SG132623A1 - Smart card body, smart card and manufacturing process for same - Google Patents

Smart card body, smart card and manufacturing process for same

Info

Publication number
SG132623A1
SG132623A1 SG200607947-9A SG2006079479A SG132623A1 SG 132623 A1 SG132623 A1 SG 132623A1 SG 2006079479 A SG2006079479 A SG 2006079479A SG 132623 A1 SG132623 A1 SG 132623A1
Authority
SG
Singapore
Prior art keywords
smart card
card body
manufacture
manufacturing process
semiconductor chip
Prior art date
Application number
SG200607947-9A
Other languages
English (en)
Inventor
Sebastien Kalck
Fr
Original Assignee
Tyco Electronics France Sas
Tyco Electronics Pretema Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics France Sas, Tyco Electronics Pretema Gmbh filed Critical Tyco Electronics France Sas
Publication of SG132623A1 publication Critical patent/SG132623A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Orthopedics, Nursing, And Contraception (AREA)
  • Sewage (AREA)
  • Stringed Musical Instruments (AREA)
SG200607947-9A 2005-11-14 2006-11-13 Smart card body, smart card and manufacturing process for same SG132623A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05292410A EP1785916B1 (de) 2005-11-14 2005-11-14 Smartcard-Körper, Smartcard und Herstellungsverfahren

Publications (1)

Publication Number Publication Date
SG132623A1 true SG132623A1 (en) 2007-06-28

Family

ID=35945251

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200607947-9A SG132623A1 (en) 2005-11-14 2006-11-13 Smart card body, smart card and manufacturing process for same

Country Status (11)

Country Link
US (1) US20070108298A1 (zh)
EP (1) EP1785916B1 (zh)
JP (1) JP4958153B2 (zh)
KR (1) KR101245719B1 (zh)
CN (1) CN1971866B (zh)
AT (1) ATE440346T1 (zh)
CA (1) CA2568123C (zh)
DE (1) DE502005007956D1 (zh)
MY (1) MY141371A (zh)
SG (1) SG132623A1 (zh)
TW (1) TWI405129B (zh)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008005320A1 (de) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Kartenförmiger Datenträger
CN101567359B (zh) * 2008-04-25 2011-12-07 原景科技股份有限公司 半导体装置
CN101350073B (zh) * 2008-08-20 2010-06-23 北京握奇数据系统有限公司 双界面智能卡的生产方法、双界面智能卡及其天线层
KR101532541B1 (ko) * 2009-05-22 2015-07-01 에스케이플래닛 주식회사 Ｕｓｉｍ 카드 및 그 제조 방법
CN102254211A (zh) * 2010-05-20 2011-11-23 上海伊诺尔信息技术有限公司 叠层芯片封装的移动通讯用户识别卡模块
KR101017425B1 (ko) * 2010-06-18 2011-02-28 임회진 사출 성형을 이용한 스마트카드 제작 방법
EP2636001A4 (en) * 2010-11-02 2014-09-03 Linxens Holding SIM CARD AND MANUFACTURING METHOD THEREFOR
CN102063631A (zh) * 2010-12-22 2011-05-18 上海浦江智能卡系统有限公司 一种双界面芯片的智能卡制造方法
CN102073898A (zh) * 2010-12-22 2011-05-25 上海浦江智能卡系统有限公司 一种双界面智能卡inlay的制造方法
EP2761539A4 (en) * 2011-09-28 2015-05-27 Gemalto Technologies Asia Ltd METHOD FOR MANUFACTURING A DATA CARRIER COMPRISING A MICROCIRCUIT
EP2587412A1 (fr) * 2011-10-31 2013-05-01 Gemalto SA Carte à puce prédécoupée
CN102376012B (zh) * 2011-11-01 2016-10-26 上海仪电智能电子有限公司 一种双界面智能卡
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
DE202012004102U1 (de) 2012-04-26 2013-07-30 Pretema Gmbh Smartcard-Körper zur Aufnahme eines Halbleiter-Chips
DE102012008176A1 (de) 2012-04-26 2013-10-31 Pretema Gmbh Verfahren zur Herstellung eines Smartcard-Körpers zur Aufnahme eines Halbleiter-Chips sowie ein derartiger Smartcard-Körper
CN104364804B (zh) 2012-04-26 2017-05-17 立信有限公司 用于制造用于容纳半导体芯片的智能卡基体的方法和这样的智能卡基体
EP2738714A1 (fr) * 2012-11-30 2014-06-04 Gemalto SA Procédé de fabrication de dispositif électrique ou électronique à interface d'alimentation ou de communication
CN102983115B (zh) * 2012-12-03 2015-10-28 恒汇电子科技有限公司 一种智能卡封装框架
KR101402072B1 (ko) 2012-12-28 2014-06-27 안봉규 메모리 디스크 케이스의 처리방법
CN203894790U (zh) * 2013-04-11 2014-10-22 德昌电机(深圳)有限公司 智能卡、身份识别卡、银行卡及智能卡触板
US10535046B2 (en) 2016-02-24 2020-01-14 CPI Card Group — Colorado, Inc. System and method for encoding IC chips for payment objects
WO2017194200A2 (de) * 2016-05-11 2017-11-16 Linxens Holding Leiterbahnstruktur, insbesondere für einen lead-frame für eine smartcard-anwendung, mit mindestens zwei übereinander liegenden leiterbahn-ebenen
CN106656234B (zh) * 2016-12-21 2020-06-09 南京秦淮紫云创益企业服务有限公司 Sim卡、卡架、sim卡组合及移动终端
CN106897766A (zh) * 2017-03-31 2017-06-27 金邦达有限公司 带ic芯片的智能卡及智能卡的制造方法
DE102017005057A1 (de) 2017-05-26 2018-11-29 Giesecke+Devrient Mobile Security Gmbh Personalisieren eines Halbleiterelements
WO2019138260A1 (en) * 2018-01-12 2019-07-18 Linxens Holding Method for manufacturing a sim card and sim card
FR3081583B1 (fr) * 2018-05-25 2021-10-01 Linxens Holding Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede
US11568424B2 (en) 2018-10-18 2023-01-31 CPI Card Group—Colorado, Inc. Method and system for product authentication
USD983261S1 (en) 2019-12-20 2023-04-11 Capital One Services, Llc Vented laminated card

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01210394A (ja) * 1988-02-19 1989-08-23 Matsushita Electric Ind Co Ltd 集積回路装置
FR2636453B1 (fr) * 1988-09-14 1992-01-17 Sgs Thomson Microelectronics Procede d'encapsulation de circuits-integres notamment pour cartes a puces
JPH0719859B2 (ja) * 1988-12-12 1995-03-06 松下電器産業株式会社 Ｉｃカード用モジュールの製造方法
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
FR2673041A1 (fr) * 1991-02-19 1992-08-21 Gemplus Card Int Procede de fabrication de micromodules de circuit integre et micromodule correspondant.
FR2736453B1 (fr) * 1995-07-07 1997-08-08 Gemplus Card Int Support portable a microcircuit, notamment carte a puce, et procede de fabrication dudit support
DE19640304C2 (de) 1996-09-30 2000-10-12 Siemens Ag Chipmodul insbesondere zur Implantation in einen Chipkartenkörper
US6914196B2 (en) * 1998-01-09 2005-07-05 Samsung Electronics Co., Ltd. Reel-deployed printed circuit board
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
FR2795907B1 (fr) * 1999-07-01 2007-02-16 Gemplus Card Int Procede pour la fabrication et le test de micromodules electroniques, notamment pour cartes a puce
US6291263B1 (en) * 2000-06-13 2001-09-18 Siliconware Precision Industries Co., Ltd. Method of fabricating an integrated circuit package having a core-hollowed encapsulation body
US6466007B1 (en) * 2000-08-14 2002-10-15 Teradyne, Inc. Test system for smart card and indentification devices and the like
JP4171246B2 (ja) * 2002-06-10 2008-10-22 株式会社ルネサステクノロジ メモリカードおよびその製造方法
TW565916B (en) * 2002-06-20 2003-12-11 Ist Internat Semiconductor Tec Chip module for a smart card and method of making the same
EP1554754A2 (en) 2002-10-15 2005-07-20 Axalto SA Method of manufacturing a data carrier
US7217594B2 (en) * 2003-02-11 2007-05-15 Fairchild Semiconductor Corporation Alternative flip chip in leaded molded package design and method for manufacture
JP2005085089A (ja) * 2003-09-10 2005-03-31 Renesas Technology Corp Ｉｃカードおよびその製造方法
TWI223974B (en) * 2003-11-20 2004-11-11 Advanced Semiconductor Eng Tiny memory card and method for manufacturing the same
TWI239698B (en) * 2004-10-07 2005-09-11 Advanced Flash Memory Card Tec Structure of memory card and producing method thereof

Also Published As

Publication number Publication date
CN1971866B (zh) 2012-02-29
EP1785916A1 (de) 2007-05-16
DE502005007956D1 (de) 2009-10-01
US20070108298A1 (en) 2007-05-17
KR101245719B1 (ko) 2013-03-25
CA2568123C (en) 2014-09-16
KR20070051697A (ko) 2007-05-18
CA2568123A1 (en) 2007-05-14
EP1785916B1 (de) 2009-08-19
TW200802116A (en) 2008-01-01
ATE440346T1 (de) 2009-09-15
JP4958153B2 (ja) 2012-06-20
TWI405129B (zh) 2013-08-11
MY141371A (en) 2010-04-16
CN1971866A (zh) 2007-05-30
JP2007141238A (ja) 2007-06-07

Similar Documents

Publication Publication Date Title
TW200802116A (en) Smart card body, smart card and manufacturing process for same
MY151796A (en) Double interface communication electronic module, in particular for a chip card
MX2009010433A (es) Tarjeta de memoria con interfaz de comunicacion doble.
TW200742249A (en) Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
ES2171274T3 (es) Procedimiento para la fabricacion de un modulo de tarjeta de chip para una tarjeta de chip combinada.
PH12015500827A1 (en) Simplified electronic module for a smart card with a dual communication interface
TW200639980A (en) Lid used in package structure and the package structure of having the same
TW200509331A (en) Semiconductor chip package and method for making the same
DE59805191D1 (de) Chipkartenmodul und diesen umfassende chipkarte
TW200513978A (en) Wireless communication medium
US20150115038A1 (en) Transponder Layer and Method for the Production Thereof
TW200605279A (en) Semiconductor device and manufacturing method thereof
TW200503111A (en) Semiconductor device and method of manufacturing the same
WO2003028044A3 (de) Nicht-leitendes, ein band oder einen nutzen bildendes substrat, auf dem eine vielzahl von trägerelementen ausgebildet ist
MY126242A (en) Electronic assembly with laterally connected capacitors and manufacturing method
EP4242915A3 (en) Smart ic substrate, smart ic module, and ic card including the same
AU2003219905A8 (en) Laminated socket contacts
US7095103B1 (en) Leadframe based memory card
CN207765433U (zh) 一种封装的指纹传感芯片
JP4240990B2 (ja) Ｉｃモジュール回路基板
TW200633096A (en) Method for producing a module including an integrated circuit on a substrate and an integrated module manufactured thereby
DE602006020533D1 (de) Haltemodul für eine SIM-Karte zur Erweiterung und Verbesserung der Funktionen eines mobilen Kommunikationsgerätes
CN104979222A (zh) 一种超薄的mosfet封装结构及封装方法
CN210955154U (zh) 一种微型6焊盘智能卡模块
CN107946200B (zh) 指纹传感芯片的封装方法及封装指纹传感芯片