WO2007010510A3 - Method and device for wire bonding with low mechanical stress - Google Patents

Method and device for wire bonding with low mechanical stress Download PDF

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Publication number
WO2007010510A3
WO2007010510A3 PCT/IB2006/052981 IB2006052981W WO2007010510A3 WO 2007010510 A3 WO2007010510 A3 WO 2007010510A3 IB 2006052981 W IB2006052981 W IB 2006052981W WO 2007010510 A3 WO2007010510 A3 WO 2007010510A3
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WO
WIPO (PCT)
Prior art keywords
wire bonding
frame
site
mechanical stress
wire
Prior art date
Application number
PCT/IB2006/052981
Other languages
French (fr)
Other versions
WO2007010510A2 (en
Inventor
Michael Mayer
Original Assignee
Michael Mayer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Michael Mayer filed Critical Michael Mayer
Publication of WO2007010510A2 publication Critical patent/WO2007010510A2/en
Publication of WO2007010510A3 publication Critical patent/WO2007010510A3/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
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    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
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    • H01L2224/85214—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Abstract

A novel wire bonding system for bonding a wire to electronic components is described, which comprises a frame (1), a bond head (7) being connected to the frame and being movable by means of positioning elements (3, 4), and a bond site cleaning device (10, 11) mounted to the frame and adapted to emit an energy beam (12) towards a surface of the electronic component for cleaning from contaminants. The bond site cleaning device (10, 11) is mounted such that the energy beam (12) is directed in an angle towards the site of the electronic component to be immediately bonded to the wire, whereby the beam spot on the site is lying underneath the bonding head (7).
PCT/IB2006/052981 2006-04-03 2006-08-28 Method and device for wire bonding with low mechanical stress WO2007010510A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IBPCT/IB2006/000772 2006-04-03
IB2006000772 2006-04-03

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WO2007010510A3 true WO2007010510A3 (en) 2007-06-07

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007057429A1 (en) * 2007-11-29 2009-06-04 Linde Ag Device and method for wire bonding
TW201816909A (en) * 2016-10-27 2018-05-01 矽品精密工業股份有限公司 Mounting apparatus and mounting method
CN107626689B (en) * 2017-09-26 2024-04-12 中国工程物理研究院激光聚变研究中心 Ultrasonic-assisted laser surface cleaning system and cleaning method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178338A (en) * 1981-04-27 1982-11-02 Mitsubishi Electric Corp Wire bonding method
JPS6435923A (en) * 1987-07-30 1989-02-07 Dainippon Printing Co Ltd Connection of semiconductor device
US5614113A (en) * 1995-05-05 1997-03-25 Texas Instruments Incorporated Method and apparatus for performing microelectronic bonding using a laser
JPH10199913A (en) * 1997-01-10 1998-07-31 Sanken Electric Co Ltd Wire-bonding method
JP2000286287A (en) * 1999-03-31 2000-10-13 Nec Corp Wire bonder, and wire bonding method
JP2001068499A (en) * 1999-08-26 2001-03-16 Nec Corp Device and method for wire bonding
JP2003133356A (en) * 2001-10-23 2003-05-09 Matsushita Electric Ind Co Ltd Method and device for bump bonding
WO2003068445A1 (en) * 2002-02-11 2003-08-21 Infineon Technologies Ag Arrangement for wire bonding and method for producing a bonding connection

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178338A (en) * 1981-04-27 1982-11-02 Mitsubishi Electric Corp Wire bonding method
JPS6435923A (en) * 1987-07-30 1989-02-07 Dainippon Printing Co Ltd Connection of semiconductor device
US5614113A (en) * 1995-05-05 1997-03-25 Texas Instruments Incorporated Method and apparatus for performing microelectronic bonding using a laser
JPH10199913A (en) * 1997-01-10 1998-07-31 Sanken Electric Co Ltd Wire-bonding method
JP2000286287A (en) * 1999-03-31 2000-10-13 Nec Corp Wire bonder, and wire bonding method
JP2001068499A (en) * 1999-08-26 2001-03-16 Nec Corp Device and method for wire bonding
JP2003133356A (en) * 2001-10-23 2003-05-09 Matsushita Electric Ind Co Ltd Method and device for bump bonding
WO2003068445A1 (en) * 2002-02-11 2003-08-21 Infineon Technologies Ag Arrangement for wire bonding and method for producing a bonding connection

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