SG116418A1 - Semiconductor wafer grinding method. - Google Patents
Semiconductor wafer grinding method.Info
- Publication number
- SG116418A1 SG116418A1 SG200103861A SG200103861A SG116418A1 SG 116418 A1 SG116418 A1 SG 116418A1 SG 200103861 A SG200103861 A SG 200103861A SG 200103861 A SG200103861 A SG 200103861A SG 116418 A1 SG116418 A1 SG 116418A1
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor wafer
- grinding method
- wafer grinding
- semiconductor
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000202661A JP2002025961A (ja) | 2000-07-04 | 2000-07-04 | 半導体ウエーハの研削方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG116418A1 true SG116418A1 (en) | 2005-11-28 |
Family
ID=18700155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200103861A SG116418A1 (en) | 2000-07-04 | 2001-06-25 | Semiconductor wafer grinding method. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6527627B2 (de) |
EP (1) | EP1170088B1 (de) |
JP (1) | JP2002025961A (de) |
KR (1) | KR100709457B1 (de) |
DE (1) | DE60103701T2 (de) |
SG (1) | SG116418A1 (de) |
TW (1) | TW490359B (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010035163A (ko) * | 2001-01-09 | 2001-05-07 | 이민기 | 세계 헤드헌터 네트워크를 이용한 국제 고급인력 수급인터넷망 |
US6826986B2 (en) * | 2001-05-05 | 2004-12-07 | Ah Beng Lim | Bi-directional singulation system and method |
JP2002359211A (ja) * | 2001-05-30 | 2002-12-13 | Disco Abrasive Syst Ltd | 切削機 |
KR20040031071A (ko) * | 2001-09-28 | 2004-04-09 | 신에쯔 한도타이 가부시키가이샤 | 연마용 워크지지반, 워크의 연마장치 및 연마방법 |
US7018268B2 (en) | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
JP2004319697A (ja) * | 2003-04-15 | 2004-11-11 | Disco Abrasive Syst Ltd | 板状物に形成された電極の加工装置 |
JP4464113B2 (ja) * | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
US6910956B1 (en) | 2003-12-22 | 2005-06-28 | Powerchip Semiconductor Corp. | Wafer grinding apparatus |
US7011567B2 (en) * | 2004-02-05 | 2006-03-14 | Robert Gerber | Semiconductor wafer grinder |
US7163441B2 (en) * | 2004-02-05 | 2007-01-16 | Robert Gerber | Semiconductor wafer grinder |
JP4427396B2 (ja) * | 2004-06-30 | 2010-03-03 | 株式会社ディスコ | 加工装置 |
TWI251924B (en) * | 2004-12-29 | 2006-03-21 | Siliconware Precision Industries Co Ltd | A process applied to semiconductor |
US7713846B2 (en) * | 2004-12-29 | 2010-05-11 | Siliconware Precision Industries Co., Ltd. | Process applied to semiconductor |
JP2007243112A (ja) * | 2006-03-13 | 2007-09-20 | Disco Abrasive Syst Ltd | ウェーハの凹状加工方法及び凹凸吸収パッド |
JP4806282B2 (ja) * | 2006-03-29 | 2011-11-02 | 株式会社ディスコ | ウエーハの処理装置 |
JP4937674B2 (ja) * | 2006-08-16 | 2012-05-23 | 株式会社ディスコ | ウエーハのエッチング方法 |
KR101109078B1 (ko) * | 2009-11-17 | 2012-03-13 | (주)엘이티 | 기판 지지 유닛 및 이를 포함하는 기판 검사 장치, 그리고 이를 이용한 기판 검사 방법 |
US9508570B2 (en) * | 2013-10-21 | 2016-11-29 | Asm Technology Singapore Pte Ltd | Singulation apparatus and method |
WO2016151121A2 (de) * | 2015-03-26 | 2016-09-29 | Mauser-Werke Oberndorf Maschinenbau Gmbh | Bearbeitungseinheit |
KR20160125585A (ko) * | 2015-04-21 | 2016-11-01 | 삼성전자주식회사 | 기판 처리 장치 및 기판 처리 방법 |
JP2018114573A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社ディスコ | 研削装置 |
CN108000267A (zh) * | 2017-12-26 | 2018-05-08 | 北京中电科电子装备有限公司 | 减薄机 |
JP7171140B2 (ja) * | 2018-12-11 | 2022-11-15 | 株式会社ディスコ | 被加工物の加工方法および樹脂シートユニット |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19641534A1 (de) * | 1996-10-09 | 1998-04-23 | Genauigkeits & Maschinenbau Nu | Schleifautomat |
EP0897778A1 (de) * | 1997-08-15 | 1999-02-24 | Disco Corporation | Verfahren und Vorrichtung zum Bearbeiten von Werkstücken, wobei eine Bearbeitungsflüssigkeit zwischen Werkstück und Werkzeug gespült wird |
WO2000041854A1 (en) * | 1999-01-11 | 2000-07-20 | Strasbaugh, Inc. | Improved handling of wet thin wafers |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3377096A (en) | 1967-06-02 | 1968-04-09 | Wood S Powr Grip Co Inc | Vacuum gripping pad |
EP0272531B1 (de) * | 1986-12-08 | 1991-07-31 | Sumitomo Electric Industries Limited | Flächenschleifmaschine |
JP3050910B2 (ja) * | 1990-11-30 | 2000-06-12 | 東芝セラミックス株式会社 | 薄板状部材の保持装置 |
JPH06302572A (ja) * | 1993-04-12 | 1994-10-28 | Hitachi Ltd | 半導体装置の製造方法及びテープ貼付剥離装置 |
DE4335980C2 (de) * | 1993-10-21 | 1998-09-10 | Wacker Siltronic Halbleitermat | Verfahren zum Positionieren einer Werkstückhalterung |
US5632667A (en) * | 1995-06-29 | 1997-05-27 | Delco Electronics Corporation | No coat backside wafer grinding process |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
US5816895A (en) * | 1997-01-17 | 1998-10-06 | Tokyo Seimitsu Co., Ltd. | Surface grinding method and apparatus |
JPH1123450A (ja) * | 1997-07-09 | 1999-01-29 | Mitsubishi Heavy Ind Ltd | ガス濃度検知方法及び装置 |
US5827111A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
US6383890B2 (en) | 1997-12-26 | 2002-05-07 | Canon Kabushiki Kaisha | Wafer bonding method, apparatus and vacuum chuck |
JP2000015570A (ja) * | 1998-07-02 | 2000-01-18 | Disco Abrasive Syst Ltd | 研削装置 |
JP4009367B2 (ja) * | 1998-08-04 | 2007-11-14 | 株式会社ディスコ | スピン洗浄・乾燥方法 |
JP2000158334A (ja) * | 1998-11-30 | 2000-06-13 | Disco Abrasive Syst Ltd | 作業用トレー及び研削方法 |
US6227950B1 (en) * | 1999-03-08 | 2001-05-08 | Speedfam-Ipec Corporation | Dual purpose handoff station for workpiece polishing machine |
-
2000
- 2000-07-04 JP JP2000202661A patent/JP2002025961A/ja active Pending
-
2001
- 2001-06-25 SG SG200103861A patent/SG116418A1/en unknown
- 2001-06-27 TW TW090115651A patent/TW490359B/zh not_active IP Right Cessation
- 2001-06-29 US US09/894,127 patent/US6527627B2/en not_active Expired - Lifetime
- 2001-07-03 DE DE60103701T patent/DE60103701T2/de not_active Expired - Lifetime
- 2001-07-03 EP EP20010115657 patent/EP1170088B1/de not_active Expired - Lifetime
- 2001-07-03 KR KR1020010039514A patent/KR100709457B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19641534A1 (de) * | 1996-10-09 | 1998-04-23 | Genauigkeits & Maschinenbau Nu | Schleifautomat |
EP0897778A1 (de) * | 1997-08-15 | 1999-02-24 | Disco Corporation | Verfahren und Vorrichtung zum Bearbeiten von Werkstücken, wobei eine Bearbeitungsflüssigkeit zwischen Werkstück und Werkzeug gespült wird |
WO2000041854A1 (en) * | 1999-01-11 | 2000-07-20 | Strasbaugh, Inc. | Improved handling of wet thin wafers |
Also Published As
Publication number | Publication date |
---|---|
EP1170088A3 (de) | 2002-01-30 |
EP1170088A2 (de) | 2002-01-09 |
US6527627B2 (en) | 2003-03-04 |
US20020004359A1 (en) | 2002-01-10 |
KR20020017943A (ko) | 2002-03-07 |
DE60103701T2 (de) | 2005-06-16 |
DE60103701D1 (de) | 2004-07-15 |
EP1170088B1 (de) | 2004-06-09 |
TW490359B (en) | 2002-06-11 |
JP2002025961A (ja) | 2002-01-25 |
KR100709457B1 (ko) | 2007-04-18 |
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