SG11201907886QA - Nonvolatile semiconductor storage device - Google Patents
Nonvolatile semiconductor storage deviceInfo
- Publication number
- SG11201907886QA SG11201907886QA SG11201907886QA SG11201907886QA SG 11201907886Q A SG11201907886Q A SG 11201907886QA SG 11201907886Q A SG11201907886Q A SG 11201907886QA SG 11201907886Q A SG11201907886Q A SG 11201907886QA
- Authority
- SG
- Singapore
- Prior art keywords
- bit line
- reading bit
- adjacent
- compared
- volatile semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0441—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
- G11C16/28—Sensing or reading circuits; Data output circuits using differential sensing or reference cells, e.g. dummy cells
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/08—Address circuits; Decoders; Word-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/24—Bit-line control circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/30—Power supply circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/40—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/60—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the control gate being a doped region, e.g. single-poly memory cell
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42364—Gate electrodes for field effect devices for field-effect transistors with insulated gate characterised by the insulating layer, e.g. thickness or uniformity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017059316A JP6276447B1 (ja) | 2017-03-24 | 2017-03-24 | 不揮発性半導体記憶装置 |
PCT/JP2018/003794 WO2018173513A1 (fr) | 2017-03-24 | 2018-02-05 | Dispositif de stockage à semi-conducteurs non volatil |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201907886QA true SG11201907886QA (en) | 2019-10-30 |
Family
ID=61158423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201907886Q SG11201907886QA (en) | 2017-03-24 | 2018-02-05 | Nonvolatile semiconductor storage device |
Country Status (8)
Country | Link |
---|---|
US (1) | US11127469B2 (fr) |
JP (1) | JP6276447B1 (fr) |
KR (1) | KR102540105B1 (fr) |
CN (1) | CN110419080B (fr) |
IL (1) | IL269012B2 (fr) |
SG (1) | SG11201907886QA (fr) |
TW (1) | TWI660354B (fr) |
WO (1) | WO2018173513A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10692557B1 (en) | 2019-04-11 | 2020-06-23 | Micron Technology, Inc. | Reference voltage management |
CN111402943B (zh) * | 2020-06-02 | 2020-09-04 | 深圳市芯天下技术有限公司 | 减少非型闪存读操作泵面积方法、系统、储存介质和终端 |
US11069743B1 (en) * | 2020-06-09 | 2021-07-20 | Globalfoundries Singapore Pte. Ltd. | Non-volatile memory elements with a multi-level cell configuration |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2554620B2 (ja) * | 1985-12-12 | 1996-11-13 | 株式会社東芝 | 不揮発性半導体記憶装置 |
US6903964B2 (en) * | 2002-06-28 | 2005-06-07 | Freescale Semiconductor, Inc. | MRAM architecture with electrically isolated read and write circuitry |
JP2005175411A (ja) | 2003-12-12 | 2005-06-30 | Genusion:Kk | 半導体装置、及びその製造方法 |
JP2006031795A (ja) * | 2004-07-14 | 2006-02-02 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
JP4683995B2 (ja) * | 2005-04-28 | 2011-05-18 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
JP4800109B2 (ja) | 2005-09-13 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7391647B2 (en) * | 2006-04-11 | 2008-06-24 | Mosys, Inc. | Non-volatile memory in CMOS logic process and method of operation thereof |
JP5556873B2 (ja) * | 2012-10-19 | 2014-07-23 | 株式会社フローディア | 不揮発性半導体記憶装置 |
JP6069137B2 (ja) * | 2013-09-04 | 2017-02-01 | 株式会社フローディア | 不揮発性半導体記憶装置 |
KR20150054225A (ko) * | 2013-11-11 | 2015-05-20 | 삼성전자주식회사 | 로직 임베디드 불휘발성 메모리 장치 |
JP6235901B2 (ja) | 2013-12-27 | 2017-11-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6280428B2 (ja) * | 2014-04-18 | 2018-02-14 | 株式会社フローディア | 不揮発性半導体記憶装置 |
KR102554495B1 (ko) * | 2016-01-22 | 2023-07-12 | 에스케이하이닉스 주식회사 | 수평적 커플링 구조를 갖는 불휘발성 메모리셀 및 이를 이용한 메모리 셀 어레이 |
-
2017
- 2017-03-24 JP JP2017059316A patent/JP6276447B1/ja active Active
-
2018
- 2018-02-05 CN CN201880000130.1A patent/CN110419080B/zh active Active
- 2018-02-05 WO PCT/JP2018/003794 patent/WO2018173513A1/fr active Application Filing
- 2018-02-05 KR KR1020187007224A patent/KR102540105B1/ko active IP Right Grant
- 2018-02-05 US US16/491,704 patent/US11127469B2/en active Active
- 2018-02-05 SG SG11201907886Q patent/SG11201907886QA/en unknown
- 2018-02-05 IL IL269012A patent/IL269012B2/en unknown
- 2018-02-22 TW TW107105944A patent/TWI660354B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP6276447B1 (ja) | 2018-02-07 |
KR102540105B1 (ko) | 2023-06-08 |
IL269012A (en) | 2019-10-31 |
IL269012B1 (en) | 2023-08-01 |
IL269012B2 (en) | 2023-12-01 |
CN110419080B (zh) | 2023-06-20 |
KR20190130465A (ko) | 2019-11-22 |
CN110419080A (zh) | 2019-11-05 |
US11127469B2 (en) | 2021-09-21 |
WO2018173513A1 (fr) | 2018-09-27 |
TWI660354B (zh) | 2019-05-21 |
US20200075105A1 (en) | 2020-03-05 |
JP2018163711A (ja) | 2018-10-18 |
TW201835925A (zh) | 2018-10-01 |
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