SG11202103909WA - Flux, method for applying flux, and method for mounting solder ball - Google Patents

Flux, method for applying flux, and method for mounting solder ball

Info

Publication number
SG11202103909WA
SG11202103909WA SG11202103909WA SG11202103909WA SG11202103909WA SG 11202103909W A SG11202103909W A SG 11202103909WA SG 11202103909W A SG11202103909W A SG 11202103909WA SG 11202103909W A SG11202103909W A SG 11202103909WA SG 11202103909W A SG11202103909W A SG 11202103909WA
Authority
SG
Singapore
Prior art keywords
flux
solder ball
mounting solder
applying
applying flux
Prior art date
Application number
SG11202103909WA
Other languages
English (en)
Inventor
Takahiro Nishizaki
Naoaki FUKUYAMA
Hiroyoshi Kawasaki
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of SG11202103909WA publication Critical patent/SG11202103909WA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3617—B-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG11202103909WA 2018-11-06 2019-11-05 Flux, method for applying flux, and method for mounting solder ball SG11202103909WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018208657A JP6627949B1 (ja) 2018-11-06 2018-11-06 フラックス、フラックスの塗布方法及びはんだボールの搭載方法
PCT/JP2019/043279 WO2020095892A1 (ja) 2018-11-06 2019-11-05 フラックス、フラックスの塗布方法及びはんだボールの搭載方法

Publications (1)

Publication Number Publication Date
SG11202103909WA true SG11202103909WA (en) 2021-05-28

Family

ID=69101106

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202103909WA SG11202103909WA (en) 2018-11-06 2019-11-05 Flux, method for applying flux, and method for mounting solder ball

Country Status (8)

Country Link
US (1) US20220009041A1 (zh)
EP (1) EP3878596A4 (zh)
JP (1) JP6627949B1 (zh)
KR (1) KR20210082180A (zh)
CN (1) CN112912205B (zh)
SG (1) SG11202103909WA (zh)
TW (1) TWI739197B (zh)
WO (1) WO2020095892A1 (zh)

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3675307A (en) * 1969-08-08 1972-07-11 Frys Metals Ltd Soldering fluxes
JPS5588914A (en) * 1978-12-27 1980-07-05 Nippon Steel Corp Controlling method for rolling mill
JPH02147194A (ja) * 1988-11-30 1990-06-06 Fujitsu Ltd はんだペースト
US5176749A (en) * 1991-06-20 1993-01-05 Argus International Preflux coating composition for copper
JPH1070153A (ja) * 1996-08-26 1998-03-10 Hitachi Ltd 電子部品の接続方法
JP2001168509A (ja) * 1999-12-06 2001-06-22 Seiko Epson Corp フラックス塗布方法および装置
JP2001300358A (ja) * 2000-04-28 2001-10-30 Nihon Dennetsu Keiki Co Ltd フラックス塗布装置
JP3998536B2 (ja) * 2002-08-22 2007-10-31 松下電器産業株式会社 接合材料およびその製造方法、接合材料の供給方法ならびに電子回路基板
US6796482B2 (en) * 2002-10-31 2004-09-28 Freescale Semiconductor, Inc. Phase separated system for fluxing
JP4005077B2 (ja) * 2004-11-22 2007-11-07 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法及び粘性液体の塗膜方法
JP2008529790A (ja) * 2005-02-17 2008-08-07 ノードソン コーポレイション 粘性材料を噴射するシステム、弁、及び方法
CN100336626C (zh) * 2005-08-12 2007-09-12 北京工业大学 无铅焊膏用松香型无卤素助焊剂
US7767032B2 (en) * 2006-06-30 2010-08-03 W.C. Heraeus Holding GmbH No-clean low-residue solder paste for semiconductor device applications
CN101073862A (zh) * 2007-06-08 2007-11-21 北京工业大学 无铅焊膏用低松香型无卤素免清洗助焊剂
JP4935743B2 (ja) * 2008-04-08 2012-05-23 株式会社日立プラントテクノロジー フラックス形成装置
US9579738B2 (en) * 2011-02-25 2017-02-28 International Business Machines Corporation Flux composition and techniques for use thereof
EP2682220A1 (en) * 2011-03-02 2014-01-08 Senju Metal Industry Co., Ltd Flux
JP5974608B2 (ja) * 2011-04-26 2016-08-23 荒川化学工業株式会社 ディップはんだ付用フラックス
CN102303199B (zh) * 2011-08-12 2012-08-01 广州化学试剂厂 含有环己胺柠檬酸盐的助焊剂
CN102513732B (zh) * 2011-12-15 2014-06-25 中南大学 一种松香型无卤素免清洗助焊剂及其制备和应用
CN102513739A (zh) * 2011-12-30 2012-06-27 深圳市晨日科技有限公司 一种高温无铅无卤锡膏及其制备方法
JP6096035B2 (ja) * 2013-03-29 2017-03-15 株式会社タムラ製作所 はんだ付け用フラックス組成物およびそれを用いた電子基板の製造方法
JP6569905B2 (ja) * 2014-11-21 2019-09-04 荒川化学工業株式会社 スクリーン印刷用フラックス
JP2016144812A (ja) * 2015-02-06 2016-08-12 富士通株式会社 フラックス及び電子装置の製造方法
JP6332525B1 (ja) * 2017-05-25 2018-05-30 千住金属工業株式会社 ソルダペースト
CN108465984B (zh) * 2018-06-28 2020-09-04 广东剑鑫科技股份有限公司 一种无卤水溶性助焊剂及其制备方法

Also Published As

Publication number Publication date
WO2020095892A1 (ja) 2020-05-14
JP2020075259A (ja) 2020-05-21
EP3878596A1 (en) 2021-09-15
TWI739197B (zh) 2021-09-11
EP3878596A4 (en) 2022-10-19
JP6627949B1 (ja) 2020-01-08
KR20210082180A (ko) 2021-07-02
TW202028352A (zh) 2020-08-01
CN112912205B (zh) 2022-04-01
US20220009041A1 (en) 2022-01-13
CN112912205A (zh) 2021-06-04

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