SG11201811130YA - Film formation method - Google Patents
Film formation methodInfo
- Publication number
- SG11201811130YA SG11201811130YA SG11201811130YA SG11201811130YA SG11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA SG 11201811130Y A SG11201811130Y A SG 11201811130YA
- Authority
- SG
- Singapore
- Prior art keywords
- film
- film formation
- formation method
- forming
- catalyst
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 4
- 238000007747 plating Methods 0.000 abstract 4
- 239000003054 catalyst Substances 0.000 abstract 3
- 229910052763 palladium Inorganic materials 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1841—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016116993A JP6329589B2 (ja) | 2016-06-13 | 2016-06-13 | 皮膜形成方法 |
PCT/JP2017/016793 WO2017217125A1 (ja) | 2016-06-13 | 2017-04-27 | 皮膜形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201811130YA true SG11201811130YA (en) | 2019-01-30 |
Family
ID=60663560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201811130YA SG11201811130YA (en) | 2016-06-13 | 2017-04-27 | Film formation method |
Country Status (9)
Country | Link |
---|---|
US (1) | US10941493B2 (zh) |
EP (1) | EP3470546B1 (zh) |
JP (1) | JP6329589B2 (zh) |
KR (1) | KR102230083B1 (zh) |
CN (1) | CN109312463B (zh) |
MY (1) | MY186814A (zh) |
SG (1) | SG11201811130YA (zh) |
TW (1) | TWI693303B (zh) |
WO (1) | WO2017217125A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6811041B2 (ja) * | 2016-07-04 | 2021-01-13 | 上村工業株式会社 | 無電解白金めっき浴 |
JP6572376B1 (ja) | 2018-11-30 | 2019-09-11 | 上村工業株式会社 | 無電解めっき浴 |
JP7285123B2 (ja) * | 2019-04-10 | 2023-06-01 | 上村工業株式会社 | 金めっき方法及びめっき皮膜 |
CN110204885B (zh) * | 2019-05-24 | 2021-02-12 | 合肥安利聚氨酯新材料有限公司 | 一种无溶剂聚氨酯树脂皮膜及其制备方法和鞋革 |
JP6754151B1 (ja) | 2020-02-18 | 2020-09-09 | 日本高純度化学株式会社 | めっき積層体 |
JP6754152B1 (ja) * | 2020-02-18 | 2020-09-09 | 日本高純度化学株式会社 | めっき積層体 |
WO2022239017A1 (en) * | 2021-05-09 | 2022-11-17 | Prerna Goradia | Novel methodology for coating non-conducting articles with broad-spectrum antimicrobial electroless plating layers |
TWI824612B (zh) * | 2022-07-11 | 2023-12-01 | 台灣上村股份有限公司 | 金鈀金鍍膜結構及其製作方法 |
KR102666518B1 (ko) * | 2023-08-31 | 2024-05-21 | (주)엠케이켐앤텍 | 반도체 패키지용 기판 및 이를 포함하는 반도체 패키지 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54117329A (en) * | 1978-03-06 | 1979-09-12 | Ngk Spark Plug Co | Electroless plating method |
JPH05327187A (ja) * | 1992-05-18 | 1993-12-10 | Ishihara Chem Co Ltd | プリント配線板及びその製造法 |
JP3345529B2 (ja) * | 1995-06-20 | 2002-11-18 | 日立化成工業株式会社 | ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法 |
JP3466521B2 (ja) | 1999-10-04 | 2003-11-10 | 新光電気工業株式会社 | 置換型無電解金めっき液及び無電解金めっき方法 |
DE10048844A1 (de) * | 2000-10-02 | 2002-04-11 | Basf Ag | Verfahren zur Herstellung von Platinmetall-Katalysatoren |
JP3866164B2 (ja) * | 2002-07-05 | 2007-01-10 | 京セラ株式会社 | 配線基板 |
JP3994279B2 (ja) * | 2002-10-21 | 2007-10-17 | 奥野製薬工業株式会社 | 無電解金めっき液 |
KR100749992B1 (ko) * | 2003-06-10 | 2007-08-16 | 닛코킨조쿠 가부시키가이샤 | 무전해 금도금액 |
JP2005054267A (ja) * | 2003-07-24 | 2005-03-03 | Electroplating Eng Of Japan Co | 無電解金めっき方法 |
JP2005317729A (ja) | 2004-04-28 | 2005-11-10 | Hitachi Chem Co Ltd | 接続端子、その接続端子を用いた半導体パッケージ及び半導体パッケージの製造方法 |
KR100688833B1 (ko) * | 2005-10-25 | 2007-03-02 | 삼성전기주식회사 | 인쇄회로기판의 도금층 형성방법 및 이로부터 제조된인쇄회로기판 |
JP5526459B2 (ja) | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
JP5526458B2 (ja) * | 2006-12-06 | 2014-06-18 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
JP2008184679A (ja) * | 2007-01-31 | 2008-08-14 | Okuno Chem Ind Co Ltd | 無電解パラジウムめっき用活性化組成物 |
EP2141556B1 (fr) | 2008-07-03 | 2012-06-27 | ETA SA Manufacture Horlogère Suisse | Mécanisme de quantième pour pièce d'horlogerie |
WO2010004856A1 (ja) | 2008-07-08 | 2010-01-14 | 日本高純度化学株式会社 | パラジウムめっき用触媒付与液 |
JP2011243790A (ja) * | 2010-05-19 | 2011-12-01 | Panasonic Electric Works Co Ltd | 配線方法、並びに、表面に配線が設けられた構造物、半導体装置、配線基板、メモリカード、電気デバイス、モジュール及び多層回路基板 |
JP5517302B2 (ja) * | 2010-08-31 | 2014-06-11 | 奥野製薬工業株式会社 | 無電解めっきの前処理方法 |
CN102605359A (zh) * | 2011-01-25 | 2012-07-25 | 台湾上村股份有限公司 | 化学钯金镀膜结构及其制作方法、铜线或钯铜线接合的钯金镀膜封装结构及其封装工艺 |
JP5983336B2 (ja) * | 2011-11-17 | 2016-08-31 | Tdk株式会社 | 被覆体及び電子部品 |
KR20130056629A (ko) * | 2011-11-22 | 2013-05-30 | 삼성전기주식회사 | 기판 및 이의 제조방법 |
EP2642594B1 (en) | 2012-03-22 | 2018-09-05 | Avago Technologies General IP (Singapore) Pte. Ltd. | Programmable antenna having a programmable substrate |
KR20140043955A (ko) * | 2012-09-21 | 2014-04-14 | 삼성전기주식회사 | 전극 패드, 이를 이용한 인쇄 회로 기판 및 그의 제조 방법 |
-
2016
- 2016-06-13 JP JP2016116993A patent/JP6329589B2/ja active Active
-
2017
- 2017-04-27 US US16/307,418 patent/US10941493B2/en active Active
- 2017-04-27 SG SG11201811130YA patent/SG11201811130YA/en unknown
- 2017-04-27 WO PCT/JP2017/016793 patent/WO2017217125A1/ja unknown
- 2017-04-27 EP EP17813030.8A patent/EP3470546B1/en active Active
- 2017-04-27 KR KR1020187035662A patent/KR102230083B1/ko active IP Right Grant
- 2017-04-27 CN CN201780034651.4A patent/CN109312463B/zh active Active
- 2017-04-27 MY MYPI2018002430A patent/MY186814A/en unknown
- 2017-05-12 TW TW106115795A patent/TWI693303B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR102230083B1 (ko) | 2021-03-22 |
KR20190008284A (ko) | 2019-01-23 |
CN109312463A (zh) | 2019-02-05 |
JP2017222891A (ja) | 2017-12-21 |
JP6329589B2 (ja) | 2018-05-23 |
EP3470546A1 (en) | 2019-04-17 |
WO2017217125A1 (ja) | 2017-12-21 |
EP3470546A4 (en) | 2019-05-08 |
TWI693303B (zh) | 2020-05-11 |
US20190345612A1 (en) | 2019-11-14 |
TW201819681A (zh) | 2018-06-01 |
MY186814A (en) | 2021-08-23 |
US10941493B2 (en) | 2021-03-09 |
CN109312463B (zh) | 2021-05-14 |
EP3470546B1 (en) | 2021-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201811130YA (en) | Film formation method | |
EP3505491A4 (en) | COMPOUND, PRODUCTION METHOD THEREOF, AND HYDROGEN SUPPLY METHOD | |
TW201612629A (en) | Non-chemically amplified resist composition, non-chemically amplified resist film, pattern forming method, and method for manufacturing electronic device | |
EP3693425A4 (en) | COATING LIQUID, AND COATING FILM AS WELL AS THE METHOD FOR MANUFACTURING THE SAME | |
EP3642376A4 (en) | IRON-BASED ALLOY TO PROVIDE A HARD AND WEAR RESISTANT COATING ON A SUBSTRATE, ARTICLE WITH A HARD AND WEAR RESISTANT COATING AND MANUFACTURING METHOD FOR IT | |
TW201612153A (en) | Producing method of (R)-1,1,3-trimethyl-4-aminoindane | |
EA201791376A1 (ru) | Способ получения пластмассовой монтажной детали для транспортного средства | |
WO2020127145A3 (de) | Materialien für elektronische vorrichtungen | |
MY182700A (en) | Self-assembly patterning for fabricating thin-film devices | |
MY188980A (en) | Method for die and clip attachment | |
EP3432369A4 (en) | MODEL, ULTRAVIOLET SEMICONDUCTOR LIGHT EMITTING ELEMENT, AND METHOD FOR PRODUCING THE MODEL | |
EP3653762A4 (en) | Semiconductor substrate, semiconductor component and method for the production of a semiconductor substrate | |
MX2019002692A (es) | Metodo para manufacturar un patron insoluble en agua. | |
TW201612137A (en) | Method for producing double-sided metallized ceramic substrates | |
ITMI20130954A1 (it) | Elementro strutturale con contatto passante e procedimento per la relativa produzione | |
EP3650215A4 (en) | RESIN-COATED METAL SHEET AND METAL BOX PRODUCED BY PROCESSING SUCH RESIN-COATED METAL SHEET | |
EP3467147A4 (en) | RESIN SUBSTRATE WITH COATING, PRODUCTION METHOD THEREFOR AND COATING FORMING METHOD | |
EP4397183A3 (en) | Use of a biopolymer for reducing the formation of a biofilm | |
MY193435A (en) | A polymer composition for applications comprising a layer element | |
MX2017005084A (es) | Barrera de manchas de laminado y tubo. | |
WO2019038589A3 (de) | Druckplatte | |
SA518392272B1 (ar) | منتج شبه مكتمل، طريقة إنتاجه واستخدامه | |
EP3715868A4 (en) | DETECTION SUBSTRATE, ARRANGEMENT AND METHOD FOR MANUFACTURING A DETECTION SUBSTRATE | |
EP3629367A4 (en) | SUBSTRATE MODULE, AND SUBSTRATE MODULE PRODUCTION PROCESS | |
EP3597667A4 (en) | EMULSION, PROCESS FOR PRODUCTION AND PROCESS FOR FORMING A COATING LAYER USING IT |