SG115813A1 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method

Info

Publication number
SG115813A1
SG115813A1 SG200501887A SG200501887A SG115813A1 SG 115813 A1 SG115813 A1 SG 115813A1 SG 200501887 A SG200501887 A SG 200501887A SG 200501887 A SG200501887 A SG 200501887A SG 115813 A1 SG115813 A1 SG 115813A1
Authority
SG
Singapore
Prior art keywords
device manufacturing
lithographic apparatus
lithographic
manufacturing
Prior art date
Application number
SG200501887A
Other languages
English (en)
Inventor
Der Feltz Gustaaf Willem Van
Cheng-Qun Gui
Johan Christiaan Ge Hoefnagels
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG115813A1 publication Critical patent/SG115813A1/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG200501887A 2004-03-29 2005-03-28 Lithographic apparatus and device manufacturing method SG115813A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/811,070 US7561251B2 (en) 2004-03-29 2004-03-29 Lithographic apparatus and device manufacturing method

Publications (1)

Publication Number Publication Date
SG115813A1 true SG115813A1 (en) 2005-10-28

Family

ID=34887663

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200501887A SG115813A1 (en) 2004-03-29 2005-03-28 Lithographic apparatus and device manufacturing method

Country Status (8)

Country Link
US (2) US7561251B2 (de)
EP (1) EP1582928B1 (de)
JP (1) JP4459850B2 (de)
KR (2) KR20060044936A (de)
CN (1) CN1677246B (de)
DE (1) DE602005004949T2 (de)
SG (1) SG115813A1 (de)
TW (1) TWI282490B (de)

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US7391503B2 (en) * 2005-10-04 2008-06-24 Asml Netherlands B.V. System and method for compensating for thermal expansion of lithography apparatus or substrate
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CN110361938B (zh) * 2018-03-26 2021-03-02 上海微电子装备(集团)股份有限公司 一种曝光方法及半导体器件的制造方法
US10996572B2 (en) * 2019-02-15 2021-05-04 Applied Materials, Inc. Model based dynamic positional correction for digital lithography tools
WO2020207632A1 (en) 2019-04-10 2020-10-15 Asml Netherlands B.V. A method and system for determining overlay

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Also Published As

Publication number Publication date
US20100014059A1 (en) 2010-01-21
DE602005004949T2 (de) 2009-03-12
US8502954B2 (en) 2013-08-06
EP1582928B1 (de) 2008-02-27
JP4459850B2 (ja) 2010-04-28
US20050213067A1 (en) 2005-09-29
KR20060044936A (ko) 2006-05-16
TWI282490B (en) 2007-06-11
US7561251B2 (en) 2009-07-14
TW200602813A (en) 2006-01-16
JP2005286333A (ja) 2005-10-13
CN1677246A (zh) 2005-10-05
DE602005004949D1 (de) 2008-04-10
CN1677246B (zh) 2011-09-28
KR20070058418A (ko) 2007-06-08
EP1582928A1 (de) 2005-10-05

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