SG143190A1 - Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly - Google Patents

Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Info

Publication number
SG143190A1
SG143190A1 SG200717956-7A SG2007179567A SG143190A1 SG 143190 A1 SG143190 A1 SG 143190A1 SG 2007179567 A SG2007179567 A SG 2007179567A SG 143190 A1 SG143190 A1 SG 143190A1
Authority
SG
Singapore
Prior art keywords
retaining ring
flexible membrane
assembly
applying load
annular
Prior art date
Application number
SG200717956-7A
Other languages
English (en)
Inventor
Steven M Zuniga
Andrew J Nagengast
Jeonghoon Oh
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG143190A1 publication Critical patent/SG143190A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Snaps, Bayonet Connections, Set Pins, And Snap Rings (AREA)
  • Laminated Bodies (AREA)
SG200717956-7A 2006-11-22 2007-11-21 Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly SG143190A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86709006P 2006-11-22 2006-11-22
US89170507P 2007-02-26 2007-02-26
US11/741,691 US7575504B2 (en) 2006-11-22 2007-04-27 Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Publications (1)

Publication Number Publication Date
SG143190A1 true SG143190A1 (en) 2008-06-27

Family

ID=38969432

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200717956-7A SG143190A1 (en) 2006-11-22 2007-11-21 Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly

Country Status (9)

Country Link
US (1) US7575504B2 (zh)
EP (1) EP1925398B1 (zh)
JP (2) JP5314267B2 (zh)
KR (3) KR100940614B1 (zh)
CN (1) CN101293332B (zh)
AT (1) ATE503610T1 (zh)
DE (1) DE602007013517D1 (zh)
SG (1) SG143190A1 (zh)
TW (2) TWI432288B (zh)

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US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US8033895B2 (en) * 2007-07-19 2011-10-11 Applied Materials, Inc. Retaining ring with shaped profile
DE112007003710T5 (de) * 2007-11-20 2010-12-02 Shin-Etsu Handotai Co., Ltd. Polierkopf und Poliervorrichtung
CN103252711B (zh) * 2008-03-25 2016-06-29 应用材料公司 改良的承载头薄膜
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US8475231B2 (en) * 2008-12-12 2013-07-02 Applied Materials, Inc. Carrier head membrane
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
TWI540021B (zh) * 2010-08-06 2016-07-01 應用材料股份有限公司 以扣環調校基板邊緣
CN103733315A (zh) * 2011-08-05 2014-04-16 应用材料公司 两件式塑料保持环
US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
KR102236929B1 (ko) 2012-06-05 2021-04-06 어플라이드 머티어리얼스, 인코포레이티드 인터로크 피쳐들을 갖는 2-파트 리테이닝 링
KR101387923B1 (ko) 2012-08-27 2014-04-22 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드용 멤브레인 및 이를 구비한 캐리어 헤드
US8998676B2 (en) 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
KR101410358B1 (ko) * 2013-02-25 2014-06-20 삼성전자주식회사 화학적 기계적 연마장치용 멤브레인 및 화학적 기계적 연마장치용 연마헤드
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
US9227297B2 (en) 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
KR101515424B1 (ko) * 2013-10-22 2015-04-29 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인
JP6232297B2 (ja) * 2014-01-21 2017-11-15 株式会社荏原製作所 基板保持装置および研磨装置
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
KR101583815B1 (ko) * 2014-12-22 2016-01-11 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
KR102264785B1 (ko) * 2015-02-16 2021-06-14 삼성전자주식회사 연마 헤드 및 이를 갖는 연마 캐리어 장치
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
KR101655075B1 (ko) * 2015-08-21 2016-09-07 주식회사 케이씨텍 화학 기계적 연마 장치
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
KR102420066B1 (ko) 2016-07-25 2022-07-11 어플라이드 머티어리얼스, 인코포레이티드 Cmp를 위한 리테이닝 링
US11397139B2 (en) * 2017-02-27 2022-07-26 Leco Corporation Metallographic grinder and components thereof
CN108687657A (zh) * 2017-04-05 2018-10-23 中芯国际集成电路制造(北京)有限公司 一种化学机械研磨设备
CN209615159U (zh) * 2018-11-28 2019-11-12 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
CN112548848B (zh) * 2019-09-26 2022-09-23 清华大学 一种承载头和化学机械抛光设备
CN111318959B (zh) * 2020-04-16 2024-02-06 清华大学 一种用于化学机械抛光的保持环和承载头
US11724355B2 (en) 2020-09-30 2023-08-15 Applied Materials, Inc. Substrate polish edge uniformity control with secondary fluid dispense
JP2023516869A (ja) 2020-10-13 2023-04-21 アプライド マテリアルズ インコーポレイテッド 接点延長部又は調節可能な止め具を有する基板研磨装置
US11623321B2 (en) 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
WO2022187249A1 (en) * 2021-03-04 2022-09-09 Applied Materials, Inc. Polishing carrier head with floating edge control

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JP5112614B2 (ja) * 2004-12-10 2013-01-09 株式会社荏原製作所 基板保持装置および研磨装置
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Also Published As

Publication number Publication date
TWI448356B (zh) 2014-08-11
JP5314267B2 (ja) 2013-10-16
DE602007013517D1 (de) 2011-05-12
US20080119118A1 (en) 2008-05-22
CN101293332B (zh) 2012-08-08
CN101293332A (zh) 2008-10-29
KR100940614B1 (ko) 2010-02-05
ATE503610T1 (de) 2011-04-15
TW201000257A (en) 2010-01-01
KR20090089279A (ko) 2009-08-21
JP2008137149A (ja) 2008-06-19
TW200833465A (en) 2008-08-16
JP2013116554A (ja) 2013-06-13
TWI432288B (zh) 2014-04-01
KR20080046556A (ko) 2008-05-27
US7575504B2 (en) 2009-08-18
EP1925398A1 (en) 2008-05-28
KR20130083873A (ko) 2013-07-23
JP5568653B2 (ja) 2014-08-06
EP1925398B1 (en) 2011-03-30
KR101358821B1 (ko) 2014-02-10
KR101335554B1 (ko) 2013-12-02

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