FR3081583B1 - Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede - Google Patents

Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede Download PDF

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Publication number
FR3081583B1
FR3081583B1 FR1854465A FR1854465A FR3081583B1 FR 3081583 B1 FR3081583 B1 FR 3081583B1 FR 1854465 A FR1854465 A FR 1854465A FR 1854465 A FR1854465 A FR 1854465A FR 3081583 B1 FR3081583 B1 FR 3081583B1
Authority
FR
France
Prior art keywords
electronic chip
chip cards
card
contact areas
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1854465A
Other languages
English (en)
Other versions
FR3081583A1 (fr
Inventor
Sebastien Kalck
Daniel Brenk
Frederic Morgenthaler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Linxens Holding SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Linxens Holding SAS filed Critical Linxens Holding SAS
Priority to FR1854465A priority Critical patent/FR3081583B1/fr
Priority to PCT/FR2019/051207 priority patent/WO2019224500A1/fr
Priority to CN201980034871.6A priority patent/CN112166440A/zh
Priority to DE112019002169.9T priority patent/DE112019002169T5/de
Publication of FR3081583A1 publication Critical patent/FR3081583A1/fr
Application granted granted Critical
Publication of FR3081583B1 publication Critical patent/FR3081583B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

Procédé de fabrication d'une carte à puce électronique, dans lequel - on découpe un matériau métallique en bande pour former des ensembles de zones de contact (1) rattachés, par un moins une patte (27), à au moins une bande support, ces ensembles de zones de contact (1) étant régulièrement agencés, avec un pas déterminé, le long de la bande support, un ensemble de zones de contact (1) correspondant à un connecteur de carte destiné à établir une connexion électrique avec un lecteur de carte, - on fixe une puce électronique (30) sur la face arrière du connecteur, et on connecte cette puce électronique aux zones de contact, et - on injecte une matière plastique électriquement isolante pour recouvrir la puce (30) et les fils conducteurs (31). Carte à puce fabriquée à l'aide de ce procédé.
FR1854465A 2018-05-25 2018-05-25 Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede Active FR3081583B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1854465A FR3081583B1 (fr) 2018-05-25 2018-05-25 Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede
PCT/FR2019/051207 WO2019224500A1 (fr) 2018-05-25 2019-05-24 Procédé de fabrication de cartes a puce électronique et cartes a puce électronique fabriquées par ce procédé
CN201980034871.6A CN112166440A (zh) 2018-05-25 2019-05-24 电子芯片卡的制造方法以及通过该方法获得的电子芯片卡
DE112019002169.9T DE112019002169T5 (de) 2018-05-25 2019-05-24 Verfahren zur Herstellung einer elektronischen Chipkarte und eine mit diesem Verfahren hergestellte Chipkarte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1854465A FR3081583B1 (fr) 2018-05-25 2018-05-25 Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede
FR1854465 2018-05-25

Publications (2)

Publication Number Publication Date
FR3081583A1 FR3081583A1 (fr) 2019-11-29
FR3081583B1 true FR3081583B1 (fr) 2021-10-01

Family

ID=63145041

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1854465A Active FR3081583B1 (fr) 2018-05-25 2018-05-25 Procede de fabrication de cartes a puce electronique et cartes a puce electronique fabriquees par ce procede

Country Status (4)

Country Link
CN (1) CN112166440A (fr)
DE (1) DE112019002169T5 (fr)
FR (1) FR3081583B1 (fr)
WO (1) WO2019224500A1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157475A (en) * 1988-07-08 1992-10-20 Oki Electric Industry Co., Ltd. Semiconductor device having a particular conductive lead structure
US20060255160A1 (en) * 2005-05-13 2006-11-16 Otto Winkler Memory card, the fabrication thereof and a mobile phone apparatus having a memory card
EP1785916B1 (fr) * 2005-11-14 2009-08-19 Tyco Electronics France SAS Corps de carte à puce, carte à puce et procédé de fabrication
DE102011104510A1 (de) * 2011-06-17 2012-12-20 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
KR101767720B1 (ko) * 2012-04-26 2017-08-23 프리테마 게엠베하 반도체 칩을 수용하는 스마트 카드 바디 및 그 제조 방법
DE102014108916B4 (de) * 2014-06-25 2019-12-05 Heraeus Deutschland GmbH & Co. KG Bandförmiges Substrat zur Herstellung von Chipträgern, elektronisches Modul mit einem solchen Chipträger, elektronische Einrichtung mit einem solchen Modul und Verfahren zur Herstellung eines Substrates

Also Published As

Publication number Publication date
WO2019224500A1 (fr) 2019-11-28
DE112019002169T5 (de) 2021-02-11
CN112166440A (zh) 2021-01-01
FR3081583A1 (fr) 2019-11-29

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