SG131039A1 - Condenser microphone and packaging method for the same - Google Patents

Condenser microphone and packaging method for the same

Info

Publication number
SG131039A1
SG131039A1 SG200606072-7A SG2006060727A SG131039A1 SG 131039 A1 SG131039 A1 SG 131039A1 SG 2006060727 A SG2006060727 A SG 2006060727A SG 131039 A1 SG131039 A1 SG 131039A1
Authority
SG
Singapore
Prior art keywords
board
metal case
case
condenser microphone
adhesive
Prior art date
Application number
SG200606072-7A
Other languages
English (en)
Inventor
Chung-Dam Song
Original Assignee
Bse Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020050085839A external-priority patent/KR100675023B1/ko
Priority claimed from KR1020050085986A external-priority patent/KR100650280B1/ko
Priority claimed from KR1020050085987A external-priority patent/KR100740462B1/ko
Application filed by Bse Co Ltd filed Critical Bse Co Ltd
Publication of SG131039A1 publication Critical patent/SG131039A1/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)
SG200606072-7A 2005-09-14 2006-09-04 Condenser microphone and packaging method for the same SG131039A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020050085839A KR100675023B1 (ko) 2005-09-14 2005-09-14 콘덴서 마이크로폰 및 이를 위한 패키징 방법
KR1020050085986A KR100650280B1 (ko) 2005-09-15 2005-09-15 기판에 음향홀이 형성된 실리콘 콘덴서 마이크로폰
KR1020050085987A KR100740462B1 (ko) 2005-09-15 2005-09-15 지향성 실리콘 콘덴서 마이크로폰

Publications (1)

Publication Number Publication Date
SG131039A1 true SG131039A1 (en) 2007-04-26

Family

ID=37533290

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200606072-7A SG131039A1 (en) 2005-09-14 2006-09-04 Condenser microphone and packaging method for the same

Country Status (6)

Country Link
US (1) US8126166B2 (es)
EP (1) EP1765035B1 (es)
JP (1) JP2007082233A (es)
ES (1) ES2523662T3 (es)
SG (1) SG131039A1 (es)
TW (1) TW200723925A (es)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100544283B1 (ko) * 2004-01-20 2006-01-24 주식회사 비에스이 표면실장을 위한 평행육면체형 콘덴서 마이크로폰
US7885423B2 (en) * 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US8351632B2 (en) * 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
JP4642634B2 (ja) * 2005-10-31 2011-03-02 パナソニック株式会社 音響センサの製造方法
JP4951067B2 (ja) * 2006-07-25 2012-06-13 アナログ デバイシス， インコーポレイテッド 複数のマイクロホンシステム
TW200847827A (en) * 2006-11-30 2008-12-01 Analog Devices Inc Microphone system with silicon microphone secured to package lid
KR100904285B1 (ko) * 2007-06-04 2009-06-25 주식회사 비에스이 콘덴서 마이크로폰
KR100884260B1 (ko) 2007-10-09 2009-02-17 한국과학기술원 마이크로 전자기계 시스템 소자의 패키징 방법 및 그패키지
JP5024671B2 (ja) * 2007-12-11 2012-09-12 ソニーモバイルコミュニケーションズ株式会社 コンデンサマイクロホン及び電子機器
US8073179B2 (en) * 2008-06-12 2011-12-06 Fortemedia, Inc. MEMS microphone package with RF insensitive MEMS microphone chip
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
WO2011001195A1 (en) 2009-06-29 2011-01-06 Nokia Corporation Temperature compensated microphone
US9399574B2 (en) 2009-08-13 2016-07-26 Knowles Electronics Llc MEMS package and a method for manufacturing the same
US8987030B2 (en) * 2009-08-13 2015-03-24 Knowles Electronics, Llc MEMS package and a method for manufacturing the same
KR101011486B1 (ko) * 2010-05-24 2011-01-31 주식회사 필코씨에스티 하이브리드 음/전 변환장치
US9258634B2 (en) 2010-07-30 2016-02-09 Invensense, Inc. Microphone system with offset apertures
US8340735B2 (en) * 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
EP2416544B1 (en) * 2010-08-06 2015-04-29 BlackBerry Limited Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device
CN102726065B (zh) * 2010-12-30 2014-06-04 歌尔声学股份有限公司 Mems麦克风及其封装方法
WO2013074270A1 (en) 2011-11-17 2013-05-23 Analog Devices, Inc. Microphone module with sound pipe
JP5861497B2 (ja) * 2012-02-29 2016-02-16 オムロン株式会社 センサ装置
US9695040B2 (en) 2012-10-16 2017-07-04 Invensense, Inc. Microphone system with integrated passive device die
US8816492B1 (en) * 2013-03-13 2014-08-26 Qualtre, Inc. Method and apparatus for isolating MEMS devices from external stimuli
KR101480615B1 (ko) * 2013-05-29 2015-01-08 현대자동차주식회사 지향성 마이크로폰 장치 및 그의 동작방법
US9212052B2 (en) * 2013-08-07 2015-12-15 Invensense, Inc. Packaged microphone with multiple mounting orientations
US9338546B2 (en) * 2013-12-16 2016-05-10 Infineon Technologies Ag Circuit assembly for processing an input signal, microphone assembly and method for following an input signal
EP3229492B1 (en) * 2014-12-25 2020-09-23 Huawei Technologies Co., Ltd. Microphone
US20170236547A1 (en) * 2015-03-04 2017-08-17 Sowhat Studio Di Michele Baggio Portable recorder
US9668055B2 (en) * 2015-03-04 2017-05-30 Sowhat Studio Di Michele Baggio Portable recorder
KR101703628B1 (ko) * 2015-09-25 2017-02-07 현대자동차 주식회사 마이크로폰 및 그 제조방법
WO2018022773A1 (en) * 2016-07-27 2018-02-01 Knowles Electronics, Llc Microelectromechanical system (mems) device packaging
KR101807062B1 (ko) * 2016-11-08 2018-01-18 현대자동차 주식회사 마이크로폰 및 이의 제조방법
DK3373597T3 (da) * 2017-03-07 2019-10-28 G R A S Sound & Vibration As Mikrofon til montering på en overflade med lav profil
US20180366424A1 (en) 2017-06-20 2018-12-20 Infineon Technologies Ag Device Package with Reduced Radio Frequency Losses
JP7162567B2 (ja) * 2019-05-23 2022-10-28 ホシデン株式会社 基板、マイクユニット
US10645497B1 (en) * 2019-05-28 2020-05-05 Bose Corporation Surface treatments for silicone acoustic diaphragms

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
EP1623601A1 (en) * 2003-04-28 2006-02-08 Knowles Electronics, LLC Method and apparatus for substantially improving power supply rejection performance in a miniature microphone assembly
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
KR100675025B1 (ko) * 2005-08-20 2007-01-29 주식회사 비에스이 실리콘 콘덴서 마이크로폰
KR100644730B1 (ko) * 2005-08-20 2006-11-10 주식회사 비에스이 실리콘 콘덴서 마이크로폰
SG130158A1 (en) * 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same

Also Published As

Publication number Publication date
US20070057602A1 (en) 2007-03-15
EP1765035A3 (en) 2009-11-11
ES2523662T3 (es) 2014-11-28
EP1765035A2 (en) 2007-03-21
TW200723925A (en) 2007-06-16
EP1765035B1 (en) 2014-08-13
US8126166B2 (en) 2012-02-28
JP2007082233A (ja) 2007-03-29

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