SG11201801665TA - Phosphorus-containing copper powder and method for producing the same - Google Patents

Phosphorus-containing copper powder and method for producing the same

Info

Publication number
SG11201801665TA
SG11201801665TA SG11201801665TA SG11201801665TA SG11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA SG 11201801665T A SG11201801665T A SG 11201801665TA
Authority
SG
Singapore
Prior art keywords
phosphorus
producing
same
copper powder
containing copper
Prior art date
Application number
SG11201801665TA
Other languages
English (en)
Inventor
Kenichi Inoue
Atsushi Ebara
Masahiro Yoshida
Kyoso MASUDA
Takahiro Yamada
Shinichi Uchiyama
Original Assignee
Dowa Electronics Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Electronics Materials Co Ltd filed Critical Dowa Electronics Materials Co Ltd
Priority claimed from PCT/JP2016/074076 external-priority patent/WO2017038478A1/ja
Publication of SG11201801665TA publication Critical patent/SG11201801665TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2304/00—Physical aspects of the powder
    • B22F2304/10—Micron size particles, i.e. above 1 micrometer up to 500 micrometer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29147—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29186—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/29187—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
SG11201801665TA 2015-09-03 2016-08-18 Phosphorus-containing copper powder and method for producing the same SG11201801665TA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015173730 2015-09-03
JP2016160289A JP6807681B2 (ja) 2015-09-03 2016-08-18 りん含有銅粉およびその製造方法
PCT/JP2016/074076 WO2017038478A1 (ja) 2015-09-03 2016-08-18 りん含有銅粉およびその製造方法

Publications (1)

Publication Number Publication Date
SG11201801665TA true SG11201801665TA (en) 2018-03-28

Family

ID=58278906

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201801665TA SG11201801665TA (en) 2015-09-03 2016-08-18 Phosphorus-containing copper powder and method for producing the same

Country Status (7)

Country Link
US (1) US10773311B2 (ja)
EP (1) EP3345696B1 (ja)
JP (1) JP6807681B2 (ja)
KR (1) KR102404788B1 (ja)
CN (1) CN107921532B (ja)
SG (1) SG11201801665TA (ja)
TW (1) TWI689604B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10773311B2 (en) * 2015-09-03 2020-09-15 Dowa Electronics Materials Co., Ltd. Phosphorus-containing copper powder and method for producing the same
CN110740827B (zh) * 2017-06-21 2022-03-01 福田金属箔粉工业株式会社 层压成形用铜粉末以及层压成形产品
JP2019031735A (ja) * 2017-08-07 2019-02-28 Ｄｏｗａエレクトロニクス株式会社 表面処理銀被覆合金粉末、該粉末の製造方法、導電性ペースト、電子部品及び電気装置
CN110052617A (zh) * 2018-01-17 2019-07-26 昆山磁通新材料科技有限公司 一种低氧含量水雾化金属粉末的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0699731B2 (ja) * 1986-10-14 1994-12-07 株式会社クボタ Ａｌ，Ｍｇ系金属急冷凝固粉末の成型法
JPH05195024A (ja) * 1992-01-14 1993-08-03 Nippon Steel Corp 金属粉末製造における金属粉末の酸化防止方法
US5605585A (en) * 1993-07-15 1997-02-25 Matsushita Electric Industrial Co., Ltd. Method for producing hydrogen storage alloy particles and sealed-type nickel-metal hydride storage battery using the same
JP2920343B2 (ja) * 1993-10-25 1999-07-19 松下電器産業株式会社 水素吸蔵合金粉末およびその水素吸蔵合金粉末を負極活物質に有するニッケル水素電池ならびに水素吸蔵合金粉末の製造方法
JP3984534B2 (ja) * 2002-11-19 2007-10-03 三井金属鉱業株式会社 導電性ペースト用の銅粉及びその製造方法
US20050106435A1 (en) * 2003-11-13 2005-05-19 Jang Bor Z. Twin-wire arc deposited electrode, solid electrolyte membrane, membrane electrode assembly and fuel cell
JP4158713B2 (ja) 2004-02-03 2008-10-01 住友金属鉱山株式会社 外部電極用銅ペースト組成物
JP4888769B2 (ja) * 2006-10-16 2012-02-29 新東工業株式会社 銅粉末およびその製造方法
US20100192728A1 (en) * 2007-06-28 2010-08-05 Nippon Mining & Metals Co., Ltd. Spherical Copper Fine Powder and Process for Producing the Same
JP5392884B2 (ja) * 2007-09-21 2014-01-22 三井金属鉱業株式会社 銅粉の製造方法
JP2011006740A (ja) * 2009-06-25 2011-01-13 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
JP5932638B2 (ja) * 2010-05-19 2016-06-08 三井金属鉱業株式会社 導電性ペースト用銅粉及び導電性ペースト
JP5785433B2 (ja) * 2011-04-28 2015-09-30 三井金属鉱業株式会社 低炭素銅粒子
KR101918323B1 (ko) * 2011-05-18 2018-11-13 도다 고교 가부시끼가이샤 구리 분말, 구리 페이스트, 도전성 도막의 제조 방법 및 도전성 도막
CN102398040A (zh) * 2011-12-07 2012-04-04 昆山德泰新材料科技有限公司 一种超低松比铜粉的雾化生产方法
JP2014077101A (ja) 2012-10-12 2014-05-01 Hitachi Chemical Co Ltd リン含有銅合金粒子を用いた接着剤組成物及びそれを用いた半導体装置
US10773311B2 (en) * 2015-09-03 2020-09-15 Dowa Electronics Materials Co., Ltd. Phosphorus-containing copper powder and method for producing the same

Also Published As

Publication number Publication date
KR102404788B1 (ko) 2022-06-02
EP3345696A4 (en) 2019-03-20
US10773311B2 (en) 2020-09-15
TWI689604B (zh) 2020-04-01
EP3345696B1 (en) 2023-06-07
US20180243831A1 (en) 2018-08-30
KR20180048980A (ko) 2018-05-10
CN107921532B (zh) 2020-05-08
EP3345696A1 (en) 2018-07-11
TW201715048A (zh) 2017-05-01
EP3345696C0 (en) 2023-06-07
CN107921532A (zh) 2018-04-17
JP6807681B2 (ja) 2021-01-06
JP2017048461A (ja) 2017-03-09

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