SG143126A1 - Method of manufacturing a semiconductor heterostructure - Google Patents
Method of manufacturing a semiconductor heterostructureInfo
- Publication number
- SG143126A1 SG143126A1 SG200716932-9A SG2007169329A SG143126A1 SG 143126 A1 SG143126 A1 SG 143126A1 SG 2007169329 A SG2007169329 A SG 2007169329A SG 143126 A1 SG143126 A1 SG 143126A1
- Authority
- SG
- Singapore
- Prior art keywords
- layer
- manufacturing
- substrate
- wafer
- lattice parameter
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76256—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques using silicon etch back techniques, e.g. BESOI, ELTRAN
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/0245—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06291860.2A EP1928020B1 (en) | 2006-11-30 | 2006-11-30 | Method of manufacturing a semiconductor heterostructure |
Publications (1)
Publication Number | Publication Date |
---|---|
SG143126A1 true SG143126A1 (en) | 2008-06-27 |
Family
ID=37989091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200716932-9A SG143126A1 (en) | 2006-11-30 | 2007-10-16 | Method of manufacturing a semiconductor heterostructure |
Country Status (7)
Country | Link |
---|---|
US (1) | US7459374B2 (ja) |
EP (1) | EP1928020B1 (ja) |
JP (1) | JP5068635B2 (ja) |
KR (1) | KR100934037B1 (ja) |
CN (1) | CN100585801C (ja) |
SG (1) | SG143126A1 (ja) |
TW (1) | TWI358755B (ja) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2773261B1 (fr) | 1997-12-30 | 2000-01-28 | Commissariat Energie Atomique | Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions |
FR2861497B1 (fr) | 2003-10-28 | 2006-02-10 | Soitec Silicon On Insulator | Procede de transfert catastrophique d'une couche fine apres co-implantation |
FR2891281B1 (fr) * | 2005-09-28 | 2007-12-28 | Commissariat Energie Atomique | Procede de fabrication d'un element en couches minces. |
JP4894390B2 (ja) * | 2006-07-25 | 2012-03-14 | 信越半導体株式会社 | 半導体基板の製造方法 |
US7998835B2 (en) * | 2008-01-15 | 2011-08-16 | Globalfoundries Singapore Pte. Ltd. | Strain-direct-on-insulator (SDOI) substrate and method of forming |
EP2157602A1 (en) * | 2008-08-20 | 2010-02-24 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | A method of manufacturing a plurality of fabrication wafers |
FR2947098A1 (fr) | 2009-06-18 | 2010-12-24 | Commissariat Energie Atomique | Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince |
KR101705937B1 (ko) * | 2011-01-25 | 2017-02-10 | 에베 그룹 에. 탈너 게엠베하 | 웨이퍼들의 영구적 결합을 위한 방법 |
FR2972567B1 (fr) * | 2011-03-09 | 2013-03-22 | Soitec Silicon On Insulator | Méthode de formation d'une structure de ge sur iii/v sur isolant |
JP5810718B2 (ja) * | 2011-03-18 | 2015-11-11 | 富士ゼロックス株式会社 | シリコン層転写用基板及び半導体基板の製造方法 |
US8802534B2 (en) * | 2011-06-14 | 2014-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming SOI substrate and apparatus for forming the same |
FR2977069B1 (fr) * | 2011-06-23 | 2014-02-07 | Soitec Silicon On Insulator | Procede de fabrication d'une structure semi-conductrice mettant en oeuvre un collage temporaire |
TWI509659B (zh) * | 2013-08-02 | 2015-11-21 | Nat Univ Tsing Hua | 異質材料之自我對準水平接合製作方法 |
US9721792B2 (en) | 2013-09-16 | 2017-08-01 | Applied Materials, Inc. | Method of forming strain-relaxed buffer layers |
JP6094541B2 (ja) | 2014-07-28 | 2017-03-15 | 信越半導体株式会社 | ゲルマニウムウェーハの研磨方法 |
WO2016081367A1 (en) | 2014-11-18 | 2016-05-26 | Sunedison Semiconductor Limited | HIGH RESISTIVITY SILICON-ON-INSULATOR SUBSTRATE COMPRISING A CHARGE TRAPPING LAYER FORMED BY He-N2 CO-IMPLANTATION |
EP3304586B1 (en) * | 2015-06-01 | 2020-10-07 | GlobalWafers Co., Ltd. | A method of manufacturing silicon germanium-on-insulator |
US9870940B2 (en) | 2015-08-03 | 2018-01-16 | Samsung Electronics Co., Ltd. | Methods of forming nanosheets on lattice mismatched substrates |
CN117198983A (zh) | 2015-11-20 | 2023-12-08 | 环球晶圆股份有限公司 | 使半导体表面平整的制造方法 |
DE102016214573A1 (de) * | 2016-08-05 | 2018-02-08 | Robert Bosch Gmbh | Verfahren zum Herstellen eines Schichtstapels und/oder einer Topologie, Schichtstapel und Verfahren zum Erfassen eines Magnetfelds |
KR101889352B1 (ko) * | 2016-09-13 | 2018-08-20 | 한국과학기술연구원 | 변형된 저마늄을 포함하는 반도체 소자의 제조 방법 및 이에 의해 제조된 반도체 소자 |
FR3064398B1 (fr) * | 2017-03-21 | 2019-06-07 | Soitec | Structure de type semi-conducteur sur isolant, notamment pour un capteur d'image de type face avant, et procede de fabrication d'une telle structure |
WO2019236320A1 (en) | 2018-06-08 | 2019-12-12 | Globalwafers Co., Ltd. | Method for transfer of a thin layer of silicon |
CN108878263B (zh) * | 2018-06-25 | 2022-03-18 | 中国科学院微电子研究所 | 半导体结构与其制作方法 |
US20220102580A1 (en) * | 2019-01-16 | 2022-03-31 | The Regents Of The University Of California | Wafer bonding for embedding active regions with relaxed nanofeatures |
FR3098643B1 (fr) * | 2019-07-09 | 2023-01-13 | Commissariat Energie Atomique | Fabrication d'un dispositif photosensible à semiconducteur |
CN112582257A (zh) * | 2020-11-23 | 2021-03-30 | 中国科学院微电子研究所 | 一种用于半导体量子计算的应变纯化硅衬底及其形成方法 |
CN112530855B (zh) * | 2020-12-04 | 2024-04-12 | 中国科学院上海微系统与信息技术研究所 | 复合异质集成半导体结构、半导体器件及制备方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5442205A (en) | 1991-04-24 | 1995-08-15 | At&T Corp. | Semiconductor heterostructure devices with strained semiconductor layers |
CA2062134C (en) * | 1991-05-31 | 1997-03-25 | Ibm | Heteroepitaxial layers with low defect density and arbitrary network parameter |
WO2002015244A2 (en) * | 2000-08-16 | 2002-02-21 | Massachusetts Institute Of Technology | Process for producing semiconductor article using graded expitaxial growth |
US6890835B1 (en) * | 2000-10-19 | 2005-05-10 | International Business Machines Corporation | Layer transfer of low defect SiGe using an etch-back process |
US6703688B1 (en) * | 2001-03-02 | 2004-03-09 | Amberwave Systems Corporation | Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits |
JP4296726B2 (ja) * | 2001-06-29 | 2009-07-15 | 株式会社Sumco | 半導体基板の製造方法及び電界効果型トランジスタの製造方法 |
JP4296727B2 (ja) * | 2001-07-06 | 2009-07-15 | 株式会社Sumco | 半導体基板と電界効果型トランジスタ並びにSiGe層の形成方法及びこれを用いた歪みSi層の形成方法と電界効果型トランジスタの製造方法 |
WO2003015140A1 (fr) | 2001-08-06 | 2003-02-20 | Sumitomo Mitsubishi Silicon Corporation | Substrat semiconducteur, transistor a effet de champ et procedes de fabrication de ces elements |
US6649492B2 (en) | 2002-02-11 | 2003-11-18 | International Business Machines Corporation | Strained Si based layer made by UHV-CVD, and devices therein |
AU2003222003A1 (en) | 2002-03-14 | 2003-09-29 | Amberwave Systems Corporation | Methods for fabricating strained layers on semiconductor substrates |
WO2004019391A2 (en) * | 2002-08-23 | 2004-03-04 | Amberwave Systems Corporation | Semiconductor heterostructures having reduced dislocation pile-ups and related methods |
EP1439570A1 (en) | 2003-01-14 | 2004-07-21 | Interuniversitair Microelektronica Centrum ( Imec) | SiGe strain relaxed buffer for high mobility devices and a method of fabricating it |
US6963078B2 (en) * | 2003-03-15 | 2005-11-08 | International Business Machines Corporation | Dual strain-state SiGe layers for microelectronics |
TWI263709B (en) | 2004-02-17 | 2006-10-11 | Ind Tech Res Inst | Structure of strain relaxed thin Si/Ge epitaxial layer and fabricating method thereof |
JP2006080278A (ja) * | 2004-09-09 | 2006-03-23 | Toshiba Ceramics Co Ltd | 歪みシリコンウエハおよびその製造方法 |
US7202124B2 (en) * | 2004-10-01 | 2007-04-10 | Massachusetts Institute Of Technology | Strained gettering layers for semiconductor processes |
US20060151787A1 (en) | 2005-01-12 | 2006-07-13 | International Business Machines Corporation | LOW CONCENTRATION SiGe BUFFER DURING STRAINED Si GROWTH OF SSGOI MATERIAL FOR DOPANT DIFFUSION CONTROL AND DEFECT REDUCTION |
-
2006
- 2006-11-30 EP EP06291860.2A patent/EP1928020B1/en active Active
-
2007
- 2007-02-13 US US11/674,392 patent/US7459374B2/en active Active
- 2007-10-16 SG SG200716932-9A patent/SG143126A1/en unknown
- 2007-10-19 TW TW096139361A patent/TWI358755B/zh active
- 2007-11-26 KR KR1020070120820A patent/KR100934037B1/ko active IP Right Grant
- 2007-11-29 CN CN200710196164A patent/CN100585801C/zh active Active
- 2007-11-30 JP JP2007311074A patent/JP5068635B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP5068635B2 (ja) | 2012-11-07 |
KR20080049630A (ko) | 2008-06-04 |
CN101192512A (zh) | 2008-06-04 |
KR100934037B1 (ko) | 2009-12-28 |
TWI358755B (en) | 2012-02-21 |
US20080132031A1 (en) | 2008-06-05 |
EP1928020A1 (en) | 2008-06-04 |
EP1928020B1 (en) | 2020-04-22 |
US7459374B2 (en) | 2008-12-02 |
CN100585801C (zh) | 2010-01-27 |
JP2008141206A (ja) | 2008-06-19 |
TW200830368A (en) | 2008-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG143126A1 (en) | Method of manufacturing a semiconductor heterostructure | |
JP2007080896A5 (ja) | ||
TW200735348A (en) | Semiconductor heterostructure and method for forming a semiconductor heterostructure | |
SG144032A1 (en) | Semiconductor heterostructure | |
FR2890489B1 (fr) | Procede de fabrication d'une heterostructure de type semi-conducteur sur isolant | |
WO2010141351A3 (en) | Wafer bonding technique in nitride semiconductors | |
DE60141843D1 (de) | Verfahren zur bildung einer schicht aus relaxiertem sige-auf-isolator | |
WO2007036858A3 (en) | Iii-v light emitting device | |
WO2004021420A3 (en) | Fabrication method for a monocrystalline semiconductor layer on a substrate | |
JP2008505834A5 (ja) | ||
TW200636999A (en) | Thick semi-insulating or insulating epitaxial gallium nitride layers and devices incorporating same | |
WO2010151857A3 (en) | Method for forming iii-v semiconductor structures including aluminum-silicon nitride passivation | |
TW200721419A (en) | Semiconductor IC-embedded substrate and method for manufacturing same | |
TW200729343A (en) | Method for fabricating controlled stress silicon nitride films | |
WO2008146646A1 (ja) | 半導体装置用ヒートスプレッダとその製造方法 | |
TW200707799A (en) | Bonded intermediate substrate and method of making same | |
TW200636983A (en) | Composite substrates of conductive and insulating or semi-insulating group III-nitrides for group III-nitride devices | |
WO2013003695A3 (en) | Bumpless build-up layer package warpage reduction | |
MY146044A (en) | Prepreg, method for manufacturing prepreg, substrate, and semiconductor device | |
WO2012059862A3 (en) | Light emitting device with improved extraction efficiency | |
IN2015DN03284A (ja) | ||
SG152101A1 (en) | An interconnect structure and a method of fabricating the same | |
TW200631078A (en) | A method of making a semiconductor structure for high power semiconductor devices | |
JP2017529692A5 (ja) | ||
SG11201810733PA (en) | Hybrid structure for surface acoustic wave device |