SG11202006009XA - Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux - Google Patents

Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux

Info

Publication number
SG11202006009XA
SG11202006009XA SG11202006009XA SG11202006009XA SG11202006009XA SG 11202006009X A SG11202006009X A SG 11202006009XA SG 11202006009X A SG11202006009X A SG 11202006009XA SG 11202006009X A SG11202006009X A SG 11202006009XA SG 11202006009X A SG11202006009X A SG 11202006009XA
Authority
SG
Singapore
Prior art keywords
flux
solder
resin
soldering
resin composition
Prior art date
Application number
SG11202006009XA
Inventor
Motohiro ONITSUKA
Yoko Kurasawa
Hiroyoshi Kawasaki
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of SG11202006009XA publication Critical patent/SG11202006009XA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615N-compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616Halogen compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618Carboxylic acids or salts
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/02Halogenated hydrocarbons
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092Polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • C08K5/3492Triazines
    • C08K5/34924Triazines containing cyanurate groups; Tautomers thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04Rosin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Epoxy Resins (AREA)
SG11202006009XA 2018-01-17 2019-01-15 Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux SG11202006009XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018005918A JP6501003B1 (en) 2018-01-17 2018-01-17 Resin composition for soldering, core solder, flux coat solder and liquid flux
PCT/JP2019/000970 WO2019142795A1 (en) 2018-01-17 2019-01-15 Soldering resin composition, resin flux cored solder, flux coat solder, and liquid flux

Publications (1)

Publication Number Publication Date
SG11202006009XA true SG11202006009XA (en) 2020-08-28

Family

ID=66166646

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202006009XA SG11202006009XA (en) 2018-01-17 2019-01-15 Resin composition for soldering, resin flux cored solder, flux coated solder, and liquid flux

Country Status (9)

Country Link
US (1) US11292089B2 (en)
JP (1) JP6501003B1 (en)
CN (1) CN111587162B (en)
DE (1) DE112019000443T5 (en)
MY (1) MY182969A (en)
PH (1) PH12020551092A1 (en)
SG (1) SG11202006009XA (en)
TW (1) TWI714949B (en)
WO (1) WO2019142795A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7262343B2 (en) * 2019-08-27 2023-04-21 株式会社タムラ製作所 Flux and molded solder
JP6967050B2 (en) * 2019-09-27 2021-11-17 株式会社タムラ製作所 Flux composition for soldering
JP6795774B1 (en) * 2019-12-25 2020-12-02 千住金属工業株式会社 Flux, soldering and soldering method
JP7407781B2 (en) * 2020-12-11 2024-01-04 千住金属工業株式会社 Flux for flux cored solder, flux cored solder and soldering method
CN116600930B (en) * 2020-12-11 2024-04-12 千住金属工业株式会社 Flux for clad solder, and soldering method
MX2023006665A (en) * 2020-12-11 2023-07-25 Senju Metal Industry Co Flux for resin-cored solder, resin-cored solder, and soldering method.
JP6971444B1 (en) * 2021-02-26 2021-11-24 千住金属工業株式会社 flux
JP7252504B1 (en) * 2022-08-26 2023-04-05 千住金属工業株式会社 Manufacturing method of flux and electronic parts

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157681A (en) 1962-06-28 1964-11-17 Gen Mills Inc Polymeric fat acids
CA1159436A (en) * 1980-11-10 1983-12-27 Harold Shaub Lubricant composition with improved friction reducing properties
US4617134A (en) 1980-11-10 1986-10-14 Exxon Research And Engineering Company Method and lubricant composition for providing improved friction reduction
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
JP2747784B2 (en) * 1994-03-23 1998-05-06 三洋化成工業株式会社 Printing ink binder
US6414055B1 (en) 2000-04-25 2002-07-02 Hercules Incorporated Method for preparing aqueous size composition
JP2004300399A (en) * 2003-03-28 2004-10-28 Hitachi Kasei Polymer Co Ltd Rosin-modified phenol resin
US7109263B2 (en) * 2003-05-02 2006-09-19 National Starch And Chemical Investment Holding Corporation Labeling adhesive
KR101297611B1 (en) * 2004-04-16 2013-08-19 피. 케이 메탈 인코포레이티드 Soldering process
US7861915B2 (en) 2004-04-16 2011-01-04 Ms2 Technologies, Llc Soldering process
CN1972779A (en) * 2004-05-28 2007-05-30 P·凯金属公司 Solder paste and process
CA2576250A1 (en) * 2004-08-06 2006-03-30 Arizona Chemical Company Antifoam compositions containing fatty and rosin acids or derivatives thereof
US8404057B2 (en) 2004-08-31 2013-03-26 Senju Metal Industry Co., Ltd. Soldering flux
JP2005179377A (en) 2005-03-10 2005-07-07 Kokyu Alcohol Kogyo Co Ltd Cosmetic
EP1999238A4 (en) * 2006-03-01 2010-12-15 Arizona Chem Release agents containing saponified fatty and rosin acids or derivatives thereof
DE102007007212A1 (en) 2007-02-14 2008-08-21 Stannol Gmbh Soft solder, useful e.g. in electronics and electrical sectors, comprises solder material mass coated with non-corrosive flux material, preferably based on carrier resin and plasticizer
JP5736671B2 (en) * 2009-06-19 2015-06-17 日産自動車株式会社 Polyurea electrolyte and method for producing the same
DE102009033406A1 (en) 2009-07-15 2011-01-20 Jl Goslar Gmbh & Co. Kg Tubular solder production involves preparing solder material and flux melting agent, where hollow rod is produced by filling solder material in core filament made of flux melting agent
JP6120139B2 (en) * 2012-01-24 2017-04-26 荒川化学工業株式会社 Lead-free solder flux, lead-free solder paste and lead-free thread solder
JP5667101B2 (en) 2012-02-20 2015-02-12 株式会社タムラ製作所 Solder composition, method for producing the same, and printed wiring board
JP6130180B2 (en) 2013-03-25 2017-05-17 株式会社タムラ製作所 Rosin ester-containing soldering flux composition and solder paste composition
JP6401912B2 (en) * 2014-01-31 2018-10-10 株式会社タムラ製作所 Solder composition and method for producing printed wiring board using the same
JP5962832B1 (en) * 2015-09-18 2016-08-03 千住金属工業株式会社 flux
JP6310894B2 (en) 2015-09-30 2018-04-11 株式会社タムラ製作所 Solder composition and method for producing electronic substrate
JP6700734B2 (en) 2015-11-17 2020-05-27 カナヱ塗料株式会社 Rough skin prevention photocurable composition
JP2017113776A (en) 2015-12-24 2017-06-29 荒川化学工業株式会社 Flux for resin flux-cored solder, and resin flux-cored solder
CN106928453B (en) * 2015-12-30 2019-08-09 江西省宜春远大化工有限公司 A kind of polyamide curing agent and its synthetic method
CN105855749B (en) * 2016-04-27 2017-02-22 深圳市晨日科技股份有限公司 Washing chip solid crystal solder paste and preparing method thereof
JP6536503B2 (en) * 2016-07-12 2019-07-03 千住金属工業株式会社 flux
JP6460198B1 (en) 2017-10-11 2019-01-30 千住金属工業株式会社 Flux and solder paste
JP6338007B1 (en) * 2017-11-02 2018-06-06 千住金属工業株式会社 Flux and solder paste
JP6540789B1 (en) 2017-12-29 2019-07-10 千住金属工業株式会社 Resin composition and flux for soldering
JP6399242B1 (en) * 2018-01-17 2018-10-03 千住金属工業株式会社 Flux and solder paste

Also Published As

Publication number Publication date
DE112019000443T5 (en) 2020-10-01
CN111587162A (en) 2020-08-25
WO2019142795A1 (en) 2019-07-25
TWI714949B (en) 2021-01-01
JP2019123811A (en) 2019-07-25
PH12020551092A1 (en) 2021-09-06
CN111587162B (en) 2022-03-04
JP6501003B1 (en) 2019-04-17
US20200391329A1 (en) 2020-12-17
MY182969A (en) 2021-02-05
TW201940598A (en) 2019-10-16
US11292089B2 (en) 2022-04-05

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