SG11201903365SA - Elastic wave device with sub-wavelength thick piezoelectric layer - Google Patents
Elastic wave device with sub-wavelength thick piezoelectric layerInfo
- Publication number
- SG11201903365SA SG11201903365SA SG11201903365SA SG11201903365SA SG11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA SG 11201903365S A SG11201903365S A SG 11201903365SA
- Authority
- SG
- Singapore
- Prior art keywords
- elastic wave
- international
- layer
- osaka
- sub
- Prior art date
Links
- VQKFNUFAXTZWDK-UHFFFAOYSA-N alpha-methylfuran Natural products CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 abstract 3
- 230000008520 organization Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6489—Compensation of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662410804P | 2016-10-20 | 2016-10-20 | |
US201662423705P | 2016-11-17 | 2016-11-17 | |
PCT/US2017/057256 WO2018075682A1 (en) | 2016-10-20 | 2017-10-18 | Elastic wave device with sub-wavelength thick piezoelectric layer |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201903365SA true SG11201903365SA (en) | 2019-05-30 |
Family
ID=62019519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201903365SA SG11201903365SA (en) | 2016-10-20 | 2017-10-18 | Elastic wave device with sub-wavelength thick piezoelectric layer |
Country Status (9)
Country | Link |
---|---|
US (3) | US20180159494A1 (ja) |
JP (1) | JP2018074575A (ja) |
KR (1) | KR20190058680A (ja) |
CN (1) | CN109891612A (ja) |
DE (1) | DE112017005316B4 (ja) |
GB (2) | GB2600838A (ja) |
SG (1) | SG11201903365SA (ja) |
TW (1) | TWI752102B (ja) |
WO (1) | WO2018075682A1 (ja) |
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CN107431478B (zh) * | 2015-04-01 | 2020-10-13 | 株式会社村田制作所 | 双工器 |
US20180159494A1 (en) | 2016-10-20 | 2018-06-07 | Skyworks Solutions, Inc. | Elastic wave device with sub-wavelength thick piezoelectric layer |
WO2018116602A1 (ja) * | 2016-12-20 | 2018-06-28 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
US10594292B2 (en) * | 2017-01-30 | 2020-03-17 | Huawei Technologies Co., Ltd. | Surface acoustic wave device |
KR102294238B1 (ko) * | 2017-03-09 | 2021-08-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치, 탄성파 장치 패키지, 멀티플렉서, 고주파 프론트 엔드 회로 및 통신 장치 |
WO2018198952A1 (ja) * | 2017-04-24 | 2018-11-01 | 株式会社村田製作所 | フィルタ装置およびその製造方法 |
US11070193B2 (en) * | 2017-11-24 | 2021-07-20 | Murata Manufacturing Co., Ltd. | Elastic wave device, radio-frequency front-end circuit, and communication device |
JP7068835B2 (ja) | 2018-01-26 | 2022-05-17 | 太陽誘電株式会社 | 弾性波デバイス、フィルタおよびマルチプレクサ |
WO2019172032A1 (ja) * | 2018-03-08 | 2019-09-12 | 株式会社村田製作所 | マルチプレクサ、高周波フロントエンド回路および通信装置 |
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TWI748497B (zh) * | 2019-06-12 | 2021-12-01 | 美商特拉華公司 | 電極界定未懸掛之聲波共振器 |
CN110138356B (zh) * | 2019-06-28 | 2020-11-06 | 中国科学院上海微系统与信息技术研究所 | 一种高频声表面波谐振器及其制备方法 |
DE102019119239A1 (de) * | 2019-07-16 | 2021-01-21 | RF360 Europe GmbH | Multiplexer |
KR20220051245A (ko) * | 2019-09-27 | 2022-04-26 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
CN114430885A (zh) * | 2019-09-27 | 2022-05-03 | 株式会社村田制作所 | 弹性波装置以及滤波器装置 |
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WO2021200835A1 (ja) * | 2020-03-30 | 2021-10-07 | 株式会社村田製作所 | 弾性波装置 |
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KR102358899B1 (ko) * | 2017-12-08 | 2022-02-08 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
CN113454912B (zh) * | 2019-03-11 | 2024-02-23 | 株式会社村田制作所 | 弹性波装置 |
JP7426991B2 (ja) * | 2019-04-08 | 2024-02-02 | 株式会社村田製作所 | 弾性波装置及びマルチプレクサ |
US11811392B2 (en) * | 2019-10-23 | 2023-11-07 | Skyworks Solutions, Inc. | Surface acoustic wave resonator with suppressed transverse modes using selective dielectric removal |
US11870421B2 (en) * | 2019-10-23 | 2024-01-09 | Skyworks Solutions, Inc. | Surface acoustic wave resonator with suppressed transverse modes using second bus bar |
US20230028925A1 (en) * | 2021-07-23 | 2023-01-26 | Skyworks Solutions, Inc. | Multilayer piezoelectric substrate device with reduced piezoelectric material cut angle |
-
2017
- 2017-10-18 US US15/787,568 patent/US20180159494A1/en not_active Abandoned
- 2017-10-18 DE DE112017005316.1T patent/DE112017005316B4/de active Active
- 2017-10-18 US US15/787,596 patent/US10778181B2/en active Active
- 2017-10-18 SG SG11201903365SA patent/SG11201903365SA/en unknown
- 2017-10-18 WO PCT/US2017/057256 patent/WO2018075682A1/en active Application Filing
- 2017-10-18 GB GB2118878.4A patent/GB2600838A/en not_active Withdrawn
- 2017-10-18 GB GB1905101.0A patent/GB2569082A/en not_active Withdrawn
- 2017-10-18 KR KR1020197014259A patent/KR20190058680A/ko unknown
- 2017-10-18 CN CN201780064907.6A patent/CN109891612A/zh active Pending
- 2017-10-19 JP JP2017202561A patent/JP2018074575A/ja active Pending
- 2017-10-20 TW TW106136258A patent/TWI752102B/zh active
-
2020
- 2020-08-03 US US16/983,472 patent/US11996821B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE112017005316T5 (de) | 2019-07-18 |
JP2018074575A (ja) | 2018-05-10 |
WO2018075682A1 (en) | 2018-04-26 |
US10778181B2 (en) | 2020-09-15 |
CN109891612A (zh) | 2019-06-14 |
US20180159494A1 (en) | 2018-06-07 |
US20180159507A1 (en) | 2018-06-07 |
GB2600838A (en) | 2022-05-11 |
DE112017005316B4 (de) | 2021-08-05 |
US20210050840A1 (en) | 2021-02-18 |
GB202118878D0 (en) | 2022-02-09 |
US11996821B2 (en) | 2024-05-28 |
GB2569082A (en) | 2019-06-05 |
TW201830740A (zh) | 2018-08-16 |
GB201905101D0 (en) | 2019-05-22 |
KR20190058680A (ko) | 2019-05-29 |
TWI752102B (zh) | 2022-01-11 |
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