SG129394A1 - Film separation method and film separation apparatus - Google Patents

Film separation method and film separation apparatus

Info

Publication number
SG129394A1
SG129394A1 SG200604750A SG200604750A SG129394A1 SG 129394 A1 SG129394 A1 SG 129394A1 SG 200604750 A SG200604750 A SG 200604750A SG 200604750 A SG200604750 A SG 200604750A SG 129394 A1 SG129394 A1 SG 129394A1
Authority
SG
Singapore
Prior art keywords
film
wafer
release tape
film separation
application surface
Prior art date
Application number
SG200604750A
Other languages
English (en)
Inventor
Minoru Ametani
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of SG129394A1 publication Critical patent/SG129394A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
SG200604750A 2005-07-29 2006-07-13 Film separation method and film separation apparatus SG129394A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005220750A JP2007036111A (ja) 2005-07-29 2005-07-29 フィルム剥離方法およびフィルム剥離装置

Publications (1)

Publication Number Publication Date
SG129394A1 true SG129394A1 (en) 2007-02-26

Family

ID=36930665

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200604750A SG129394A1 (en) 2005-07-29 2006-07-13 Film separation method and film separation apparatus

Country Status (6)

Country Link
US (1) US7740728B2 (ko)
EP (1) EP1748468A3 (ko)
JP (1) JP2007036111A (ko)
KR (1) KR100855101B1 (ko)
SG (1) SG129394A1 (ko)
TW (1) TWI351058B (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200539357A (en) * 2004-04-28 2005-12-01 Lintec Corp Adhering apparatus and adhering method
JP5147425B2 (ja) * 2007-08-14 2013-02-20 株式会社東京精密 ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法
JP2009239194A (ja) * 2008-03-28 2009-10-15 Sanyo Electric Co Ltd 半導体ウエハの処理方法
JP5238390B2 (ja) * 2008-07-24 2013-07-17 リンテック株式会社 シート剥離装置および剥離方法
JP5113658B2 (ja) * 2008-07-24 2013-01-09 リンテック株式会社 シート剥離装置および剥離方法
JP5486230B2 (ja) * 2008-07-24 2014-05-07 リンテック株式会社 シート剥離装置及び剥離方法
JP5368226B2 (ja) * 2009-09-16 2013-12-18 リンテック株式会社 シート剥離装置及び剥離方法
TWI412096B (zh) * 2009-12-15 2013-10-11 Hiwin Tech Corp 晶圓防護裝置及其操作流程
JP5501062B2 (ja) * 2010-03-29 2014-05-21 リンテック株式会社 シート貼付装置および貼付方法
JP5534923B2 (ja) * 2010-04-27 2014-07-02 リンテック株式会社 シート剥離装置及び剥離方法
JP5520129B2 (ja) * 2010-04-27 2014-06-11 リンテック株式会社 シート剥離装置
KR101239263B1 (ko) * 2011-02-11 2013-03-06 고려대학교 산학협력단 플렉서블 소자의 제조방법
JP5918927B2 (ja) * 2011-03-14 2016-05-18 リンテック株式会社 シート剥離装置および剥離方法
JP5918928B2 (ja) * 2011-03-14 2016-05-18 リンテック株式会社 シート剥離装置および剥離方法
JP5598865B2 (ja) * 2011-12-16 2014-10-01 古河電気工業株式会社 ウエハ加工用テープ
JP5687647B2 (ja) * 2012-03-14 2015-03-18 株式会社東芝 半導体装置の製造方法、半導体製造装置
US9944055B2 (en) 2015-06-26 2018-04-17 Sunpower Corporation Thermo-compression bonding tool with high temperature elastic element
JP6563469B2 (ja) * 2017-12-15 2019-08-21 本田技研工業株式会社 電極接合方法及び電極接合装置
JP7020980B2 (ja) * 2018-03-30 2022-02-16 本田技研工業株式会社 膜電極接合体の製造方法及び製造装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6312416A (ja) * 1986-06-20 1988-01-19 株式会社村田製作所 チツプ状電子部品連の製造方法
JPS6451911A (en) * 1987-08-21 1989-02-28 Nitto Denko Corp Sticking device for mounting frame for semiconductor wafer
JP4322328B2 (ja) * 1997-06-05 2009-08-26 テキサス インスツルメンツ インコーポレイテツド ウエハをウエハテープに接着する方法および装置
JP4204653B2 (ja) * 1997-06-20 2009-01-07 リンテック株式会社 シート剥離装置および方法
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
KR20010097792A (ko) 2000-04-26 2001-11-08 안용국 핫멜트형 박리테이프 및 그 핫멜트형 박리테이프를 이용한백그라인딩 테이프 박리방법
JP4502547B2 (ja) * 2000-08-07 2010-07-14 日東電工株式会社 半導体ウエハの保護テープ除去方法およびその装置
US6773461B2 (en) * 2001-01-29 2004-08-10 Zimmer Technology, Inc. Constrained prosthetic knee with rotating bearing
JP2002367931A (ja) * 2001-06-07 2002-12-20 Lintec Corp ダイボンディングシート貼着装置およびダイボンディングシートの貼着方法
JP4418610B2 (ja) 2001-07-27 2010-02-17 パナソニック株式会社 半導体装置の製造方法および半導体装置の製造装置
JP3957506B2 (ja) * 2001-12-26 2007-08-15 Ｎｅｃエレクトロニクス株式会社 基板表面保護シート貼り付け装置および貼り付け方法
JP4060641B2 (ja) * 2002-05-22 2008-03-12 株式会社ディスコ テープ剥離方法
JP2004071687A (ja) 2002-08-02 2004-03-04 Nec Kansai Ltd 半導体基板の表面保護用の粘着テープの剥離方法及び剥離テープ
JP4267283B2 (ja) * 2002-09-30 2009-05-27 リンテック株式会社 保護テープの剥離装置および保護テープの剥離方法
JP2004128147A (ja) 2002-10-01 2004-04-22 Nitto Denko Corp 半導体ウエハからの保護テープ除去方法およびその装置
JP2004165570A (ja) 2002-11-15 2004-06-10 Nitto Denko Corp 半導体ウエハからの保護テープ除去方法およびその装置
JP4417028B2 (ja) * 2003-05-22 2010-02-17 株式会社タカトリ ダイシングフレームへのダイシングテープの貼り付け装置
JP2004363165A (ja) * 2003-06-02 2004-12-24 Tokyo Seimitsu Co Ltd ウェーハ処理装置およびウェーハ処理方法

Also Published As

Publication number Publication date
KR100855101B1 (ko) 2008-08-29
EP1748468A2 (en) 2007-01-31
JP2007036111A (ja) 2007-02-08
US7740728B2 (en) 2010-06-22
US20070026641A1 (en) 2007-02-01
KR20070015091A (ko) 2007-02-01
TWI351058B (en) 2011-10-21
TW200717634A (en) 2007-05-01
EP1748468A3 (en) 2008-06-11

Similar Documents

Publication Publication Date Title
SG129394A1 (en) Film separation method and film separation apparatus
TWI268572B (en) Film peeling method and film peeling device
TW200618130A (en) Sheet peeling device and method
SG137801A1 (en) Surface protection film peeling method and surface protection film peeling device
TW200606098A (en) Method and apparatus for peeling a film
AU2002214397A1 (en) A method for separating a film and a substrate
TW200644106A (en) Support board separating apparatus, and support board separating method using the same
MY138782A (en) Method and apparatus for attaching a peeling tape
TW200618097A (en) Protective tape separation method, and apparatus using the same
WO2008053299A3 (en) Methods and apparatus for peeling a flexible sheet from a substrate
MX2007004350A (es) Vehiculos y metodos para laminacion de pelicula.
TW200628580A (en) Multi-layer pressure sensitive adhesive for optical assembly
SG138537A1 (en) Peeling tape adhering method and peeling tape adhering device
TW200738547A (en) Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
SG135135A1 (en) Surface protective film peeling method and surface protective film peeling apparatus
WO2007058963A3 (en) Apparatus and method for automated tape closure
WO2007074153A3 (fr) Procede de relaxation d'une couche mince contrainte
WO2008114753A1 (ja) 基板載置台，基板処理装置，基板載置台の表面加工方法
BRPI0719958A2 (pt) Dispositivo para a remodelagem de ossos
MY157358A (en) Cover tape and method for manufacture
EP3263319A3 (en) Method and apparatus for applying a touch film to a compound curved surface and appliance comprising a touch film
EP1900787A3 (en) Multiple or single stage cure adhesive material and method of use
WO2006050292A3 (en) Processing apparatus
EP1719604A3 (de) Verfahren zur Beschichtung von Werkstücken
PL2121362T3 (pl) Sposób łączenia przez sklejenie oszklenia na jego wsporniku i środki do realizacji tego sposobu