SG120205A1 - Controlled cooling of sputter targets - Google Patents

Controlled cooling of sputter targets

Info

Publication number
SG120205A1
SG120205A1 SG200406308A SG200406308A SG120205A1 SG 120205 A1 SG120205 A1 SG 120205A1 SG 200406308 A SG200406308 A SG 200406308A SG 200406308 A SG200406308 A SG 200406308A SG 120205 A1 SG120205 A1 SG 120205A1
Authority
SG
Singapore
Prior art keywords
controlled cooling
sputter targets
sputter
targets
cooling
Prior art date
Application number
SG200406308A
Other languages
English (en)
Inventor
Yuanda R Cheng
Roger Kennedy Steve
Gene Racine Michael
Anand S Deodutt
Original Assignee
Heraeus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Inc filed Critical Heraeus Inc
Publication of SG120205A1 publication Critical patent/SG120205A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
SG200406308A 2004-04-23 2004-10-28 Controlled cooling of sputter targets SG120205A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/829,952 US20050236270A1 (en) 2004-04-23 2004-04-23 Controlled cooling of sputter targets

Publications (1)

Publication Number Publication Date
SG120205A1 true SG120205A1 (en) 2006-03-28

Family

ID=34930924

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200406308A SG120205A1 (en) 2004-04-23 2004-10-28 Controlled cooling of sputter targets

Country Status (8)

Country Link
US (1) US20050236270A1 (ja)
EP (1) EP1589129B1 (ja)
JP (1) JP2005307351A (ja)
CN (1) CN1690246A (ja)
DE (1) DE602004004756T2 (ja)
HK (1) HK1076842A1 (ja)
SG (1) SG120205A1 (ja)
TW (1) TWI296655B (ja)

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US20060226003A1 (en) * 2003-01-22 2006-10-12 John Mize Apparatus and methods for ionized deposition of a film or thin layer
US9659758B2 (en) 2005-03-22 2017-05-23 Honeywell International Inc. Coils utilized in vapor deposition applications and methods of production
US20070045108A1 (en) * 2005-08-26 2007-03-01 Demaray Richard E Monolithic sputter target backing plate with integrated cooling passages
US20080173541A1 (en) * 2007-01-22 2008-07-24 Eal Lee Target designs and related methods for reduced eddy currents, increased resistance and resistivity, and enhanced cooling
EP2267179B1 (en) * 2009-06-25 2012-12-26 Solmates B.V. Target cooling device
US9512516B1 (en) 2009-09-24 2016-12-06 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Cooling water jet pack for high power rotary cathodes
DE102010015149A1 (de) * 2010-04-16 2011-10-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zum Beschichten eines Substrates innerhalb einer Vakuumkammer mittels plasmaunterstützter chemischer Dampfabscheidung
JP5727740B2 (ja) * 2010-09-24 2015-06-03 株式会社高純度化学研究所 バッキングプレートの製造方法
CN103814151B (zh) 2011-06-27 2016-01-20 梭莱有限公司 Pvd靶材及其铸造方法
US9620339B2 (en) * 2013-03-15 2017-04-11 Applied Materials, Inc. Sputter source for semiconductor process chambers
KR102052074B1 (ko) 2013-04-04 2019-12-05 삼성디스플레이 주식회사 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법
US9779920B2 (en) * 2013-08-14 2017-10-03 Applied Materials, Inc. Sputtering target with backside cooling grooves
CN108926783A (zh) * 2017-05-26 2018-12-04 南京中硼联康医疗科技有限公司 中子捕获治疗系统及用于粒子线产生装置的靶材
US11183373B2 (en) 2017-10-11 2021-11-23 Honeywell International Inc. Multi-patterned sputter traps and methods of making
CN109440070A (zh) * 2018-11-19 2019-03-08 东部超导科技（苏州）有限公司 基于ibad纳米涂层设备的溅射靶冷却装置
KR20200069884A (ko) 2018-12-07 2020-06-17 에스케이하이닉스 주식회사 스퍼터링 타겟 및 그 제조 방법

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WO2000022185A1 (en) * 1998-10-14 2000-04-20 Praxair S.T. Technology, Inc. Sputter target/backing plate assembly and method of making same
US6340415B1 (en) * 1998-01-05 2002-01-22 Applied Materials, Inc. Method and apparatus for enhancing a sputtering target's lifetime

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Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
US6340415B1 (en) * 1998-01-05 2002-01-22 Applied Materials, Inc. Method and apparatus for enhancing a sputtering target's lifetime
WO2000015863A1 (en) * 1998-09-11 2000-03-23 Tosoh Smd, Inc. Low temperature sputter target bonding method and target assemblies produced thereby
WO2000022185A1 (en) * 1998-10-14 2000-04-20 Praxair S.T. Technology, Inc. Sputter target/backing plate assembly and method of making same

Also Published As

Publication number Publication date
DE602004004756T2 (de) 2007-10-31
HK1076842A1 (en) 2006-01-27
TW200535266A (en) 2005-11-01
DE602004004756D1 (de) 2007-03-29
JP2005307351A (ja) 2005-11-04
TWI296655B (en) 2008-05-11
EP1589129B1 (en) 2007-02-14
US20050236270A1 (en) 2005-10-27
CN1690246A (zh) 2005-11-02
EP1589129A1 (en) 2005-10-26

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