SG11202011069RA - Radical output monitor for a remote plasma source and method of use - Google Patents

Radical output monitor for a remote plasma source and method of use

Info

Publication number
SG11202011069RA
SG11202011069RA SG11202011069RA SG11202011069RA SG11202011069RA SG 11202011069R A SG11202011069R A SG 11202011069RA SG 11202011069R A SG11202011069R A SG 11202011069RA SG 11202011069R A SG11202011069R A SG 11202011069RA SG 11202011069R A SG11202011069R A SG 11202011069RA
Authority
SG
Singapore
Prior art keywords
plasma source
remote plasma
output monitor
radical output
radical
Prior art date
Application number
SG11202011069RA
Other languages
English (en)
Inventor
Michael Harris
Chiu-Yang Tai
Atul Gupta
Original Assignee
Mks Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mks Instr Inc filed Critical Mks Instr Inc
Publication of SG11202011069RA publication Critical patent/SG11202011069RA/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/3244Gas supply means
    • H01J37/32449Gas control, e.g. control of the gas flow
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357Generation remote from the workpiece, e.g. down-stream
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32522Temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32954Electron temperature measurement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/0006Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
    • H05H1/0068Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature by thermal means

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
SG11202011069RA 2018-06-14 2019-06-12 Radical output monitor for a remote plasma source and method of use SG11202011069RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862684820P 2018-06-14 2018-06-14
PCT/US2019/036796 WO2019241405A1 (en) 2018-06-14 2019-06-12 Radical output monitor for a remote plasma source and method of use

Publications (1)

Publication Number Publication Date
SG11202011069RA true SG11202011069RA (en) 2020-12-30

Family

ID=68840258

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202011069RA SG11202011069RA (en) 2018-06-14 2019-06-12 Radical output monitor for a remote plasma source and method of use

Country Status (8)

Country Link
US (1) US11114287B2 (zh)
EP (1) EP3785494A4 (zh)
JP (1) JP7301075B2 (zh)
KR (1) KR20210009428A (zh)
CN (1) CN112335342B (zh)
SG (1) SG11202011069RA (zh)
TW (1) TWI809122B (zh)
WO (1) WO2019241405A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102421625B1 (ko) 2017-06-27 2022-07-19 캐논 아네르바 가부시키가이샤 플라스마 처리 장치
CN110800377B (zh) 2017-06-27 2022-04-29 佳能安内华股份有限公司 等离子体处理装置
SG11201912566WA (en) 2017-06-27 2020-01-30 Canon Anelva Corp Plasma processing apparatus
JP6595002B2 (ja) 2017-06-27 2019-10-23 キヤノンアネルバ株式会社 スパッタリング装置
SG11202009122YA (en) * 2018-06-26 2020-10-29 Canon Anelva Corp Plasma processing apparatus, plasma processing method, program, and memory medium

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4918031A (en) 1988-12-28 1990-04-17 American Telephone And Telegraph Company,At&T Bell Laboratories Processes depending on plasma generation using a helical resonator
US5429070A (en) 1989-06-13 1995-07-04 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5122251A (en) 1989-06-13 1992-06-16 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
DE69128345T2 (de) 1990-01-04 1998-03-26 Mattson Tech Inc Induktiver plasmareaktor im unteren hochfrequenzbereich
JP2635267B2 (ja) 1991-06-27 1997-07-30 アプライド マテリアルズ インコーポレイテッド Rfプラズマ処理装置
US6024826A (en) * 1996-05-13 2000-02-15 Applied Materials, Inc. Plasma reactor with heated source of a polymer-hardening precursor material
US5349154A (en) 1991-10-16 1994-09-20 Rockwell International Corporation Diamond growth by microwave generated plasma flame
JPH07254496A (ja) 1994-03-17 1995-10-03 Fuji Electric Co Ltd 誘導プラズマの発生装置
US5587207A (en) 1994-11-14 1996-12-24 Gorokhovsky; Vladimir I. Arc assisted CVD coating and sintering method
US5478608A (en) 1994-11-14 1995-12-26 Gorokhovsky; Vladimir I. Arc assisted CVD coating method and apparatus
JPH0955372A (ja) 1995-08-11 1997-02-25 Nippon Steel Corp プラズマ処理装置
JPH10134996A (ja) 1996-10-31 1998-05-22 Nec Corp プラズマ処理装置
JP3598717B2 (ja) 1997-03-19 2004-12-08 株式会社日立製作所 プラズマ処理装置
JP2868120B2 (ja) 1997-06-11 1999-03-10 川崎重工業株式会社 電子ビーム励起プラズマ発生装置
US6388226B1 (en) 1997-06-26 2002-05-14 Applied Science And Technology, Inc. Toroidal low-field reactive gas source
US6150628A (en) 1997-06-26 2000-11-21 Applied Science And Technology, Inc. Toroidal low-field reactive gas source
US6815633B1 (en) 1997-06-26 2004-11-09 Applied Science & Technology, Inc. Inductively-coupled toroidal plasma source
US5937541A (en) * 1997-09-15 1999-08-17 Siemens Aktiengesellschaft Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
US6352049B1 (en) 1998-02-09 2002-03-05 Applied Materials, Inc. Plasma assisted processing chamber with separate control of species density
US6635578B1 (en) 1998-02-09 2003-10-21 Applied Materials, Inc Method of operating a dual chamber reactor with neutral density decoupled from ion density
US6450116B1 (en) * 1999-04-22 2002-09-17 Applied Materials, Inc. Apparatus for exposing a substrate to plasma radicals
EP1212775A1 (en) 1999-08-06 2002-06-12 Advanced Energy Industries, Inc. Inductively coupled ring-plasma source apparatus for processing gases and materials and method thereof
JP2001274148A (ja) * 2000-03-24 2001-10-05 Tokyo Electron Ltd プラズマ処理装置及び方法
US6679981B1 (en) 2000-05-11 2004-01-20 Applied Materials, Inc. Inductive plasma loop enhancing magnetron sputtering
EP1156511A1 (en) * 2000-05-19 2001-11-21 Applied Materials, Inc. Remote plasma CVD apparatus
US6418874B1 (en) 2000-05-25 2002-07-16 Applied Materials, Inc. Toroidal plasma source for plasma processing
EP1162646A3 (en) 2000-06-06 2004-10-13 Matsushita Electric Works, Ltd. Plasma treatment apparatus and method
RU2209532C2 (ru) 2001-10-10 2003-07-27 Сорокин Игорь Борисович Плазменный ускоритель с замкнутым дрейфом электронов
US6855906B2 (en) 2001-10-16 2005-02-15 Adam Alexander Brailove Induction plasma reactor
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US20030164143A1 (en) 2002-01-10 2003-09-04 Hitachi Kokusai Electric Inc. Batch-type remote plasma processing apparatus
JP2004047192A (ja) 2002-07-10 2004-02-12 Adtec Plasma Technology Co Ltd 透磁コアによるトランス放電型プラズマ発生装置
NO20024248D0 (no) 2002-09-05 2002-09-05 Seppo Konkola Metode og utstyr for aksellererende strömmende plasma gasskombinasjoner
JP4472372B2 (ja) 2003-02-03 2010-06-02 株式会社オクテック プラズマ処理装置及びプラズマ処理装置用の電極板
KR100520979B1 (ko) 2003-03-07 2005-10-12 위순임 원격 플라즈마 발생기를 이용한 진공 프로세스 챔버
US6872909B2 (en) 2003-04-16 2005-03-29 Applied Science And Technology, Inc. Toroidal low-field reactive gas and plasma source having a dielectric vacuum vessel
US8053700B2 (en) 2003-04-16 2011-11-08 Mks Instruments, Inc. Applicators and cooling systems for a plasma device
JP4460940B2 (ja) 2003-05-07 2010-05-12 株式会社ニューパワープラズマ 多重放電管ブリッジを備えた誘導プラズマチャンバ
US6902646B2 (en) * 2003-08-14 2005-06-07 Advanced Energy Industries, Inc. Sensor array for measuring plasma characteristics in plasma processing environments
US7071118B2 (en) 2003-11-12 2006-07-04 Veeco Instruments, Inc. Method and apparatus for fabricating a conformal thin film on a substrate
US7268084B2 (en) 2004-09-30 2007-09-11 Tokyo Electron Limited Method for treating a substrate
US7396431B2 (en) 2004-09-30 2008-07-08 Tokyo Electron Limited Plasma processing system for treating a substrate
GB2442990A (en) 2004-10-04 2008-04-23 C Tech Innovation Ltd Microwave plasma apparatus
US20060118240A1 (en) 2004-12-03 2006-06-08 Applied Science And Technology, Inc. Methods and apparatus for downstream dissociation of gases
KR20070106982A (ko) 2004-12-20 2007-11-06 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. 저에너지 고전류 리본 빔 이온주입장치에서 빔 중성화의개선
KR100720989B1 (ko) 2005-07-15 2007-05-28 주식회사 뉴파워 프라즈마 멀티 챔버 플라즈마 프로세스 시스템
US7550381B2 (en) 2005-07-18 2009-06-23 Applied Materials, Inc. Contact clean by remote plasma and repair of silicide surface
TWI332532B (en) 2005-11-04 2010-11-01 Applied Materials Inc Apparatus and process for plasma-enhanced atomic layer deposition
KR100799175B1 (ko) 2006-04-21 2008-02-01 주식회사 뉴파워 프라즈마 플라즈마 프로세싱 시스템 및 그 제어 방법
JP5257917B2 (ja) 2006-04-24 2013-08-07 株式会社ニューパワープラズマ 多重マグネチックコアが結合された誘導結合プラズマ反応器
CN101466445A (zh) * 2006-06-12 2009-06-24 山米奎普公司 到处于真空状态下的装置的蒸气传送
US7837826B2 (en) 2006-07-18 2010-11-23 Lam Research Corporation Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
KR101595686B1 (ko) 2007-10-19 2016-02-18 엠케이에스 인스트루먼츠, 인코포레이티드 높은 가스 유량 공정을 위한 환형 플라즈마 챔버
JP5423205B2 (ja) * 2008-08-29 2014-02-19 東京エレクトロン株式会社 成膜装置
BRPI1008865B1 (pt) 2009-02-04 2019-12-10 General Fusion Inc sistemas e métodos para compressão de plasma
AU2010288081B2 (en) 2009-08-27 2014-03-20 Mosaic Crystals Ltd. Penetrating plasma generating apparatus for high vacuum chambers
JP5469991B2 (ja) * 2009-10-19 2014-04-16 株式会社アルバック 分析装置
US9190289B2 (en) * 2010-02-26 2015-11-17 Lam Research Corporation System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas
JP5618766B2 (ja) * 2010-10-27 2014-11-05 株式会社アルバック ラジカル測定装置及びラジカル測定管
US8723423B2 (en) 2011-01-25 2014-05-13 Advanced Energy Industries, Inc. Electrostatic remote plasma source
TWI646869B (zh) * 2011-10-05 2019-01-01 美商應用材料股份有限公司 對稱電漿處理腔室
US9035553B2 (en) 2011-11-09 2015-05-19 Dae-Kyu Choi Hybrid plasma reactor
US20130118589A1 (en) 2011-11-15 2013-05-16 Mks Instruments, Inc. Toroidal Plasma Channel with Varying Cross-Section Areas Along the Channel
WO2014007472A1 (en) 2012-07-03 2014-01-09 Plasmart Inc. Plasma generation apparatus and plasma generation method
US10316409B2 (en) * 2012-12-21 2019-06-11 Novellus Systems, Inc. Radical source design for remote plasma atomic layer deposition
US9653266B2 (en) * 2014-03-27 2017-05-16 Mks Instruments, Inc. Microwave plasma applicator with improved power uniformity
CN106605451A (zh) * 2014-09-12 2017-04-26 应用材料公司 用于处理半导体处理设备排放物的控制器
BR112017019368B1 (pt) 2015-03-11 2022-08-30 General Fusion Inc Câmara de compressão modular
KR102376982B1 (ko) * 2015-04-14 2022-03-21 삼성전자주식회사 세라믹을 이용하여 파티클 저감 효과를 가지는 원격 플라즈마 발생장치
KR102125028B1 (ko) * 2015-04-30 2020-06-19 (주) 엔피홀딩스 마그네틱 코어 냉각용 냉각키트 및 이를 구비한 플라즈마 반응기
KR102194085B1 (ko) * 2016-04-26 2020-12-22 어플라이드 머티어리얼스, 인코포레이티드 배출 퇴적물 제거를 위한 온도 제어식 원격 플라즈마 세정
US11837479B2 (en) * 2016-05-05 2023-12-05 Applied Materials, Inc. Advanced temperature control for wafer carrier in plasma processing chamber
US20190006154A1 (en) 2017-06-28 2019-01-03 Chaolin Hu Toroidal Plasma Chamber
US10329976B2 (en) * 2017-08-11 2019-06-25 Gm Global Technology Operations Llc. Non-thermal plasma/ozone-assisted catalytic system and use in exhaust systems

Also Published As

Publication number Publication date
KR20210009428A (ko) 2021-01-26
TW202017074A (zh) 2020-05-01
EP3785494A1 (en) 2021-03-03
EP3785494A4 (en) 2022-01-26
TWI809122B (zh) 2023-07-21
US20190385829A1 (en) 2019-12-19
CN112335342A (zh) 2021-02-05
WO2019241405A1 (en) 2019-12-19
US11114287B2 (en) 2021-09-07
JP2021530076A (ja) 2021-11-04
JP7301075B2 (ja) 2023-06-30
CN112335342B (zh) 2023-07-14

Similar Documents

Publication Publication Date Title
SG11202011069RA (en) Radical output monitor for a remote plasma source and method of use
EP3770757A4 (en) METHOD AND DEVICE FOR GENERATING A SEQUENCE OF ROBOT ACTIONS
IL267624A (en) A broadband light source device and a method for generating a broadband light pulse
EP3568738A4 (en) APPARATUS AND METHOD FOR MODIFYING A HAPTICAL OUTPUT OF A HAPTICAL DEVICE
EP3833184A4 (en) PROCEDURE FOR GENERATION OF STERILE AND MONOSEX PROGRESS
EP3245662A4 (en) Method for joint control of a power source and active filter
EP4008074A4 (en) HARQ-ACK FEEDBACK APPARATUS AND METHOD
IL283749A (en) Spray generator device and method for its operation
EP4030681A4 (en) METHOD AND DEVICE FOR REMOTE CERTIFICATION OF A COMBINED DEVICE
GB201915892D0 (en) Apparatus and method for controlling laser processing of a remote material
EP3823444A4 (en) METHOD OF GENERATION OF STERILE PROGENY
EP3854115A4 (en) EXCEPTIONAL PROCESS AND APPARATUS FOR THE MANAGEMENT OF REMOTE PROFILES
EP3678001A4 (en) METHOD AND DEVICE FOR CONTROLLING THE OUTPUT OF A REPORT
GB2580474B (en) An apparatus and a method of using the apparatus
EP3760579A4 (en) OZONE GENERATOR AND PROCESS FOR OZONE PRODUCTION
GB201809656D0 (en) A powder depostion apparatus and a method of using the same
GB2578926B (en) Power supply and method of operating a power amplifier
EP4055959A4 (en) METHOD AND APPARATUS FOR SINGLE COMMON BEAM BASED OPERATION
PT3635348T (pt) Procedimento e dispositivo para calibração de uma fonte de luz de um dispositivo médico
KR101922978B9 (ko) 입력 영상과 출력 영상의 교차 열람을 지원하는 방법 및 이를 이용한 장치
GB201706353D0 (en) Power tool apparatus and a method of use for the same
AU2018902188A0 (en) A method of treatment and prophylaxis
AU2018900306A0 (en) A method of treatment and prophylaxis
ZA201905153B (en) Vacuum apparatus and method of using same
GB2578483B (en) Trenching apparatus and a method of trenching