SG11202103744XA - Transfer device, resin molding device, transfer method, and method for producing resin molded article - Google Patents

Transfer device, resin molding device, transfer method, and method for producing resin molded article

Info

Publication number
SG11202103744XA
SG11202103744XA SG11202103744XA SG11202103744XA SG11202103744XA SG 11202103744X A SG11202103744X A SG 11202103744XA SG 11202103744X A SG11202103744X A SG 11202103744XA SG 11202103744X A SG11202103744X A SG 11202103744XA SG 11202103744X A SG11202103744X A SG 11202103744XA
Authority
SG
Singapore
Prior art keywords
transfer
molded article
resin molded
resin molding
molding device
Prior art date
Application number
SG11202103744XA
Other languages
English (en)
Inventor
Syuhei Yoshida
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of SG11202103744XA publication Critical patent/SG11202103744XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B29C45/4225—Take-off members or carriers for the moulded articles, e.g. grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould
    • B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B29C2043/5046—Removing moulded articles using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
SG11202103744XA 2018-10-19 2019-08-01 Transfer device, resin molding device, transfer method, and method for producing resin molded article SG11202103744XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018197518A JP6655150B1 (ja) 2018-10-19 2018-10-19 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法
PCT/JP2019/030369 WO2020079923A1 (ja) 2018-10-19 2019-08-01 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
SG11202103744XA true SG11202103744XA (en) 2021-05-28

Family

ID=69624441

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202103744XA SG11202103744XA (en) 2018-10-19 2019-08-01 Transfer device, resin molding device, transfer method, and method for producing resin molded article

Country Status (7)

Country Link
US (1) US20210370565A1 (ko)
JP (1) JP6655150B1 (ko)
KR (1) KR102484881B1 (ko)
CN (1) CN112839785B (ko)
SG (1) SG11202103744XA (ko)
TW (1) TWI735943B (ko)
WO (1) WO2020079923A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7160770B2 (ja) * 2019-07-22 2022-10-25 アピックヤマダ株式会社 樹脂モールド装置
JP7360369B2 (ja) * 2020-08-28 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341105B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7394798B2 (ja) * 2021-02-09 2023-12-08 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置及び樹脂成形品の製造方法
CN113274154B (zh) * 2021-05-11 2022-04-22 瑞丰口腔科技（深圳）有限公司 一种可摘树脂义齿腭皱模具结构及义齿腭皱成型工艺
CN114311491B (zh) * 2021-12-10 2024-03-19 扬州市邗江扬子汽车内饰件有限公司 轻量化麻纤维汽车内饰件的成型注塑生产设备及生产工艺
JP2024013299A (ja) * 2022-07-20 2024-02-01 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3590118B2 (ja) * 1995-01-24 2004-11-17 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JPH10335360A (ja) * 1997-05-27 1998-12-18 Sumitomo Heavy Ind Ltd 半導体素子の樹脂封止装置
JP4388654B2 (ja) 2000-02-01 2009-12-24 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
US6439869B1 (en) * 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
JP4154314B2 (ja) * 2002-11-29 2008-09-24 アピックヤマダ株式会社 樹脂封止装置
AT503968B1 (de) * 2006-05-05 2009-03-15 Gottfried Steiner Ingenieurbue Spritzgiessanlage
KR20120028639A (ko) * 2010-09-15 2012-03-23 한미반도체 주식회사 트랜스퍼 몰딩장치
JP2012104518A (ja) * 2010-11-05 2012-05-31 Sumitomo Heavy Ind Ltd 封止装置の基板受け渡し機構及び封止装置の基板受け渡し方法
JP5934139B2 (ja) * 2013-04-19 2016-06-15 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP2017121771A (ja) * 2016-01-08 2017-07-13 株式会社ユーシン精機 成形品取出機及びその制御方法
GB2574971A (en) * 2017-03-28 2019-12-25 Unipres Corp Cooling method and cooling apparatus for molded article
JP7377189B2 (ja) * 2020-12-14 2023-11-09 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、及び、樹脂成形品の製造方法

Also Published As

Publication number Publication date
KR20210058904A (ko) 2021-05-24
JP6655150B1 (ja) 2020-02-26
TWI735943B (zh) 2021-08-11
US20210370565A1 (en) 2021-12-02
JP2020062857A (ja) 2020-04-23
KR102484881B1 (ko) 2023-01-05
CN112839785A (zh) 2021-05-25
WO2020079923A1 (ja) 2020-04-23
TW202015877A (zh) 2020-05-01
CN112839785B (zh) 2022-12-30

Similar Documents

Publication Publication Date Title
SG11202103744XA (en) Transfer device, resin molding device, transfer method, and method for producing resin molded article
EP3275923A4 (en) Fiber-reinforced plastic molding material, method for producing same, and molded article
EP3132907A4 (en) Molds for in-mold foaming molding of polyolefin-based resin, method for manufacturing in-mold foaming molded article, and in-mold foaming molded article
EP3438208A4 (en) THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, METHOD FOR THE PRODUCTION OF A CELLULOSE-REINFORCED THERMOPLASTIC RESIN COMPOSITION, CELLULOSE-REINFORCED CELL-OUR-CELL-IN-DISCHARGE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE CELLULOSE-CONSTRUCTIBLE-CELLULOSE-CONSTRUCTIBLE CELLULOSE-IN-DOCTORIZED CELLULOSE COMPOSITION
EP3248754A4 (en) Device and method for molding molded resin article
EP3543293C0 (en) RESIN COMPOSITION, MOLDED ARTICLE AND METHOD FOR PRODUCING A MOLDED ARTICLE
EP3632981A4 (en) THERMOPLASTIC RESIN COMPOSITION, PROCESS FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE, AND PRODUCTION METHOD FOR MOLDED ARTICLE
SG10202002603SA (en) Resin molding apparatus and method for manufacturing resin molded product
SG11202103743VA (en) Conveyance device, resin molding device, conveyance method, and method for manufacture of resin mold product
EP3339357A4 (en) Foam molding resin and method for manufacturing foam molded article
EP3797958A4 (en) MOLDING DEVICE, MOLD AND MANUFACTURING METHOD FOR MOLDED PRODUCT
EP3320997A4 (en) MOVING MOLDING DEVICE, MOVING MOLDING METHOD, AND MOLDED ARTICLE
EP3904452A4 (en) RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIN COMPOSITION, MOLDING AND METHOD OF PRODUCTION OF MOLDING
EP3904044A4 (en) BLOW MOLDING DEVICE, BLOW MOLDING METHOD AND MOLD UNIT
PL3455046T3 (pl) Sposób wytwarzania wyrobu przez formowanie wtryskowe, odpowiednia do tego żywica polimerowa i produkt
EP3521022A4 (en) TRANSFER FILM FOR THREE-DIMENSIONAL SHAPING, PRODUCTION METHOD THEREFOR AND METHOD FOR THE PRODUCTION OF A RESIN MOLDED ARTICLE
EP3881999A4 (en) APPARATUS AND METHOD FOR MAKING AN INJECTION MOLDED ARTICLE AND RESIN MOLDED ARTICLE
EP3919252A4 (en) MOLDING DEVICE AND SYSTEM FOR PRODUCTION OF A MOLDING
EP3541591A4 (en) MOLDED ARTICLE, CONTAINER AND METHOD OF MOLDING AND RECYCLING THE SAME
EP3677401A4 (en) RESIN FOR FOAM MOLDING, FOAM MOLDED ARTICLE, AND PROCESS FOR PRODUCING A FOAM MOLDED ARTICLE
EP3305545A4 (en) Film for in-mold molding, in-mold molded article, and method for producing in-mold molded article
EP3632648A4 (en) INJECTION MOLDING MOLD, RESIN ELEMENT AND METHOD OF MANUFACTURING A RESIN ARTICLE
EP3719042A4 (en) METHOD OF MANUFACTURING STYRENE RESIN AND MOLDED ARTICLES FROM STYRENE RESIN
EP3616870A4 (en) FIBER REINFORCED RESIN MOLDED MATERIAL AND METHOD OF MANUFACTURING THEREOF AND MOLDED BODY FROM FIBER REINFORCED RESIN
EP3647371A4 (en) RESIN COMPOSITION, METHOD FOR PRODUCING THE RESIN COMPOSITION AND MOLDED ARTICLE