JP6338007B1 - Flux and solder paste - Google Patents

Abstract

Provided are a flux in which an activator component is hardly volatile, and a solder paste using the flux. The flux includes dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine, or two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine. [Selection figure] None

Description

  The present invention relates to a flux used for soldering and a solder paste using the flux.

  In general, the flux used for soldering chemically removes metal oxides present on the metal surface of the solder and the object to be soldered, and enables movement of metal elements at the boundary between the two. Has the effect of For this reason, by performing soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be joined, and a strong joint can be obtained.

  The solder paste is a composite material obtained by mixing a solder alloy powder and a flux. Soldering using solder paste is performed by printing the solder paste on the soldering part such as the electrodes of the board, mounting the parts on the soldering part printed with the solder paste, and then using a heating furnace called a reflow furnace to mount the board. Soldering is performed by melting the solder by heating.

  The flux is composed of a solid component and a solvent that dissolves the solid component, and the solvent component in the flux is volatilized by heating during soldering.

  When the solvent component in the flux volatilizes due to heating during soldering, gaseous flux fume is generated, and this flux fume adheres to places where the temperature is lower than that during heating, such as the walls in the reflow furnace and the cooling zone. To liquefy.

  As described above, when the component in which the flux is volatilized adheres to the reflow furnace and becomes liquefied, there is a possibility of dripping onto the product conveyed in the reflow furnace, so that a regular cleaning operation is required. Therefore, a flux that suppresses volatilization of the solvent has been proposed (see, for example, Patent Document 1).

International Publication No. 2015/037107

  The solvent component in the flux can be appropriately adjusted in volatility, and in addition, the damage to the metal component inside the reflow furnace is relatively small. On the other hand, the activator component in the flux has an activity to remove the oxide film on the solder surface and also has an activity on the metal surface such as the inside of the reflow furnace. However, the cleaning frequency of the reflow furnace increases.

  The present invention has been made to solve such problems, and an object of the present invention is to provide a flux in which an activator component is hardly volatile and a solder paste using the flux.

  Dimer amine, which is a reaction product obtained by modifying dimer acid, and trimer triamine, which is a reaction product obtained by modifying trimer acid, has activity on the solder surface and the metal surface constituting the electrode, and is assumed in soldering. It was found to have low volatility in a certain temperature range.

  Therefore, the present invention is dimerized amine, trimer triamine, hydrogenated dimerized amine obtained by adding hydrogen to dimer amine, or hydrogenated trimer triamine which is hydrogenated product obtained by adding hydrogen to trimer triamine, or , Dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine.

  The flux of the present invention includes dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in total. It is preferable to include 0.5 wt% or more and 20 wt% or less.

  Dimeramine is a reaction product obtained by modifying dimer acid, which is a reaction product of oleic acid and linoleic acid. Trimer triamine is a reaction product obtained by modifying trimer acid, which is a reaction product of oleic acid and linoleic acid. Preferably there is.

  Furthermore, the flux of the present invention preferably contains rosin in an amount of 30 wt% to 60 wt% and a solvent in an amount of 29 wt% to 60 wt%. Further, as an activator, an organic acid is further added in an amount of 0 wt% to 15 wt%, an organic halogen compound is 0 wt% to 5 wt%, an amine hydrohalide is 0 wt% to 5 wt%, and other amines are 0 wt% to 10 wt%. It is preferable to include below. Furthermore, it is preferable to contain a thixotropic agent at 0 wt% or more and 10 wt% or less. Moreover, it is preferable to contain antioxidant 0 to 5 wt% and an antifoamer 0 to 5 wt% as optional additives.

  Moreover, this invention is the solder paste containing the flux mentioned above and metal powder.

  In the present invention, either dimer amine, trimer triamine, hydrogenated dimer amine or hydrogenated trimer triamine, or two or more of dimer amine, trimer triamine, hydrogenated dimer amine, and hydrogenated trimer triamine are used. Even under a heavy load condition, volatilization of the activator component in the flux can be suppressed and adhesion to the inside of the reflow furnace can be suppressed. Therefore, the cleaning frequency of the reflow furnace can be kept low.

<Example of flux of this embodiment>
The flux of the present embodiment includes dimer amine, which is a reaction product obtained by modifying dimer acid, trimer triamine, which is a reaction product obtained by modifying trimer acid, and hydrogenated dimer amine, which is a hydrogenation product obtained by adding hydrogen to dimer amine. Alternatively, any of hydrogenated trimer triamines, which are hydrogenated products obtained by adding hydrogen to trimer triamine, or two or more of dimer amine, trimer triamine, hydrogenated dimer amine, and hydrogenated trimer triamine are included.

  The dimer acid used as the raw material for the dimerized amine of the present embodiment is a reaction product of oleic acid and linoleic acid, and is a dimer having 36 carbon atoms. The trimer acid used as the raw material for the trimer triamine of the present embodiment is a reaction product of oleic acid and linoleic acid, and is a trimer having 54 carbon atoms. The present embodiment, which is a reaction product obtained by modifying dimer amine, which is a reaction product obtained by modifying dimer acid, which is a reaction product of oleic acid and linoleic acid, and a trimer acid, which is a reaction product of oleic acid and linoleic acid. The trimmertriamine in the form of has a low volatility in the temperature range assumed for soldering and functions as an activator during soldering.

  When the addition amount of dimer amine, trimer triamine, hydrogenated dimer amine and hydrogenated trimer triamine is small, it is necessary to add another highly volatile activator component, and the hardly volatile effect cannot be obtained. Therefore, dimeramine, trimer triamine, hydrogenated dimer amine or hydrogenated trimer triamine, or two or more of dimer amine, trimer triamine, hydrogenated dimer amine and hydrogenated trimer triamine, in a total amount of 0.5 wt%. More than 20wt% is included.

  In addition, the flux of the present embodiment includes rosin of 30 wt% or more and 60 wt% or less, organic acid of 0 wt% or more and 15 wt% or less, more preferably organic acid of 0 wt% or more and 10 wt% or less, and other amines of 0 wt% or more. 10 wt% or less, organic halogen compound 0 wt% or more and 5 wt% or less, amine hydrohalide salt 0 wt% or more and 5 wt% or less, solvent 29 wt% or more and 60 wt% or less, and thixotropic agent 0 wt% or more and 10 wt% or less. Further, the flux of the present embodiment contains 0 wt% or more and 5 wt% or less of the antioxidant and 0 wt% or more and 5 wt% or less of the antifoaming agent. A colorant may be further included.

  Examples of the rosin include raw material rosins such as gum rosin, wood rosin and tall oil rosin, and derivatives obtained from the raw rosin. Examples of the derivatives include purified rosin, hydrogenated rosin, disproportionated rosin, polymerized rosin, acid-modified rosin, phenol-modified rosin, and α, β-unsaturated carboxylic acid-modified products (acrylated rosin, maleated rosin, fumarized). Rosin, etc.), and purified, hydride and disproportionate of the polymerized rosin, and purified, hydride and disproportionate of the modified α, β unsaturated carboxylic acid, etc. Two or more types can be used.

  Organic acids include glutaric acid, adipic acid, azelaic acid, eicosane diacid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylaniline diglycolic acid, suberic acid, sebacic acid, thioglycol Acid, terephthalic acid, dodecanedioic acid, parahydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris (2-carboxyethyl) isocyanurate Glycine, 1,3-cyclohexanedicarboxylic acid, 2,2-bis (hydroxymethyl) propionic acid, 2,2-bis (hydroxymethyl) butanoic acid, 2,3-dihydroxybenzoic acid, 2,4-diethylglutaric acid 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, - anisic acid, stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, and linolenic acid.

  Examples of the organic acid include dimer acid, trimer acid, hydrogenated dimer acid which is a hydrogenated product obtained by adding hydrogen to dimer acid, and hydrogenated trimer acid which is a hydrogenated product obtained by adding hydrogen to trimer acid.

  For example, dimer acid which is a reaction product of oleic acid and linoleic acid, trimer acid which is a reaction product of oleic acid and linoleic acid, dimer acid which is a reaction product of acrylic acid, trimer acid which is a reaction product of acrylic acid, methacrylic acid Dimer acid, which is a reaction product of dimer acid, trimer acid which is a reaction product of methacrylic acid, dimer acid which is a reaction product of acrylic acid and methacrylic acid, trimer acid which is a reaction product of acrylic acid and methacrylic acid, and a reaction product of oleic acid Dimer acid, oleic acid reactant, trimer acid, linoleic acid reactant dimer acid, linoleic acid reactant trimer acid, linolenic acid reactant dimer acid, linolenic acid reactant A trimer acid, a dimer acid that is a reaction product of acrylic acid and oleic acid, a trimer acid that is a reaction product of acrylic acid and oleic acid, Dimer acid, which is a reaction product of crylic acid and linoleic acid, trimer acid, which is a reaction product of acrylic acid and linoleic acid, dimer acid which is a reaction product of acrylic acid and linolenic acid, and trimer which is a reaction product of acrylic acid and linolenic acid Dimer acid that is a reaction product of acid, methacrylic acid and oleic acid, trimer acid that is a reaction product of methacrylic acid and oleic acid, dimer acid that is a reaction product of methacrylic acid and linoleic acid, and a reaction product of methacrylic acid and linoleic acid Dimer acid, which is a reaction product of some trimer acid, methacrylic acid and linolenic acid, Trimer acid which is a reaction product of methacrylic acid and linolenic acid, Dimer acid which is a reaction product of oleic acid and linolenic acid, Reaction of oleic acid and linolenic acid Trimer acid that is a product, dimer acid that is a reaction product of linoleic acid and linolenic acid, and a reaction product of linoleic acid and linolenic acid Specific trimer acids, hydrogenated dimer acids that are hydrogenated products of the dimer acids described above, hydrogenated trimer acids that are the hydrogenated products of the trimer acids described above, and the like can be given.

  Other amines include monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl -4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl 2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimer Tate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6 [2'-Undecylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl- (1')]-ethyl-s- Triazine, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5- Dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimi Sol, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2,4-diamino-6-vinyl-s-triazine, 2,4-diamino-6-vinyl -S-triazine isocyanuric acid adduct, 2,4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, benzimidazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazole, 2- (2 ' -Hydroxy-3'-ter t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-tert-amylphenyl) benzotriazole, 2- (2'-hydroxy-5) '-Tert-octylphenyl) benzotriazole, 2,2'-methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol], 6- (2-benzotriazolyl) -4- tert-octyl-6'-tert-butyl-4'-methyl-2,2'-methylenebisphenol, 1,2,3-benzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] benzo Triazole, carboxybenzotriazole, 1- [N, N-bis (2-ethylhexyl) aminomethyl] methylbenzoto Azole, 2,2 ′-[[(methyl-1H-benzotriazol-1-yl) methyl] imino] bisethanol, 1- (1 ′, 2′-dicarboxyethyl) benzotriazole, 1- (2,3 -Dicarboxypropyl) benzotriazole, 1-[(2-ethylhexylamino) methyl] benzotriazole, 2,6-bis [(1H-benzotriazol-1-yl) methyl] -4-methylphenol, 5-methylbenzo Examples include triazole and 5-phenyltetrazole.

  Examples of the organic halogen compound include trans-2,3-dibromo-1,4-butenediol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1- Propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol, 2,3-dibromo-1 , 4-butanediol, 2,3-dibromo-2-butene-1,4-diol, and the like.

  An amine hydrohalide is a compound obtained by reacting an amine with a hydrogen halide, and examples thereof include aniline hydrogen chloride and aniline hydrogen bromide. As the amine of the amine hydrohalide, the above-described amines can be used, and examples include ethylamine, ethylenediamine, triethylamine, methylimidazole, 2-ethyl-4-methylimidazole, and the like. Examples include hydrides of bromine, iodine, and fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, hydrogen fluoride). Further, a borofluoride may be included instead of the amine hydrohalide or together with the amine hydrohalide, and examples of the borofluoride include borohydrofluoric acid.

  Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineols and the like. As alcohol solvents, isopropyl alcohol, 1,2-butanediol, isobornylcyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5 -Dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris (hydroxymethyl) Ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2'-oxybis (methylene) bis (2-ethyl-1,3-propanediol), 2,2-bis (hydroxymethyl) -1,3-propanediol, 1,2,6-trihydroxyhexane, bis [2,2,2-tris (hydroxymethyl) ethyl] ate 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3,6-diol, 2,4,7,9-tetramethyl-5-decyne-4,7-diol and the like. Glycol ether solvents include hexyl diglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether Etc.

  Examples of thixotropic agents include wax-based thixotropic agents and amide-based thixotropic agents. Examples of the wax-based thixotropic agent include castor oil. As the amide thixotropic agent, lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-toluene methane amide, Aromatic amide, methylene bis stearic acid amide, ethylene bis lauric acid amide, ethylene bishydroxystearic acid amide, saturated fatty acid bis amide, methylene bis oleic acid amide, unsaturated fatty acid bis amide, m-xylylene bis stearic acid amide, aromatic bis amide , Saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylol stearate amide, methylol amide, fatty acid ester Amide, and the like. Examples of the antioxidant include hindered phenol antioxidants. Examples of the antifoaming agent include acrylic polymers, vinyl ether polymers, butadiene polymers, and silicones.

<Example of solder paste of this embodiment>
The solder paste of the present embodiment includes the above-described flux and metal powder. The metal powder is preferably a solder containing no Pb, Sn alone, or Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Bi, Sn—In, etc. These alloys are composed of solder powder obtained by adding Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P or the like to these alloys.

<Examples of effects of flux and solder paste of this embodiment>
In a flux containing two or more of dimer amine, trimer triamine, hydrogenated dimer amine and hydrogenated trimer triamine, and a solder paste using this flux, dimer amine, trimer triamine, hydrogenated dimer amine and hydrogenated in the flux Trimmer triamine has heat resistance in the temperature range assumed for soldering. This suppresses the volatilization of dimeramine amine, trimer triamine, hydrogenated dimer amine, and hydrogenated trimer triamine, which are activator components in the flux, even under reflow conditions with a large heat load, and adheres to the inside of the reflow furnace. Can be suppressed.

  Therefore, the cleaning frequency of the reflow furnace can be kept low. The flux residue containing dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine can be removed by washing and can be applied to a washing flux.

  In addition, the solder paste using a flux containing two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine can suppress the viscosity to a low level and suppress the occurrence of lumps and precipitation. Therefore, good printability of the solder paste can be obtained.

  Furthermore, dimeramine amine, trimer triamine, hydrogenated dimer amine and hydrogenated trimer triamine are suppressed in volatilization under reflow conditions and are present in the flux until the end of reflow. There is nothing. Therefore, dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine function as an activator during soldering, so that the solder can be well spread and the occurrence of poor solder wetting can be suppressed.

  The fluxes of Examples and Comparative Examples were prepared with the compositions shown in Tables 1 and 2 below, and solder pastes were prepared using this flux, and verified for poor volatility, viscosity, and lumps / precipitation. The composition ratios in Tables 1 and 2 are wt (weight)% when the total amount of flux is 100.

  The solder paste has a flux of 11 wt% and metal powder of 89 wt%. Further, the metal powder in the solder paste is a Sn—Ag—Cu solder alloy in which Ag is 3.0 wt%, Cu is 0.5 wt%, and the balance is Sn, and the average particle size of the metal powder is φ20 μm. It is.

<Evaluation of poor volatility>
(1) Verification method Evaluation of difficult volatility was carried out by a test (JIS K 0129) by a TG method (thermal gravimeter method). In the test by the TG method, 10 mg of the flux described in each example and each comparative example was packed in an aluminum pan, and heated at 25 to 250 ° C. peak at a temperature increase rate of 1 ° C./sec using a TGD9600 manufactured by ULVAC. did.

(2) Criteria ◯: Weight loss rate−solvent content in flux ≦ 15%
×: Weight loss rate—solvent content in flux> 15%

<Evaluation of viscosity>
(1) Verification method Viscosity was evaluated by measuring the viscosity of a solder paste in which the flux described in each example and each comparative example was mixed with the above-described metal powder using PCU-205 manufactured by Malcolm Corporation. Test conditions were based on JIS Z 3284-3.

(2) Criteria ◯: Viscosity is 350 Pa * s or less x: Viscosity exceeds 350 Pa * s

<Evaluation of lumps and precipitation>
(1) Verification method The evaluation test of lumps / precipitation was performed by using a solder paste in which the flux described in each example and each comparative example and the above-described metal powder were mixed in a predetermined pattern described in JIS Z 3284-3. Using a stainless steel mask on which a paste printing section was formed, printing was performed on a Bare-Cu plate having a length of 50 mm, a width of 50 mm, and a thickness of 0.5 mm, and the presence or absence of lumps and precipitation was confirmed visually.

(2) Criteria ◯: Neither lumps or precipitation was confirmed ×: Either lumps, deposition or both were confirmed

  In addition, the solder paste of each Example printed on the Bare-Cu plate in the above-described dama / precipitation evaluation test was used to perform an evaluation test of solder wetting and spreading.

  The printing portion provided on the above-described mask has a rectangular opening and has a size of 3.0 mm × 1.5 mm. In the printing unit, a plurality of openings having the same size are arranged at different intervals, and the interval between the openings is 0.2-0.3-0.4-0.5-0.6-0.7-0.8. It is -0.9-1.0-1.1-1.2mm.

After the solder paste is printed, the mask is removed, and before reflow, it is confirmed that the solder paste is not in contact at a position of 0.2 mm, which is the minimum interval between the printing parts arranged in parallel, and reflow is performed. The reflow condition is that after preheating at 190 ° C. for 120 seconds in an N ₂ atmosphere, the temperature is increased from 190 ° C. to 260 ° C. at a rate of temperature increase of 1 ° C./sec.

  As a result of the evaluation of the solder spread, the solder paste spreads well in the solder paste using the flux of each example.

  In the present invention, as shown in Examples 1 to 4, dimer amine, which is a reaction product obtained by modifying dimer acid, which is a reaction product of oleic acid and linoleic acid, and trimer, which is a reaction product of oleic acid and linoleic acid. A flux containing 5 wt% of any of the trimer triamine, hydrogenated dimer amine, or hydrogenated trimer triamine, which is a modified product of the acid, is sufficient for low volatility, suppression of viscosity increase, and suppression of lumps and precipitation. The effect was obtained. Including 5% by weight of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in total 5% by weight is sufficient for suppressing volatility, suppressing viscosity increase, and suppressing dams and precipitation. was gotten.

  In addition, as shown in Example 5, even with a flux containing 10 wt% dimer diamine, sufficient effects were obtained with respect to poor volatility, suppression of increase in viscosity, and suppression of lumps and precipitation.

  On the other hand, as shown in Comparative Example 1 and Comparative Example 2, the flux containing no dimeramine, trimer triamine, hydrogenated dimer amine, or hydrogenated trimer triamine, and containing a low molecular weight amine suppresses viscosity increase. However, it was not possible to obtain a sufficient effect for suppressing volatility and suppressing lumps and precipitation.

  Further, as shown in Comparative Example 3 and Comparative Example 4, a flux containing an amine having a large molecular weight without any of dimer amine, trimer triamine, hydrogenated dimer amine, or hydrogenated trimer triamine is difficult as the molecular weight increases. Although there is a tendency to obtain a volatile effect, a sufficient effect was not obtained with respect to the suppression of viscosity increase and the suppression of lumps and precipitation.

  Furthermore, as shown in Comparative Example 5, in the flux that does not contain any of dimer amine, trimer triamine, hydrogenated dimer amine, or hydrogenated trimer triamine and increases the amount of amine with a small molecular weight, the amount of amine added increases. As a result, an effect was obtained for the suppression of the increase in viscosity and the suppression of lumps and precipitation, but a sufficient effect on the hardly volatile property was not obtained.

  Furthermore, as shown in Comparative Example 6, in fluxes that do not contain any of dimer amine, trimer triamine, hydrogenated dimer amine, or hydrogenated trimer triamine, and do not contain other amines, suppression of viscosity increase and suppression of lumps and precipitation. Although an effect was obtained, a sufficient effect on hardly volatile was not obtained.

  In addition, by including rosin within the range defined by the present invention, the effects of low volatility, suppression of viscosity increase and suppression of lumps and precipitation are obtained. As shown in Examples 6 to 8, rosin Even when various types of rosins were combined, the effects of low volatility, suppression of viscosity increase, and suppression of lumps and precipitation were obtained.

  Furthermore, as shown in Example 9, by containing 20 wt% of dimer diamine, the effects of low volatility, suppression of viscosity increase, and suppression of lumps / precipitation were obtained even without including an organic acid. On the other hand, by including the organic acid within the range defined by the present invention, the effects of hardly volatility, suppression of increase in viscosity, and suppression of lumps and precipitation are obtained, as shown in Examples 10 to 12. In addition, even when the type of the organic acid was changed and the addition amount of the organic acid was changed, the effects of low volatility, suppression of viscosity increase, and suppression of lumps and precipitation were obtained.

  Furthermore, by including other amines within the range defined in the present invention, the effects of low volatility, suppression of increase in viscosity, and suppression of lumps and precipitation are obtained. Even when 0.5 wt% was included and 2 wt% of other amines were included, the effects of low volatility, suppression of viscosity increase, and suppression of lumps and precipitation were also obtained. Furthermore, as shown in Examples 14 to 16, even if the kind and amount of amine were changed, the effects of low volatility, suppression of increase in viscosity, and suppression of lumps and precipitation were obtained.

  Furthermore, as shown in Example 17, by including dimer diamine within the range defined by the present invention, it is difficult to prevent volatility, increase in viscosity, and suppression of lumps / precipitation without including an organic halogen compound. The effect was obtained. On the other hand, by including an organic halogen compound within the range specified in the present invention, the effects of low volatility, suppression of increase in viscosity, and suppression of lumps and precipitation are obtained. Even when containing 5 wt% of a halogen compound, the effect of hardly volatility, suppression of viscosity increase and suppression of lumps / precipitation was obtained, and the effect of poor volatility, suppression of viscosity increase and suppression of dams / precipitation was obtained. Further, as shown in Example 19, even when the kind of the organic halogen compound was changed, the effects of the low volatility, the suppression of increase in viscosity, and the suppression of lumps and precipitation were obtained.

  Furthermore, by including an amine hydrohalide within the range defined in the present invention, the effect of low volatility, suppression of viscosity increase, and suppression of lumps and precipitation can be obtained, as shown in Example 20, Even if 1 wt% of the amine hydrohalide is included, it is difficult to volatility, suppression of increase in viscosity and suppression of lumps and precipitation are obtained. As shown in Example 21, even if 5 wt% of the amine hydrohalide is included, The effects of low volatility, suppression of viscosity increase, and suppression of lumps and precipitation were obtained. Moreover, even if it contains an antioxidant and an antifoaming agent within the range specified in the present invention, the effect of hardly volatility, suppression of increase in viscosity and suppression of lumps and precipitation can be obtained, as shown in Example 22. Even when 3 wt% of the antioxidant was contained, the effects of hardly volatility, suppression of increase in viscosity, and suppression of lumps and precipitation were obtained. Further, as shown in Example 23, even when 2 wt% of the antifoaming agent was included, the effects of hardly volatility, suppression of increase in viscosity, and suppression of lumps and precipitation were obtained.

  From the above, dimer amine, which is a reaction product obtained by modifying dimer acid, trimer triamine, reaction product obtained by modifying trimer acid, hydrogenated dimer amine or hydrogenated trimer triamine, or dimer amine, trimer Two or more of triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, in total, 0.5 wt% to 20 wt%, rosin 30 wt% to 60 wt%, organic acid 0 wt% to 15 wt%, more preferably Organic acid: 0 wt% to 10 wt%, amine: 0 wt% to 10 wt%, organic halogen compound: 0 wt% to 5 wt%, amine hydrohalide: 0 wt% to 5 wt%, solvent: 29 wt% 60wt% or less, thixotropic agent 0wt% or more and 10wt% or less, oxidation In the flux containing 0 wt% or more and 5 wt% or less of the deterrent and 0 wt% or more and 5 wt% or less of the defoaming agent, and the solder paste using this flux, the volatilization of the activator component in the flux is suppressed even under a large heat load condition. It was possible to suppress adhesion to the inside of the reflow furnace.

  In addition, the solder paste using a flux containing two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine can suppress the viscosity to a low level and suppress the occurrence of lumps and precipitation. And good printability of the solder paste was obtained.

  In addition, dimeramine amine, trimer triamine, hydrogenated dimer amine and hydrogenated trimer triamine are inhibited from volatilizing under reflow conditions, so that dimer amine, trimer triamine, hydrogenated dimer amine and hydrogenated trimer triamine are active during soldering. It functioned as an agent, the solder spreads well, and it was possible to suppress the occurrence of poor solder wetting.

Claims (10)

A flux comprising any one of dimer amine, trimer triamine, hydrogenated dimer amine, or hydrogenated trimer triamine, or two or more of dimer amine, trimer triamine, hydrogenated dimer amine, and hydrogenated trimer triamine. Dimer diamine, trimer triamine, hydrogenated dimer diamine or hydrogenated trimer triamine, or two or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, in total 0.5 wt% or more and 20 wt% The flux according to claim 1, wherein the flux is contained in an amount of not more than%. Dimeriamine is a reaction product obtained by modifying dimer acid, which is a reaction product between oleic acid and linoleic acid. Trimer triamine is a reaction product obtained by modifying trimer acid, which is a reaction product between oleic acid and linoleic acid. The flux according to claim 1 or 2, wherein 30 wt% or more and 60 wt% or less of rosin,
The flux according to any one of claims 1 to 3, wherein the solvent is contained in an amount of 29 wt% or more and 60 wt% or less. Further, an organic acid is added in an amount of 0 wt% to 15 wt% as an activator
Organohalogen compounds in an amount of 0 wt% to 5 wt%
The flux according to any one of claims 1 to 4, comprising an amine hydrohalide in an amount of 0 wt% to 5 wt%. The flux according to any one of claims 1 to 5, further comprising another amine as an activator in an amount of 0 wt% to 10 wt%. Furthermore, a thixotropic agent is contained in 0 wt% or more and 10 wt% or less. The flux according to any one of claims 1 to 6 characterized by things. Furthermore, antioxidant is contained in 0 wt% or more and 5 wt% or less. The flux of any one of Claims 1-7 characterized by the above-mentioned. The flux according to any one of claims 1 to 8, further comprising an antifoaming agent in an amount of 0 wt% to 5 wt%. A solder paste comprising the flux according to any one of claims 1 to 9 and metal powder.