CN109746591B - Flux and solder paste - Google Patents
Flux and solder paste Download PDFInfo
- Publication number
- CN109746591B CN109746591B CN201811295373.0A CN201811295373A CN109746591B CN 109746591 B CN109746591 B CN 109746591B CN 201811295373 A CN201811295373 A CN 201811295373A CN 109746591 B CN109746591 B CN 109746591B
- Authority
- CN
- China
- Prior art keywords
- acid
- amount
- flux
- hydrogenated
- dimer diamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a flux and a solder paste. [ problem ] to provide: a flux for rendering the active agent component less volatile, and a solder paste using the flux. [ solution ] A flux contains: any one of a dimer diamine, a trimer triamine, a hydrogenated dimer diamine, or a hydrogenated trimer triamine; or more than 2 of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine.
Description
Technical Field
The present invention relates to a flux used for soldering and a solder paste using the flux.
Background
In general, a flux used in soldering has the following effects: the solder and the metal oxide present on the metal surface of the object to be soldered are chemically removed, and the metal element can be moved at the boundary between the solder and the object to be soldered. Therefore, by soldering using the flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be bonded, and a strong bond can be obtained.
The solder paste is a composite material obtained by mixing solder alloy powder and flux. Soldering using a solder paste was performed as follows: solder paste is printed on a soldered portion such as an electrode of a substrate, a component is mounted on the soldered portion on which the solder paste is printed, and the substrate is heated in a heating furnace called a reflow furnace to melt the solder, thereby performing soldering.
The flux is composed of a solid component and a solvent for melting the solid component, and the solvent component in the flux is volatilized by heating at the time of soldering.
When solvent components and the like in the flux volatilize under heating during soldering, flux fumes of gas are generated, and the flux fumes adhere to and liquefy at portions lower in temperature than during heating, such as wall surfaces in the reflow furnace, a cooling zone, and the like.
As described above, when the volatile component of the flux adheres to and liquefies in the reflow furnace, the volatile component may drip on the product conveyed in the reflow furnace, and therefore, a regular cleaning operation is required. Therefore, a flux that suppresses volatilization of a solvent has been proposed (for example, see patent document 1).
Documents of the prior art
Patent document
Patent document 1: international publication No. 2015/037107
Disclosure of Invention
Problems to be solved by the invention
The solvent component in the flux can be appropriately controlled to be volatile, and the metal component in the reflow furnace is less damaged. On the other hand, the active agent component in the flux has activity of removing an oxide film on the solder surface and activity on the metal surface such as the inside of the reflow furnace, and therefore, even if the flux that suppresses the volatilization of the solvent is used, the frequency of cleaning the reflow furnace increases.
The present invention has been made to solve the above problems, and an object of the present invention is to provide: a flux for rendering the active agent component less volatile, and a solder paste using the flux.
Means for solving the problems
The following are found: dimer diamine, which is a reactant obtained by modifying a dimer acid, and trimer triamine, which is a reactant obtained by modifying a trimer acid, are active on the solder surface and the metal surface constituting an electrode, and are less volatile in a temperature range assumed for soldering.
Accordingly, the present invention is a flux, comprising: any one of dimer diamine, trimer triamine, hydrogenated dimer diamine which is a hydride obtained by hydrogenating dimer diamine, and hydrogenated trimer triamine which is a hydride obtained by hydrogenating trimer triamine; or more than 2 of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine.
The flux of the present invention preferably contains 0.5 wt% or more and 20 wt% or less in total of any of dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine; or 2 or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in a total amount of 0.5 wt% or more and 20 wt% or less.
Preferably, the dimer diamine is a reactant obtained by modifying a dimer acid which is a reactant of oleic acid and linoleic acid, and the trimer triamine is a reactant obtained by modifying a trimer acid which is a reactant of oleic acid and linoleic acid.
Further, the flux of the present invention preferably contains 30 wt% to 60 wt% of rosin and 29 wt% to 60 wt% of a solvent. Preferably, the activator further contains an organic acid in an amount of 0 to 15 wt%, an organic halogen compound in an amount of 0 to 5 wt%, an amine hydrohalide salt in an amount of 0 to 5 wt%, and other amines in an amount of 0 to 10 wt%. Preferably, the thixotropic agent is further contained in an amount of 0 wt% or more and 10 wt% or less. Further, it is preferable that the antioxidant is contained in an amount of 0 wt% or more and 5 wt% or less and the antifoaming agent is contained in an amount of 0 wt% or more and 5 wt% or less as optional additives.
In addition, the present invention is a solder paste including: the above-mentioned flux; and, a metal powder.
ADVANTAGEOUS EFFECTS OF INVENTION
In the present invention, by comprising any one of a dimer diamine, a trimer triamine, a hydrogenated dimer diamine, or a hydrogenated trimer triamine; alternatively, at least 2 of the dimer diamine, the trimer triamine, the hydrogenated dimer diamine, and the hydrogenated trimer triamine can suppress volatilization of the active agent component in the flux under a high thermal load, and can suppress adhesion thereof to the inside of the reflow furnace. This makes it possible to reduce the frequency of cleaning the reflow furnace.
Detailed Description
< example of flux in the present embodiment >
The flux of the present embodiment includes: any one of dimer diamine which is a reactant obtained by modifying a dimer acid, trimer triamine which is a reactant obtained by modifying a trimer acid, hydrogenated dimer diamine which is a hydride obtained by hydrogenating the dimer diamine, or hydrogenated trimer triamine which is a hydride obtained by hydrogenating the trimer triamine; or more than 2 of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine.
The dimer acid serving as a raw material of the dimer diamine of the present embodiment is a dimer having 36 carbon atoms, which is a reaction product of oleic acid and linoleic acid. The trimer acid which is a raw material of the trimer triamine in the present embodiment is a trimer having 54 carbon atoms which is a reaction product of oleic acid and linoleic acid. The dimer diamine of the present embodiment, which is a reactant obtained by modifying a dimer acid that is a reactant of oleic acid and linoleic acid, and the trimer triamine of the present embodiment, which is a reactant obtained by modifying a trimer acid that is a reactant of oleic acid and linoleic acid, are less volatile in a temperature range assumed in soldering, and function as an active agent in soldering.
When the amounts of the dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine are small, it is necessary to add another active ingredient having high volatility, and the effect of low volatility cannot be obtained. Thus, 0.5 wt% or more and 20 wt% or less in total of any of dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine is contained; or 2 or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in a total amount of 0.5 wt% or more and 20 wt% or less.
In addition, the flux of the present embodiment includes: 30 to 60 wt% of rosin, 0 to 15 wt% of organic acid, more preferably 0 to 10 wt% of organic acid, 0 to 10 wt% of other amine, 0 to 5 wt% of organic halogen compound, 0 to 5 wt% of amine hydrohalide salt, 29 to 60 wt% of solvent, and 0 to 10 wt% of thixotropic agent. The flux of the present embodiment further includes 0 wt% or more and 5 wt% or less of an antioxidant and 0 wt% or more and 5 wt% or less of a defoaming agent. It is noted that a colorant may be further contained.
Examples of the derivative include purified rosins, hydrogenated rosins, disproportionated rosins, polymerized rosins, acid-modified rosins, phenol-modified rosins, α -modified unsaturated carboxylic acid (acrylated rosins, maleated rosins, fumarated rosins, etc.), purified products, hydrides and disproportionates of the polymerized rosins, and purified products, hydrides and disproportionates of the α -modified unsaturated carboxylic acid, and 1 or 2 or more of them.
Examples of the organic acid include glutaric acid, adipic acid, azelaic acid, eicosanedioic acid, citric acid, glycolic acid, succinic acid, salicylic acid, diglycolic acid, dipicolinic acid, dibutylanilindiglycolic acid, suberic acid, sebacic acid, thioglycolic acid, terephthalic acid, dodecanedioic acid, p-hydroxyphenylacetic acid, picolinic acid, phenylsuccinic acid, phthalic acid, fumaric acid, maleic acid, malonic acid, lauric acid, benzoic acid, tartaric acid, tris (2-carboxyethyl) isocyanurate, glycine, 1, 3-cyclohexanedicarboxylic acid, 2-bis (hydroxymethyl) propionic acid, 2-bis (hydroxymethyl) butyric acid, 2, 3-dihydroxybenzoic acid, 2, 4-diethylglutaric acid, 2-quinolinecarboxylic acid, 3-hydroxybenzoic acid, malic acid, p-anisic acid, Stearic acid, 12-hydroxystearic acid, oleic acid, linoleic acid, linolenic acid and the like.
Examples of the organic acid include dimer acids, trimer acids, hydrogenated dimer acids which are hydrogenated hydrides obtained by hydrogenating dimer acids, and hydrogenated trimer acids which are hydrogenated hydrides obtained by hydrogenating trimer acids.
Examples thereof include: a dimer acid as a reactant of oleic acid and linoleic acid, a trimer acid as a reactant of oleic acid and linoleic acid, a dimer acid as a reactant of acrylic acid, a trimer acid as a reactant of acrylic acid, a dimer acid as a reactant of methacrylic acid, a trimer acid as a reactant of methacrylic acid, a dimer acid as a reactant of acrylic acid and methacrylic acid, a trimer acid as a reactant of acrylic acid and methacrylic acid, a dimer acid as a reactant of oleic acid, a trimer acid as a reactant of oleic acid, a dimer acid as a reactant of linoleic acid, a trimer acid as a reactant of linoleic acid, a dimer acid as a reactant of linolenic acid, a trimer acid as a reactant of linolenic acid, a dimer acid as a reactant of acrylic acid and oleic acid, a trimer acid as a reactant of, Dimer acid as a reactant of acrylic acid and linoleic acid, trimer acid as a reactant of acrylic acid and linoleic acid, dimer acid as a reactant of acrylic acid and linolenic acid, trimer acid as a reactant of acrylic acid and linolenic acid, dimer acid as a reactant of methacrylic acid and oleic acid, trimer acid as a reactant of methacrylic acid and oleic acid, dimer acid as a reactant of methacrylic acid and linoleic acid, trimer acid as a reactant of methacrylic acid and linoleic acid, dimer acid as a reactant of methacrylic acid and linolenic acid, trimer acid as a reactant of methacrylic acid and linolenic acid, dimer acid as a reactant of oleic acid and linolenic acid, trimer acid as a reactant of oleic acid and linolenic acid, dimer acid as a reactant of linoleic acid and linolenic acid, trimer acid as a reactant of linoleic acid and linolenic acid, dimer acid as a reactant of acrylic acid and linolenic acid, dimer acid as a reactant of methacrylic, Hydrogenated dimer acids as hydrides of the above dimer acids, hydrogenated trimer acids as hydrides of the above trimer acids, and the like.
Examples of other amines include: monoethanolamine, diphenylguanidine, ethylamine, triethylamine, ethylenediamine, triethylenetetramine, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1, 2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, triethylamine, etc., and a mixture thereof, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-diamino-6- [2 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -undecylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -ethyl-4 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine, 2, 4-diamino-6- [2 ' -methylimidazolyl- (1 ') ] -ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4, 5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2, 3-dihydro-1H-pyrrolo [1,2-a ] benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, 2-phenylimidazoline, 2, 4-diamino-6-vinyl-s-triazine isocyanuric acid adduct, 2, 4-diamino-6-methacryloyloxyethyl-s-triazine, epoxy-imidazole adduct, 2-methylbenzimidazole, 2-octylbenzimidazole, 2-pentylbenzimidazole, 2-dimethylbenzimidazole, dimethylimidazole, dimethyl, 2- (1-ethylpentyl) benzimidazole, 2-nonylbenzimidazole, 2- (4-thiazolyl) benzimidazole, 2- (2 ' -hydroxy-5 ' -methylphenyl) benzotriazole, 2- (2 ' -hydroxy-3 ' -tert-butyl-5 ' -methylphenyl) -5-chlorobenzotriazole, 2- (2 ' -hydroxy-3 ', 5 ' -di-tert-amylphenyl) benzotriazole, 2- (2 ' -hydroxy-5 ' -tert-octylphenyl) benzotriazole, 2 ' -methylenebis [6- (2H-benzotriazol-2-yl) -4-tert-octylphenol ], 6- (2-benzotriazolyl) -4-tert-octyl-6 ' -tert-butyl-4 ' in ' manner ' -methyl-2, 2 '-methylenebisphenol, 1,2, 3-benzotriazole, 1- [ N, N-bis (2-ethylhexyl) aminomethyl ] benzotriazole, carboxybenzotriazole, 1- [ N, N-bis (2-ethylhexyl) aminomethyl ] methylbenzotriazole, 2' - [ [ (methyl-1H-benzotriazol-1-yl) methyl ] imino ] diethanol, 1- (1 ', 2' -dicarboxyethyl) benzotriazole, 1- (2, 3-dicarboxypropyl) benzotriazole, 1- [ (2-ethylhexylamino) methyl ] benzotriazole, 2, 6-bis [ (1H-benzotriazol-1-yl) methyl ] -4-methylphenol, and mixtures thereof, 5-methylbenzotriazole, 5-phenyltetrazole, and the like.
Examples of the organic halogen compound include trans-2, 3-dibromo-1, 4-butenediol, triallyl isocyanurate hexabromide, 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1, 2-propanediol, 1, 4-dibromo-2-butanol, 1, 3-dibromo-2-propanol, 2, 3-dibromo-1, 4-butanediol, 2, 3-dibromo-2-butene-1, 4-diol and the like.
The amine hydrohalide is a compound obtained by reacting an amine with a hydrogen halide, and examples thereof include aniline hydrogen chloride and aniline hydrogen bromide. The amine of the amine hydrohalide salt may be the above-mentioned amine, and examples thereof include ethylamine, ethylenediamine, triethylamine, methylimidazole, and 2-ethyl-4-methylimidazole, and examples thereof include hydrogen halide include hydrogen halides of chlorine, bromine, iodine, and fluorine (hydrogen chloride, hydrogen bromide, hydrogen iodide, and hydrogen fluoride). Further, a borofluoride may be contained instead of or together with the amine hydrohalide, and examples of the borofluoride include borofluoric acid and the like.
Examples of the solvent include water, alcohol solvents, glycol ether solvents, terpineol, and the like. Examples of the alcohol solvent include isopropanol, 1, 2-butanediol, isobornyl cyclohexanol, 2, 4-diethyl-1, 5-pentanediol, 2-dimethyl-1, 3-propanediol, 2, 5-dimethyl-2, 5-hexanediol, 2, 5-dimethyl-3-hexyne-2, 5-diol, 2, 3-dimethyl-2, 3-butanediol, 1,1, 1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 2 '-oxybis (methylene) bis (2-ethyl-1, 3-propanediol), 2-bis (hydroxymethyl) -1, 3-propanediol, isobornyl cyclohexanol, 2, 4-diethyl-1, 5-pentanediol, 2-dimethyl-1, 3-propanediol, 2, 1, 1-tris (hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1, 3-propanediol, 2' -oxybis (, 1,2, 6-trihydroxyhexane, bis [2,2, 2-tris (hydroxymethyl) ethyl ] ether, 1-ethynyl-1-cyclohexanol, 1, 4-cyclohexanediol, 1, 4-cyclohexanedimethanol, erythritol, threitol, guaiacol glyceryl ether, 3, 6-dimethyl-4-octyne-3, 6-diol, 2,4,7, 9-tetramethyl-5-decyne-4, 7-diol, and the like. Examples of the glycol ether solvent include hexyldiglycol, diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2, 4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, and triethylene glycol monobutyl ether.
Examples of the thixotropic agent include wax-based thixotropic agents and amide-based thixotropic agents. Examples of the wax thixotropic agent include hydrogenated castor oil and the like. Examples of the amide thixotropic agent include lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide, hydroxystearic acid amide, saturated fatty acid amide, oleic acid amide, erucic acid amide, unsaturated fatty acid amide, p-tolylmethane amide, aromatic amide, methylenebisstearic acid amide, ethylenebislauric acid amide, ethylenebishydroxystearic acid amide, saturated fatty acid bisamide, methylenebisoleic acid amide, unsaturated fatty acid bisamide, m-xylylenebisstearic acid amide, aromatic bisamide, saturated fatty acid polyamide, unsaturated fatty acid polyamide, aromatic polyamide, substituted amide, methylolstearic acid amide, methylolamide, fatty acid ester amide, and the like. Examples of the antioxidant include hindered phenol antioxidants. Examples of the defoaming agent include acrylic polymers, vinyl ether polymers, butadiene polymers, and silicones.
< example of solder paste of the present embodiment >
The solder paste of the present embodiment includes: the above-mentioned flux; and, a metal powder. The metal powder is preferably soft solder without Pb and consists of Sn simple substance; or a powder of Sn-Ag system, Sn-Cu system, Sn-Ag-Cu system, Sn-Bi system, Sn-In system, or the like, or a powder of a solder obtained by adding Sb, Bi, In, Cu, Zn, As, Ag, Cd, Fe, Ni, Co, Au, Ge, P, or the like to these alloys.
< examples of effects of the flux and solder paste of the present embodiment >
A flux comprising 2 or more kinds of dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine, and a solder paste using the flux, wherein the dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine in the flux have heat resistance in a temperature range expected in soldering. Therefore, volatilization of dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine, which are active agent components in the flux, can be suppressed even under reflow conditions with a large thermal load, and adhesion to the inside of the reflow furnace can be suppressed.
This makes it possible to reduce the frequency of cleaning the reflow furnace. The flux residue containing dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine can be removed by cleaning and can be used as a cleaning flux.
In addition, in the solder paste using the flux containing 2 or more kinds of the dimer diamine, the trimer triamine, the hydrogenated dimer diamine, and the hydrogenated trimer triamine, the viscosity can be suppressed to be low, and the generation of the blocking and the precipitation can be suppressed, and therefore, the good printability of the solder paste can be obtained.
Further, the dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine can suppress volatilization under reflow soldering conditions, and are present in the flux until reflow soldering is completed, and therefore volatilization and decomposition do not occur during reflow soldering and activity is not lost. Accordingly, the dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine function as an active agent during soldering, and the solder is well spread and wetted, and the occurrence of poor wetting of the solder can be suppressed.
Examples
The flux of examples and comparative examples was prepared in the composition shown in tables 1 and 2 below, and the solder paste was prepared using the flux, and the low volatility, viscosity, and blocking/precipitation were verified. The composition ratios in tables 1 and 2 are wt% (by weight) based on 100 of the total amount of the flux.
The flux of the solder paste is 11 wt% and the metal powder is 89 wt%. The metal powder in the solder paste was an Sn-Ag-Cu solder alloy containing 3.0 wt% of Ag, 0.5 wt% of Cu, and the balance Sn, and had an average particle diameter of 20 μm.
< evaluation of volatility insusceptibility >
(1) Verification method
Evaluation of difficult volatility was carried out by a test (JIS K0129) based on the TG method (thermogravimetric analysis method). The test based on the TG method was carried out by filling 10mg of the flux described in each of examples and comparative examples in an aluminum pan and heating the pan from 25 ℃ at a temperature peak of 250 ℃ and a temperature rise rate of 1 ℃/sec by means of TGD9600 manufactured by U L VAC.
(2) Criterion for determination
Good: loss reduction rate-the solvent content in the soldering flux is less than or equal to 15 percent
× loss reduction by weight-solvent content in flux > 15%
< evaluation of viscosity >
(1) Verification method
The viscosity was evaluated as follows: the viscosity of the solder paste in which the flux described in each example and each comparative example was mixed with the metal powder was measured by PCU-205 manufactured by Malcolm inc. The test conditions were in accordance with JIS Z3284-3.
(2) Criterion for determination
Good: viscosity of 350Pa & s or less
× viscosity over 350 pas
< evaluation of lump/precipitation >
(1) Verification method
The evaluation test of blocking and deposition was conducted by printing a solder paste containing the flux described in each example and each comparative example and the metal powder described above on a Bare-Cu plate 50mm in length × and 50mm in width × and 0.5mm in thickness using a mask made of stainless steel and provided with a printed portion of solder paste in a predetermined pattern as described in JIS Z3284-3, and visually checking the presence or absence of blocking and deposition.
(2) Criterion for determination
Good: neither blocking nor precipitation was confirmed
× confirmation of either one of blocking and precipitation or both
In the evaluation test of the above-described blocking and deposition, the solder paste of each example printed on a barrel-Cu plate was used to perform an evaluation test of spreading of the solder wetting.
The printing part of the mask is a quadrangular opening with the size of 3.0mm × 1.5.5 mm, and a plurality of openings with the same size are arranged at different intervals, and the interval of the openings is 0.2-0.3-0.4-0.5-0.6-0.7-0.8-0.9-1.0-1.1-1.2 mm.
After printing of the solder paste, the mask was removed, and before reflow soldering, it was confirmed that the solder paste did not come into contact at the 0.2mm portion which is the minimum interval between the parallel printing portions, and reflow soldering was performed. The reflow conditions were as follows: in N2After preheating at 190 ℃ for 120 seconds in an atmosphere, the temperature was raised from 190 ℃ to 260 ℃ at a rate of 1 ℃/second to carry out main heating.
As a result of the evaluation of spreading of the solder, the solder was well spread in the solder paste using the flux of each example.
[ Table 1]
[ Table 2]
In the present invention, as shown in examples 1 to 4, in the flux containing 5 wt% of either dimer diamine, which is a reaction product obtained by modifying a dimer acid, which is a reaction product of oleic acid and linoleic acid, or trimer triamine, which is a reaction product obtained by modifying a trimer acid, which is a reaction product of oleic acid and linoleic acid, or hydrogenated dimer diamine or hydrogenated trimer triamine, sufficient effects are obtained with respect to the prevention of the volatilization, the increase in viscosity, and the prevention of the blocking/precipitation. It should be noted that the composition containing 5 wt% or more of dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine in total also provides sufficient effects on the prevention of volatility, the prevention of viscosity increase, and the prevention of blocking and precipitation.
As shown in example 5, the flux containing 10 wt% of dimer diamine also exhibited sufficient effects on the prevention of the increase in viscosity and the prevention of blocking and precipitation, and was less volatile.
On the other hand, as shown in comparative examples 1 and 2, the flux containing no dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine, and containing the amine having a small molecular weight exhibited an effect of suppressing the increase in viscosity, but did not exhibit a sufficient effect of suppressing the volatility and the blocking/precipitation.
As shown in comparative examples 3 and 4, in the flux containing no dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine and containing an amine having a large molecular weight, the effect of being less volatile tends to be obtained as the molecular weight increases, but sufficient effects of suppressing the increase in viscosity and suppressing blocking and precipitation cannot be obtained.
Further, as shown in comparative example 5, in the flux containing no dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine and having an increased amount of amine having a small molecular weight, the effect of suppressing the increase in viscosity and the blocking and precipitation was obtained as the amount of amine added was increased, but the effect of suppressing the blocking and precipitation was not sufficient for the low volatility.
Further, as shown in comparative example 6, in the flux containing no dimer diamine, trimer triamine, hydrogenated dimer diamine, or hydrogenated trimer triamine, and containing no other amine, the effect of suppressing the increase in viscosity and the blocking/precipitation was obtained, but the effect of suppressing the low volatility was not sufficient.
Further, by containing rosin within the range defined in the present invention, effects of low volatility, suppression of increase in viscosity, and suppression of blocking/precipitation are obtained, and as shown in examples 6 to 8, effects of low volatility, suppression of increase in viscosity, and suppression of blocking/precipitation can also be obtained by changing the kind of rosin and combining a plurality of rosins.
Further, as shown in example 9, by containing 20 wt% of dimer diamine, even if the dimer diamine does not contain an organic acid, effects of being less volatile, suppressing an increase in viscosity, and suppressing blocking/precipitation can be obtained. On the other hand, by including the organic acid within the range defined in the present invention, the effects of suppressing the volatility and the increase in viscosity and suppressing the blocking and precipitation can be obtained, and as shown in examples 10 to 12, the effects of suppressing the volatility and the increase in viscosity and suppressing the blocking and precipitation can also be obtained by changing the kind of the organic acid and changing the amount of the organic acid added.
Further, by including other amines in the range defined in the present invention, effects of suppressing the volatility and the increase in viscosity and suppressing the blocking/precipitation can be obtained, and as shown in example 13, effects of suppressing the volatility and the increase in viscosity and suppressing the blocking/precipitation can also be obtained by including 0.5 wt% of dimer diamine and 2 wt% of other amines. Further, as shown in examples 14 to 16, even when the type and amount of amine added were changed, the effects of low volatility, suppression of viscosity increase, and suppression of blocking and precipitation were obtained.
Further, as shown in example 17, by including the dimer diamine within the range defined in the present invention, even if the dimer diamine does not contain an organic halogen compound, effects of low volatility, suppression of viscosity increase, and suppression of blocking/precipitation can be obtained. On the other hand, by including the organic halogen compound in the range defined in the present invention, the effects of suppressing the volatility and the increase in viscosity and suppressing the blocking and precipitation can be obtained, and as shown in example 18, the effects of suppressing the volatility and the increase in viscosity and suppressing the blocking and precipitation, and the effects of suppressing the volatility and the increase in viscosity and suppressing the blocking and precipitation can be obtained by including 5 wt% of the organic halogen compound. Further, as shown in example 19, even when the kind of the organic halogen compound was changed, the effects of being less volatile, suppressing the increase in viscosity, and suppressing the blocking and precipitation were obtained.
Further, by containing the amine hydrohalide within the range defined in the present invention, the effects of being less volatile, suppressing the increase in viscosity, and suppressing the blocking/precipitation can be obtained, and as shown in example 20, by containing 1 wt% of the amine hydrohalide, the effects of being less volatile, suppressing the increase in viscosity, and suppressing the blocking/precipitation can be obtained, and as shown in example 21, by containing 5 wt% of the amine hydrohalide, the effects of being less volatile, suppressing the increase in viscosity, and suppressing the blocking/precipitation can be obtained. Further, the effect of suppressing the volatility and the increase in viscosity and the effect of suppressing the blocking and the precipitation can be obtained by including the antioxidant and the defoaming agent within the range defined in the present invention, and the effect of suppressing the volatility and the increase in viscosity and the effect of suppressing the blocking and the precipitation can be obtained by including the antioxidant in an amount of 3 wt% as shown in example 22. Further, as shown in example 23, when the defoaming agent was contained in an amount of 2 wt%, the effects of low volatility, suppression of viscosity increase, and suppression of blocking/precipitation were obtained.
More preferably, the resin composition contains 0.5 to 20 wt% in total of dimer diamine as a reactant obtained by modifying a dimer acid, 0.5 to 20 wt% in total of trimer triamine as a reactant obtained by modifying a trimer acid, either one of hydrogenated dimer diamine or hydrogenated trimer triamine, or 2 or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, 30 to 60 wt% of rosin, 0 to 15 wt% of an organic acid, more preferably 0 to 10 wt% of an organic acid, 0 to 10 wt% of an amine, 0 to 5 wt% of an organic halogen compound, 0 to 5 wt% of an amine hydrohalide salt, 29 to 60 wt% of a solvent, 0 to 10 wt% of a thixotropic agent, 0 to 5 wt% of an antioxidant, and, A flux containing 0 to 5 wt% of a defoaming agent and a solder paste using the flux can suppress volatilization of an active agent component in the flux even under a high thermal load and can suppress adhesion to the inside of a reflow furnace.
In addition, in the solder paste using the flux containing 2 or more kinds of the dimer diamine, the trimer triamine, the hydrogenated dimer diamine, and the hydrogenated trimer triamine, the viscosity can be suppressed to be low, and the generation of the blocking and the precipitation can be suppressed, and the good printability of the solder paste can be obtained.
Further, volatilization of the dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine under reflow soldering conditions is suppressed, and the dimer diamine, trimer triamine, hydrogenated dimer diamine, and hydrogenated trimer triamine function as an active agent during soldering, and the solder is well spread and wetted, and occurrence of poor wetting of the solder can be suppressed.
Claims (10)
1. A solder flux, comprising:
any one of a dimer diamine, a trimer triamine, a hydrogenated dimer diamine, or a hydrogenated trimer triamine; or more than 2 of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine, and the soldering flux also comprises rosin and solvent.
2. The flux according to claim 1,
comprises 0.5 wt% or more and 20 wt% or less in total of any of a dimer diamine, a trimer triamine, a hydrogenated dimer diamine, or a hydrogenated trimer triamine; or 2 or more of dimer diamine, trimer triamine, hydrogenated dimer diamine and hydrogenated trimer triamine in a total amount of 0.5 wt% or more and 20 wt% or less.
3. The flux according to claim 1 or claim 2,
the dimer diamine is a reactant obtained by modifying a dimer acid which is a reactant of oleic acid and linoleic acid, and the trimer triamine is a reactant obtained by modifying a trimer acid which is a reactant of oleic acid and linoleic acid.
4. The soldering flux according to any one of claims 1 to 2,
the rosin is contained at 30 wt% or more and 60 wt% or less,
the solvent is contained at 29 wt% or more and 60 wt% or less.
5. The flux according to claim 3,
the rosin is contained at 30 wt% or more and 60 wt% or less,
the solvent is contained at 29 wt% or more and 60 wt% or less.
6. The soldering flux according to any one of claims 1 to 2,
the soldering flux optionally further comprises an organic acid, an organic halogen compound, an amine hydrohalide salt, a further amine, a thixotropic agent, an antioxidant and/or a defoamer,
and containing an organic acid in an amount of 0 to 15 wt%,
Containing an organic halogen compound in an amount of 0 to 5 wt%,
Contains an amine hydrohalide salt in an amount of 0 to 5 wt%,
and further containing other amines in an amount of 0 to 10 wt%,
contains a thixotropic agent in an amount of 0 to 10 wt%,
an antioxidant is contained in an amount of 0 to 5 wt%,
the defoaming agent is contained in an amount of 0 to 5 wt%.
7. The flux according to claim 3,
the soldering flux optionally further comprises an organic acid, an organic halogen compound, an amine hydrohalide salt, a further amine, a thixotropic agent, an antioxidant and/or a defoamer,
and containing an organic acid in an amount of 0 to 15 wt%,
Containing an organic halogen compound in an amount of 0 to 5 wt%,
Contains an amine hydrohalide salt in an amount of 0 to 5 wt%,
and further containing other amines in an amount of 0 to 10 wt%,
contains a thixotropic agent in an amount of 0 to 10 wt%,
an antioxidant is contained in an amount of 0 to 5 wt%,
the defoaming agent is contained in an amount of 0 to 5 wt%.
8. The flux according to claim 4,
the soldering flux optionally further comprises an organic acid, an organic halogen compound, an amine hydrohalide salt, a further amine, a thixotropic agent, an antioxidant and/or a defoamer,
and containing an organic acid in an amount of 0 to 15 wt%,
Containing an organic halogen compound in an amount of 0 to 5 wt%,
Contains an amine hydrohalide salt in an amount of 0 to 5 wt%,
and further containing other amines in an amount of 0 to 10 wt%,
contains a thixotropic agent in an amount of 0 to 10 wt%,
an antioxidant is contained in an amount of 0 to 5 wt%,
the defoaming agent is contained in an amount of 0 to 5 wt%.
9. The flux according to claim 5,
the soldering flux optionally further comprises an organic acid, an organic halogen compound, an amine hydrohalide salt, a further amine, a thixotropic agent, an antioxidant and/or a defoamer,
and containing an organic acid in an amount of 0 to 15 wt%,
Containing an organic halogen compound in an amount of 0 to 5 wt%,
Contains an amine hydrohalide salt in an amount of 0 to 5 wt%,
and further containing other amines in an amount of 0 to 10 wt%,
contains a thixotropic agent in an amount of 0 to 10 wt%,
an antioxidant is contained in an amount of 0 to 5 wt%,
the defoaming agent is contained in an amount of 0 to 5 wt%.
10. A solder paste characterized in that,
comprises the following steps: the soldering flux of any one of claims 1 to 9; and, a metal powder.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017212941A JP6338007B1 (en) | 2017-11-02 | 2017-11-02 | Flux and solder paste |
| JP2017-212941 | 2017-11-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109746591A CN109746591A (en) | 2019-05-14 |
| CN109746591B true CN109746591B (en) | 2020-08-04 |
Family
ID=62487326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811295373.0A Active CN109746591B (en) | 2017-11-02 | 2018-11-01 | Flux and solder paste |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6338007B1 (en) |
| CN (1) | CN109746591B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6501003B1 (en) | 2018-01-17 | 2019-04-17 | 千住金属工業株式会社 | Resin composition for soldering, core solder, flux coat solder and liquid flux |
| JP6646242B1 (en) * | 2019-05-27 | 2020-02-14 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6646241B1 (en) * | 2019-05-27 | 2020-02-14 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| JP6849934B1 (en) * | 2020-03-18 | 2021-03-31 | 千住金属工業株式会社 | Flux and solder paste |
| JP6993594B2 (en) * | 2020-03-27 | 2022-02-04 | 千住金属工業株式会社 | Flux and solder paste |
| JP6928295B1 (en) * | 2020-10-02 | 2021-09-01 | 千住金属工業株式会社 | Flux and solder paste |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064481A (en) * | 1990-05-17 | 1991-11-12 | Motorola, Inc. | Use or organic acids in low residue solder pastes |
| US6367686B1 (en) * | 2000-08-31 | 2002-04-09 | United Technologies Corporation | Self cleaning braze material |
| CN100420540C (en) * | 2006-04-30 | 2008-09-24 | 北京市航天焊接材料厂 | Low-solid content water-based cleaning-free soldering flux without volatile organic compound and halogen |
| US8434667B2 (en) * | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
| JP5850206B2 (en) * | 2013-09-12 | 2016-02-03 | 千住金属工業株式会社 | Flux for cleaning and solder paste for cleaning |
| EP2886245B1 (en) * | 2013-12-17 | 2019-06-12 | Heraeus Deutschland GmbH & Co. KG | Soldering paste with adipic acid, oxalic acid and amine components |
| JP6160608B2 (en) * | 2014-12-26 | 2017-07-12 | 千住金属工業株式会社 | Flux for rapid heating method and solder paste for rapid heating method |
| JP2017080757A (en) * | 2015-10-26 | 2017-05-18 | 株式会社弘輝 | Flux, and solder composition |
| JP2017177121A (en) * | 2016-03-28 | 2017-10-05 | 住友金属鉱山株式会社 | HIGH-TEMPERATURE Pb-FREE SOLDER PASTE AND MANUFACTURING METHOD THEREOF |
-
2017
- 2017-11-02 JP JP2017212941A patent/JP6338007B1/en active Active
-
2018
- 2018-11-01 CN CN201811295373.0A patent/CN109746591B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109746591A (en) | 2019-05-14 |
| JP6338007B1 (en) | 2018-06-06 |
| JP2019084549A (en) | 2019-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109746591B (en) | Flux and solder paste | |
| CN111194251B (en) | Soldering flux and solder paste | |
| CN111526967B (en) | Flux and solder paste | |
| CN111587162B (en) | Resin composition for soldering, resin core solder, flux sheath solder, and liquid flux | |
| US11117224B2 (en) | Flux and solder paste | |
| CN111902238A (en) | Solder paste | |
| KR20220166197A (en) | Flux and solder paste | |
| CN110814576B (en) | Flux and solder paste | |
| CN113441875B (en) | Cleaning flux and cleaning paste | |
| US20220331916A1 (en) | Solder paste | |
| JP7021446B1 (en) | Flux and solder paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |