SG11201906425RA - System and method for measuring substrate and film thickness distribution - Google Patents

System and method for measuring substrate and film thickness distribution

Info

Publication number
SG11201906425RA
SG11201906425RA SG11201906425RA SG11201906425RA SG11201906425RA SG 11201906425R A SG11201906425R A SG 11201906425RA SG 11201906425R A SG11201906425R A SG 11201906425RA SG 11201906425R A SG11201906425R A SG 11201906425RA SG 11201906425R A SG11201906425R A SG 11201906425RA
Authority
SG
Singapore
Prior art keywords
substrate
international
mass sensor
mass
thickness distribution
Prior art date
Application number
SG11201906425RA
Other languages
English (en)
Inventor
Dengpeng Chen
Andrew Zeng
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201906425RA publication Critical patent/SG11201906425RA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02001—Interferometers characterised by controlling or generating intrinsic radiation properties
    • G01B9/02007—Two or more frequencies or sources used for interferometric measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2290/00—Aspects of interferometers not specifically covered by any group under G01B9/02
    • G01B2290/70—Using polarization in the interferometer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Signal Processing (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201906425RA 2017-02-08 2018-02-07 System and method for measuring substrate and film thickness distribution SG11201906425RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762456651P 2017-02-08 2017-02-08
US15/622,629 US10236222B2 (en) 2017-02-08 2017-06-14 System and method for measuring substrate and film thickness distribution
PCT/US2018/017255 WO2018148303A1 (en) 2017-02-08 2018-02-07 System and method for measuring substrate and film thickness distribution

Publications (1)

Publication Number Publication Date
SG11201906425RA true SG11201906425RA (en) 2019-08-27

Family

ID=63037971

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201906425RA SG11201906425RA (en) 2017-02-08 2018-02-07 System and method for measuring substrate and film thickness distribution

Country Status (7)

Country Link
US (1) US10236222B2 (ja)
EP (1) EP3551964A4 (ja)
JP (1) JP7114630B2 (ja)
KR (1) KR102518197B1 (ja)
CN (2) CN110312911B (ja)
SG (1) SG11201906425RA (ja)
WO (1) WO2018148303A1 (ja)

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US10236222B2 (en) * 2017-02-08 2019-03-19 Kla-Tencor Corporation System and method for measuring substrate and film thickness distribution
US10989652B2 (en) * 2017-09-06 2021-04-27 Lam Research Corporation Systems and methods for combining optical metrology with mass metrology
JP6959191B2 (ja) * 2018-07-25 2021-11-02 旭化成エレクトロニクス株式会社 学習処理装置、学習処理方法、化合物半導体の製造方法、および、プログラム
US20220120559A1 (en) * 2019-12-26 2022-04-21 Nanjing LiAn Semiconductor Limited Measuring apparatus and method of wafer geometry
EP3996130B1 (de) * 2020-11-09 2023-03-08 Siltronic AG Verfahren zum abscheiden einer epitaktischen schicht auf einer substratscheibe
CN113203357B (zh) * 2021-04-09 2022-08-09 中国科学院上海光学精密机械研究所 一种双侧斐索干涉仪检测装置
US20230169643A1 (en) * 2021-11-30 2023-06-01 Applied Materials, Inc. Monitoring of deposited or etched film thickness using image-based mass distribution metrology
KR20230136489A (ko) * 2022-03-18 2023-09-26 덕우전자주식회사 이차전지 벤트캡의 노치두께 측정장치

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US5416594A (en) 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
US5625170A (en) 1994-01-18 1997-04-29 Nanometrics Incorporated Precision weighing to monitor the thickness and uniformity of deposited or etched thin film
DE19602445A1 (de) 1996-01-24 1997-07-31 Nanopro Luftlager Produktions Vorrichtung und Verfahren zum Vermessen von zwei einander gegenüberliegenden Oberflächen eines Körpers
US6950193B1 (en) * 1997-10-28 2005-09-27 Rockwell Automation Technologies, Inc. System for monitoring substrate conditions
WO1999054924A1 (fr) 1998-04-21 1999-10-28 Hitachi, Ltd. Dispositif et procede permettant de mesurer l'epaisseur d'un film mince, et procede et dispositif de production d'un film mince utilisant les premiers
US6038028A (en) 1998-08-26 2000-03-14 Lockheed Martin Energy Research Corp. High-speed non-contact measuring apparatus for gauging the thickness of moving sheet material
US6284986B1 (en) * 1999-03-15 2001-09-04 Seh America, Inc. Method of determining the thickness of a layer on a silicon substrate
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US7057741B1 (en) 1999-06-18 2006-06-06 Kla-Tencor Corporation Reduced coherence symmetric grazing incidence differential interferometer
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Also Published As

Publication number Publication date
WO2018148303A1 (en) 2018-08-16
JP7114630B2 (ja) 2022-08-08
JP2020506558A (ja) 2020-02-27
US20180226304A1 (en) 2018-08-09
CN110312911A (zh) 2019-10-08
CN113847892A (zh) 2021-12-28
KR102518197B1 (ko) 2023-04-04
EP3551964A1 (en) 2019-10-16
US10236222B2 (en) 2019-03-19
CN110312911B (zh) 2021-10-15
KR20190107171A (ko) 2019-09-18
EP3551964A4 (en) 2020-05-27

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