SG121103A1 - Polishing composition and process for producing wiring structure using it - Google Patents

Polishing composition and process for producing wiring structure using it

Info

Publication number
SG121103A1
SG121103A1 SG200505680A SG200505680A SG121103A1 SG 121103 A1 SG121103 A1 SG 121103A1 SG 200505680 A SG200505680 A SG 200505680A SG 200505680 A SG200505680 A SG 200505680A SG 121103 A1 SG121103 A1 SG 121103A1
Authority
SG
Singapore
Prior art keywords
wiring structure
polishing composition
producing wiring
producing
polishing
Prior art date
Application number
SG200505680A
Other languages
English (en)
Inventor
Tatsuhiko Hirano
Junhui Oh
Akifumi Sakao
Atsunori Kawamura
Katsunobu Hori
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG121103A1 publication Critical patent/SG121103A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG200505680A 2004-09-17 2005-09-08 Polishing composition and process for producing wiring structure using it SG121103A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004272059A JP2006086462A (ja) 2004-09-17 2004-09-17 研磨用組成物およびそれを用いた配線構造体の製造法

Publications (1)

Publication Number Publication Date
SG121103A1 true SG121103A1 (en) 2006-04-26

Family

ID=35207615

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200505680A SG121103A1 (en) 2004-09-17 2005-09-08 Polishing composition and process for producing wiring structure using it

Country Status (7)

Country Link
US (1) US20060060974A1 (de)
EP (1) EP1640424A1 (de)
JP (1) JP2006086462A (de)
KR (1) KR101199275B1 (de)
CN (1) CN1754935A (de)
SG (1) SG121103A1 (de)
TW (1) TWI425082B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4316406B2 (ja) * 2004-03-22 2009-08-19 株式会社フジミインコーポレーテッド 研磨用組成物
WO2007116770A1 (ja) * 2006-04-03 2007-10-18 Jsr Corporation 化学機械研磨用水系分散体および化学機械研磨方法、ならびに化学機械研磨用水系分散体を調製するためのキット
SG139699A1 (en) * 2006-08-02 2008-02-29 Fujimi Inc Polishing composition and polishing process
JP2009164188A (ja) * 2007-12-28 2009-07-23 Fujimi Inc 研磨用組成物
JP2009164186A (ja) * 2007-12-28 2009-07-23 Fujimi Inc 研磨用組成物
CN102101980B (zh) * 2009-12-18 2015-12-02 安集微电子（上海）有限公司 一种化学机械抛光液
CN103620747B (zh) 2011-06-14 2017-07-28 福吉米株式会社 研磨用组合物
JP2014041978A (ja) * 2012-08-23 2014-03-06 Fujimi Inc 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法
JP5897200B2 (ja) * 2013-02-13 2016-03-30 株式会社フジミインコーポレーテッド 研磨用組成物、研磨用組成物製造方法および研磨物製造方法
CN104293205A (zh) * 2013-07-16 2015-01-21 鸿富锦精密工业（深圳）有限公司 水性金刚石抛光液及其制备方法
CN103525314B (zh) * 2013-10-30 2014-12-10 湖北三翔超硬材料有限公司 高效金刚石润滑冷却抛光液及制备方法和应用
CN104649986A (zh) * 2013-11-26 2015-05-27 修建东 一种苯骈三氮唑的水溶性次乙基衍生化合物及其制备方法
CN115703944A (zh) * 2021-08-09 2023-02-17 河北工业大学 一种复合抑制剂在cmp中的应用

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5428721A (en) * 1990-02-07 1995-06-27 Kabushiki Kaisha Toshiba Data processing apparatus for editing image by using image conversion
US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
JP3397501B2 (ja) * 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
AU4367396A (en) * 1994-12-05 1996-06-26 Permethyl Specialties L.L.C. Water soluble, biodegradable polymeric materials for skin care, hair care and cosmetic applications
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
US6126853A (en) * 1996-12-09 2000-10-03 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
US5954997A (en) * 1996-12-09 1999-09-21 Cabot Corporation Chemical mechanical polishing slurry useful for copper substrates
US5759917A (en) * 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
US6432828B2 (en) * 1998-03-18 2002-08-13 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper substrates
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
US6227949B1 (en) * 1999-06-03 2001-05-08 Promos Technologies, Inc. Two-slurry CMP polishing with different particle size abrasives
EP1218464B1 (de) * 1999-08-13 2008-08-20 Cabot Microelectronics Corporation Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung
TW501197B (en) 1999-08-17 2002-09-01 Hitachi Chemical Co Ltd Polishing compound for chemical mechanical polishing and method for polishing substrate
TWI265567B (en) * 1999-08-26 2006-11-01 Hitachi Chemical Co Ltd Polishing medium for chemical-mechanical polishing, and polishing method
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
JP3490038B2 (ja) 1999-12-28 2004-01-26 Ｎｅｃエレクトロニクス株式会社 金属配線形成方法
JP3563017B2 (ja) * 2000-07-19 2004-09-08 ロデール・ニッタ株式会社 研磨組成物、研磨組成物の製造方法及びポリシング方法
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP4637398B2 (ja) * 2001-04-18 2011-02-23 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2002359244A (ja) * 2001-05-31 2002-12-13 Sony Corp 半導体装置の製造方法
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
JP4954398B2 (ja) * 2001-08-09 2012-06-13 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
US20030219982A1 (en) * 2002-05-23 2003-11-27 Hitachi Chemical Co., Ltd CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
TWI282360B (en) * 2002-06-03 2007-06-11 Hitachi Chemical Co Ltd Polishing composition and polishing method thereof
TW200401358A (en) * 2002-06-07 2004-01-16 Showa Denko Kk Metal polish composition, polishing method using the composition and method for producing wafer using the polishing method
JP2004031443A (ja) * 2002-06-21 2004-01-29 Hitachi Chem Co Ltd 研磨液及び研磨方法
JP4206233B2 (ja) * 2002-07-22 2009-01-07 旭硝子株式会社 研磨剤および研磨方法
JP4083502B2 (ja) * 2002-08-19 2008-04-30 株式会社フジミインコーポレーテッド 研磨方法及びそれに用いられる研磨用組成物
JP2004107423A (ja) * 2002-09-17 2004-04-08 Sumitomo Bakelite Co Ltd 研磨用組成物
JP4593064B2 (ja) * 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP3981616B2 (ja) * 2002-10-02 2007-09-26 株式会社フジミインコーポレーテッド 研磨用組成物
US7553345B2 (en) * 2002-12-26 2009-06-30 Kao Corporation Polishing composition
JP2004331852A (ja) * 2003-05-09 2004-11-25 Tama Kagaku Kogyo Kk 分散安定性に優れた研磨剤スラリー及び基板の製造方法
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
JP4130614B2 (ja) * 2003-06-18 2008-08-06 株式会社東芝 半導体装置の製造方法
US7485162B2 (en) * 2003-09-30 2009-02-03 Fujimi Incorporated Polishing composition
WO2005031836A1 (ja) * 2003-09-30 2005-04-07 Fujimi Incorporated 研磨用組成物及び研磨方法
US20050090104A1 (en) * 2003-10-27 2005-04-28 Kai Yang Slurry compositions for chemical mechanical polishing of copper and barrier films
TW200521217A (en) 2003-11-14 2005-07-01 Showa Denko Kk Polishing composition and polishing method
JP2005244123A (ja) 2004-02-27 2005-09-08 Fujimi Inc 研磨用組成物
JP2005294798A (ja) * 2004-03-08 2005-10-20 Asahi Glass Co Ltd 研磨剤および研磨方法
JP2005268664A (ja) 2004-03-19 2005-09-29 Fujimi Inc 研磨用組成物
JP4316406B2 (ja) * 2004-03-22 2009-08-19 株式会社フジミインコーポレーテッド 研磨用組成物
JP4644434B2 (ja) * 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド 研磨用組成物

Also Published As

Publication number Publication date
US20060060974A1 (en) 2006-03-23
JP2006086462A (ja) 2006-03-30
TWI425082B (zh) 2014-02-01
KR101199275B1 (ko) 2012-11-09
TW200621957A (en) 2006-07-01
KR20060051139A (ko) 2006-05-19
EP1640424A1 (de) 2006-03-29
CN1754935A (zh) 2006-04-05

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