2021-05-05 | 2022-09-21 | 勝麗國際股份有限公司 | 非迴焊式感測鏡頭 |
CN113725134A (zh) * | 2021-08-27 | 2021-11-30 | 长江存储科技有限责任公司 | 晶粒的定位方法和定位装置 |
US11894473B2 (en) | 2021-09-09 | 2024-02-06 | Chu Hua Chang | Sensing module and manufacturing method thereof |
US20230244043A1 (en) * | 2022-01-31 | 2023-08-03 | Taiwan Semiconductor Manufacturing Co., Ltd | Package with Integrated Optical Die and Method Forming Same |
TWI840150B (zh) * | 2022-10-17 | 2024-04-21 | 同欣電子工業股份有限公司 | 感測器封裝結構及其製造方法 |
CN116425111B (zh) * | 2023-06-13 | 2023-09-08 | 苏州科阳半导体有限公司 | 一种传感器芯片的封装方法和封装结构 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6130448A (en) * | 1998-08-21 | 2000-10-10 | Gentex Corporation | Optical sensor package and method of making same |
US6396116B1 (en) * | 2000-02-25 | 2002-05-28 | Agilent Technologies, Inc. | Integrated circuit packaging for optical sensor devices |
JP3527166B2 (ja) * | 2000-03-15 | 2004-05-17 | シャープ株式会社 | 固体撮像装置及びその製造方法 |
US6512861B2 (en) * | 2001-06-26 | 2003-01-28 | Intel Corporation | Packaging and assembly method for optical coupling |
-
2007
- 2007-02-08 US US11/703,663 patent/US20080191333A1/en not_active Abandoned
- 2007-11-02 TW TW096141559A patent/TW200834938A/zh unknown
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2008
- 2008-01-31 SG SG200800894-8A patent/SG144891A1/en unknown
- 2008-02-01 JP JP2008022421A patent/JP2008244437A/ja not_active Withdrawn
- 2008-02-01 DE DE102008007237A patent/DE102008007237A1/de not_active Withdrawn
- 2008-02-04 CN CNA2008100092008A patent/CN101262002A/zh active Pending
- 2008-02-05 KR KR1020080011556A patent/KR20080074773A/ko not_active Application Discontinuation
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JP2008244437A (ja) | 2008-10-09 |
DE102008007237A1 (de) | 2008-08-14 |
CN101262002A (zh) | 2008-09-10 |
US20080191333A1 (en) | 2008-08-14 |
KR20080074773A (ko) | 2008-08-13 |
TW200834938A (en) | 2008-08-16 |
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