SG11201709647YA - Exposure device - Google Patents

Exposure device

Info

Publication number
SG11201709647YA
SG11201709647YA SG11201709647YA SG11201709647YA SG11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA
Authority
SG
Singapore
Prior art keywords
exposure device
exposure
Prior art date
Application number
SG11201709647YA
Other languages
English (en)
Inventor
Jinglu Sun
Jian Zhou
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201709647YA publication Critical patent/SG11201709647YA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G02B7/005—Motorised alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2045—Exposure; Apparatus therefor using originals with apertures, e.g. stencil exposure masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Lenses (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Lens Barrels (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
SG11201709647YA 2015-05-24 2016-05-19 Exposure device SG11201709647YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510268841.5A CN106292188B (zh) 2015-05-24 2015-05-24 曝光装置
PCT/CN2016/082583 WO2016188358A1 (zh) 2015-05-24 2016-05-19 曝光装置

Publications (1)

Publication Number Publication Date
SG11201709647YA true SG11201709647YA (en) 2017-12-28

Family

ID=57392471

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709647YA SG11201709647YA (en) 2015-05-24 2016-05-19 Exposure device

Country Status (7)

Country Link
US (1) US10197921B2 (zh)
JP (1) JP6505947B2 (zh)
KR (1) KR102048619B1 (zh)
CN (1) CN106292188B (zh)
SG (1) SG11201709647YA (zh)
TW (1) TWI611273B (zh)
WO (1) WO2016188358A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107885041B (zh) * 2016-09-30 2019-08-23 上海微电子装备（集团）股份有限公司 一种大视场曝光系统
DE102017115365B4 (de) 2017-07-10 2020-10-15 Carl Zeiss Smt Gmbh Inspektionsvorrichtung für Masken für die Halbleiterlithographie und Verfahren

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3477838B2 (ja) * 1993-11-11 2003-12-10 株式会社ニコン 走査型露光装置及び露光方法
JP3564735B2 (ja) * 1994-06-16 2004-09-15 株式会社ニコン 走査型露光装置及び露光方法
JP3617657B2 (ja) * 1995-11-13 2005-02-09 株式会社ニコン 位置ずれ補正方法
JP2001215717A (ja) * 2000-02-02 2001-08-10 Nikon Corp 走査露光方法および走査型露光装置
US6873400B2 (en) * 2000-02-02 2005-03-29 Nikon Corporation Scanning exposure method and system
JP2003031462A (ja) * 2001-07-12 2003-01-31 Nikon Corp 露光方法及び露光装置
JP4211272B2 (ja) * 2002-04-12 2009-01-21 株式会社ニコン 露光装置及び露光方法
JP2004335640A (ja) * 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd 投影露光装置
CN100549835C (zh) 2005-01-25 2009-10-14 株式会社尼康 曝光装置与曝光方法以及微元件的制造方法
JP2006261155A (ja) * 2005-03-15 2006-09-28 Fuji Photo Film Co Ltd 露光装置及び露光方法
CN100524038C (zh) 2006-08-03 2009-08-05 上海华虹Nec电子有限公司 用于测量光刻机像场弯曲分布的装置和方法
JP5245261B2 (ja) * 2007-03-02 2013-07-24 株式会社ニコン 走査型露光装置、露光方法、及びデバイスの製造方法
DE102008001892A1 (de) * 2008-05-21 2009-11-26 Carl Zeiss Smt Ag Optisches System für die Mikrolithographie
JP2010039347A (ja) * 2008-08-07 2010-02-18 Mejiro Precision:Kk 投影露光装置
JP5536401B2 (ja) 2008-10-16 2014-07-02 ギガフォトン株式会社 レーザ装置および極端紫外光光源装置
JP5704525B2 (ja) * 2010-08-19 2015-04-22 株式会社ブイ・テクノロジー マイクロレンズアレイを使用したスキャン露光装置
JP5815869B2 (ja) * 2011-08-30 2015-11-17 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置、リソグラフィ装置のセットアップ方法、及びデバイス製造方法
JP2013130642A (ja) * 2011-12-20 2013-07-04 Nikon Corp 露光方法、デバイス製造方法及び露光装置
JP2013219089A (ja) * 2012-04-04 2013-10-24 Canon Inc 光学系、露光装置、およびデバイス製造方法
CN203444239U (zh) * 2013-07-12 2014-02-19 上海微电子装备有限公司 焦面调整装置
CN105549327B (zh) 2014-10-29 2018-03-02 上海微电子装备（集团）股份有限公司 曝光装置的调整装置及调整方法

Also Published As

Publication number Publication date
TWI611273B (zh) 2018-01-11
JP6505947B2 (ja) 2019-04-24
KR20180008713A (ko) 2018-01-24
CN106292188A (zh) 2017-01-04
JP2018522287A (ja) 2018-08-09
US20180157177A1 (en) 2018-06-07
WO2016188358A1 (zh) 2016-12-01
US10197921B2 (en) 2019-02-05
TW201642047A (zh) 2016-12-01
KR102048619B1 (ko) 2019-11-25
CN106292188B (zh) 2019-01-18

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