SG11202007053XA - Manufacturing method for semiconductor device, and adhesive film - Google Patents
Manufacturing method for semiconductor device, and adhesive filmInfo
- Publication number
- SG11202007053XA SG11202007053XA SG11202007053XA SG11202007053XA SG11202007053XA SG 11202007053X A SG11202007053X A SG 11202007053XA SG 11202007053X A SG11202007053X A SG 11202007053XA SG 11202007053X A SG11202007053X A SG 11202007053XA SG 11202007053X A SG11202007053X A SG 11202007053XA
- Authority
- SG
- Singapore
- Prior art keywords
- manufacturing
- semiconductor device
- adhesive film
- adhesive
- film
- Prior art date
Links
- 239000002313 adhesive film Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018013752A JP6977588B2 (ja) | 2018-01-30 | 2018-01-30 | 半導体装置の製造方法及び接着フィルム |
PCT/JP2019/003010 WO2019151260A1 (ja) | 2018-01-30 | 2019-01-29 | 半導体装置の製造方法及び接着フィルム |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202007053XA true SG11202007053XA (en) | 2020-08-28 |
Family
ID=67479794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202007053XA SG11202007053XA (en) | 2018-01-30 | 2019-01-29 | Manufacturing method for semiconductor device, and adhesive film |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6977588B2 (ja) |
KR (1) | KR102602489B1 (ja) |
CN (1) | CN111656500B (ja) |
SG (1) | SG11202007053XA (ja) |
TW (1) | TWI791751B (ja) |
WO (1) | WO2019151260A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7298404B2 (ja) * | 2019-09-06 | 2023-06-27 | 株式会社レゾナック | 半導体装置の製造方法 |
JP7427480B2 (ja) | 2020-03-09 | 2024-02-05 | キオクシア株式会社 | 半導体装置 |
JP2022036756A (ja) | 2020-08-24 | 2022-03-08 | キオクシア株式会社 | 半導体装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1209948C (zh) * | 2002-07-17 | 2005-07-06 | 威盛电子股份有限公司 | 嵌埋有ic芯片与无源元件的整合式模块板及其制作方法 |
JP2004217757A (ja) * | 2003-01-14 | 2004-08-05 | Hitachi Chem Co Ltd | 緩衝性カバーフィルムを備えた接着シートならびに半導体装置およびその製造方法 |
US7375370B2 (en) | 2004-08-05 | 2008-05-20 | The Trustees Of Princeton University | Stacked organic photosensitive devices |
JP5003090B2 (ja) * | 2006-10-06 | 2012-08-15 | 住友ベークライト株式会社 | 接着フィルムおよびこれを用いた半導体装置 |
US20100112272A1 (en) * | 2006-10-06 | 2010-05-06 | Sumitomo Bakelite Co., Ltd. | Film for use in manufacturing semiconductor devices, method for producing the film and semiconductor device |
JP5476673B2 (ja) * | 2007-04-02 | 2014-04-23 | 日立化成株式会社 | 接着シート |
US8232185B2 (en) * | 2007-04-05 | 2012-07-31 | Hitachi Chemical Company, Ltd. | Method for manufacturing semiconductor chip, adhesive film for semiconductor, and composite sheet using the film |
EP2200075A4 (en) * | 2007-10-09 | 2011-12-07 | Hitachi Chemical Co Ltd | METHOD FOR PRODUCING A SEMICONDUCTOR CHIP WITH A LONG-TERM FILM, A LONG-TERM FOR A SEMICONDUCTOR USED IN THE PROCESS, AND METHOD FOR PRODUCING A SEMICONDUCTOR CONSTRUCTION ELEMENT |
JP4994429B2 (ja) * | 2008-08-04 | 2012-08-08 | 日東電工株式会社 | ダイシング・ダイボンドフィルム |
JP2010254763A (ja) * | 2009-04-22 | 2010-11-11 | Hitachi Chem Co Ltd | 接着剤組成物、その製造方法、これを用いた接着シート、一体型シート、その製造方法、半導体装置及びその製造方法 |
JP2012089630A (ja) * | 2010-10-18 | 2012-05-10 | Sumitomo Bakelite Co Ltd | 半導体用フィルムおよび半導体装置 |
JP5736899B2 (ja) * | 2011-03-28 | 2015-06-17 | 日立化成株式会社 | フィルム状接着剤、接着シート及び半導体装置 |
JP5834662B2 (ja) * | 2011-09-13 | 2015-12-24 | 日立化成株式会社 | フィルム状接着剤、接着シート、半導体装置及びその製造方法 |
KR101953052B1 (ko) * | 2012-03-08 | 2019-02-27 | 히타치가세이가부시끼가이샤 | 접착시트 및 반도체 장치의 제조 방법 |
JP5924145B2 (ja) * | 2012-06-12 | 2016-05-25 | 日立化成株式会社 | フィルム状接着剤、接着シート、及び半導体装置の製造方法 |
JP6322026B2 (ja) * | 2014-03-31 | 2018-05-09 | 日東電工株式会社 | ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法 |
JP6670177B2 (ja) * | 2016-05-30 | 2020-03-18 | 日東電工株式会社 | ダイボンドフィルム、ダイシングダイボンドフィルム、及び、半導体装置の製造方法 |
JP6222395B1 (ja) * | 2017-08-07 | 2017-11-01 | 日立化成株式会社 | フィルム状接着剤及びダイシングダイボンディング一体型接着シート |
-
2018
- 2018-01-30 JP JP2018013752A patent/JP6977588B2/ja active Active
-
2019
- 2019-01-29 KR KR1020207021839A patent/KR102602489B1/ko active IP Right Grant
- 2019-01-29 WO PCT/JP2019/003010 patent/WO2019151260A1/ja active Application Filing
- 2019-01-29 SG SG11202007053XA patent/SG11202007053XA/en unknown
- 2019-01-29 CN CN201980010201.0A patent/CN111656500B/zh active Active
- 2019-01-30 TW TW108103596A patent/TWI791751B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN111656500B (zh) | 2023-08-15 |
WO2019151260A1 (ja) | 2019-08-08 |
CN111656500A (zh) | 2020-09-11 |
KR20200111703A (ko) | 2020-09-29 |
KR102602489B1 (ko) | 2023-11-16 |
TWI791751B (zh) | 2023-02-11 |
TW201941314A (zh) | 2019-10-16 |
JP6977588B2 (ja) | 2021-12-08 |
JP2019134020A (ja) | 2019-08-08 |
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