SG11202105735WA - Mounting device - Google Patents

Mounting device

Info

Publication number
SG11202105735WA
SG11202105735WA SG11202105735WA SG11202105735WA SG11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA SG 11202105735W A SG11202105735W A SG 11202105735WA
Authority
SG
Singapore
Prior art keywords
mounting device
mounting
Prior art date
Application number
SG11202105735WA
Other languages
English (en)
Inventor
Tomonori Nakamura
Koji Matsushita
Hiroshi Omata
Masahito Tsuji
Keiichi Hiruma
Mitsuteru Sakamoto
Ryo Urahashi
Takaya KINJO
Shota Nakano
Akira Sekikawa
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202105735WA publication Critical patent/SG11202105735WA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG11202105735WA 2018-12-10 2019-12-09 Mounting device SG11202105735WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018231104 2018-12-10
PCT/JP2019/048163 WO2020122033A1 (ja) 2018-12-10 2019-12-09 実装装置

Publications (1)

Publication Number Publication Date
SG11202105735WA true SG11202105735WA (en) 2021-06-29

Family

ID=71076460

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202105735WA SG11202105735WA (en) 2018-12-10 2019-12-09 Mounting device

Country Status (7)

Country Link
US (1) US11910534B2 (ja)
JP (1) JP7023020B2 (ja)
KR (1) KR102454557B1 (ja)
CN (1) CN113167570B (ja)
SG (1) SG11202105735WA (ja)
TW (1) TWI731492B (ja)
WO (1) WO2020122033A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7157112B2 (ja) * 2020-10-07 2022-10-19 Ckd株式会社 半田印刷検査装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0548256A (ja) * 1991-08-13 1993-02-26 Matsushita Electric Ind Co Ltd プリント配線板の表面実装方法
JPH05187838A (ja) * 1992-01-16 1993-07-27 Hitachi Ltd はんだペースト塗布状態モニタ装置
JPH082085A (ja) * 1994-06-20 1996-01-09 Fujitsu Ltd ペーストの塗布方法
JP2000039599A (ja) * 1998-07-23 2000-02-08 Hitachi Ltd 液晶表示基板の検査方法及び装置並びに液晶表示基板
JP3832622B2 (ja) 2001-03-15 2006-10-11 シャープ株式会社 ダイボンド方法およびダイボンド装置
JP3858633B2 (ja) * 2001-06-25 2006-12-20 松下電器産業株式会社 ボンディング状態の検査方法
JP4450223B2 (ja) * 2005-09-14 2010-04-14 オムロン株式会社 基板検査方法
JP4746948B2 (ja) * 2005-09-21 2011-08-10 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP2015025656A (ja) * 2011-09-29 2015-02-05 株式会社日立ハイテクノロジーズ 基板に形成された形状を計測するための装置
JP5874508B2 (ja) * 2012-04-17 2016-03-02 オムロン株式会社 はんだの濡れ上がり状態の検査方法およびこの方法を用いた自動外観検査装置ならびに基板検査システム
JP5945699B2 (ja) * 2012-12-25 2016-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
JP6118353B2 (ja) * 2013-02-03 2017-04-19 名古屋電機工業株式会社 部品実装基板検査方法及びその検査方法を採用する基板製造システム
JP6450923B2 (ja) * 2013-12-20 2019-01-16 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置
JP2016070810A (ja) * 2014-09-30 2016-05-09 三友工業株式会社 接着剤検査装置、接着剤検査装置を備えた接着剤塗布装置及び接着剤検査方法。
JP6436141B2 (ja) 2016-09-20 2018-12-12 オムロン株式会社 Ｘ線検査装置およびその制御方法
JP6822864B2 (ja) * 2017-01-31 2021-01-27 アルファーデザイン株式会社 情報処理装置、情報処理方法、プログラム、

Also Published As

Publication number Publication date
WO2020122033A1 (ja) 2020-06-18
KR102454557B1 (ko) 2022-10-14
TWI731492B (zh) 2021-06-21
US20220046838A1 (en) 2022-02-10
JPWO2020122033A1 (ja) 2021-09-02
KR20210044854A (ko) 2021-04-23
US11910534B2 (en) 2024-02-20
JP7023020B2 (ja) 2022-02-21
CN113167570A (zh) 2021-07-23
TW202037883A (zh) 2020-10-16
CN113167570B (zh) 2023-01-24

Similar Documents

Publication Publication Date Title
GB201803700D0 (en) Device
CA186074S (en) Device mount
IL276214A (en) Device placement system
GB201805903D0 (en) Device
SG11202110089XA (en) Attachment device
SG10201910955QA (en) Positioning device
SI3536459T1 (sl) Montažna naprava
SG11202005070UA (en) Mounting device
SG11202105735WA (en) Mounting device
SG11202111369UA (en) Mounting device
GB2577473B (en) An attachment device
PL3792416T3 (pl) Przyrząd mocujący
GB201818208D0 (en) Themoelectric device
GB201817970D0 (en) Device
GB201817950D0 (en) Tatto device
PL3506444T3 (pl) Urządzenie do montażu na powierzchni
GB201802846D0 (en) Overboarding device
GB201710759D0 (en) Surface mounting device
ZA202104072B (en) Securing device
EP3647685C0 (de) Vorrichtung
GB201809317D0 (en) Attachment device
GB201903215D0 (en) Self-pierce device
GB201819069D0 (en) Device
AU201816595S (en) Vaping Device
GB201815254D0 (en) Securing device