SG11201709647YA - Exposure device - Google Patents

Exposure device

Info

Publication number
SG11201709647YA
SG11201709647YA SG11201709647YA SG11201709647YA SG11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA SG 11201709647Y A SG11201709647Y A SG 11201709647YA
Authority
SG
Singapore
Prior art keywords
exposure device
exposure
Prior art date
Application number
SG11201709647YA
Inventor
Jinglu Sun
Jian Zhou
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201709647YA publication Critical patent/SG11201709647YA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70475—Stitching, i.e. connecting image fields to produce a device field, the field occupied by a device such as a memory chip, processor chip, CCD, flat panel display
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/003—Alignment of optical elements
    • G02B7/005—Motorised alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2045—Exposure; Apparatus therefor using originals with apertures, e.g. stencil exposure masks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
SG11201709647YA 2015-05-24 2016-05-19 Exposure device SG11201709647YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510268841.5A CN106292188B (en) 2015-05-24 2015-05-24 Exposure device
PCT/CN2016/082583 WO2016188358A1 (en) 2015-05-24 2016-05-19 Exposure device

Publications (1)

Publication Number Publication Date
SG11201709647YA true SG11201709647YA (en) 2017-12-28

Family

ID=57392471

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201709647YA SG11201709647YA (en) 2015-05-24 2016-05-19 Exposure device

Country Status (7)

Country Link
US (1) US10197921B2 (en)
JP (1) JP6505947B2 (en)
KR (1) KR102048619B1 (en)
CN (1) CN106292188B (en)
SG (1) SG11201709647YA (en)
TW (1) TWI611273B (en)
WO (1) WO2016188358A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107885041B (en) * 2016-09-30 2019-08-23 上海微电子装备（集团）股份有限公司 A kind of big visual field exposure system
DE102017115365B4 (en) * 2017-07-10 2020-10-15 Carl Zeiss Smt Gmbh Semiconductor lithography mask inspection device and process

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3477838B2 (en) * 1993-11-11 2003-12-10 株式会社ニコン Scanning exposure apparatus and exposure method
JP3564735B2 (en) * 1994-06-16 2004-09-15 株式会社ニコン Scanning exposure apparatus and exposure method
JP3617657B2 (en) * 1995-11-13 2005-02-09 株式会社ニコン Misalignment correction method
TW495836B (en) * 2000-02-02 2002-07-21 Nikon Corp Scanning exposure method and device
JP2001215717A (en) * 2000-02-02 2001-08-10 Nikon Corp Scanning exposure method and scanning exposure system
JP2003031462A (en) * 2001-07-12 2003-01-31 Nikon Corp Method of exposure and exposure system
JP4211272B2 (en) * 2002-04-12 2009-01-21 株式会社ニコン Exposure apparatus and exposure method
JP2004335640A (en) * 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd Projection aligner
CN100549835C (en) * 2005-01-25 2009-10-14 株式会社尼康 The manufacture method of exposure device and exposure method and microcomponent
JP2006261155A (en) * 2005-03-15 2006-09-28 Fuji Photo Film Co Ltd Aligner and exposure method
CN100524038C (en) * 2006-08-03 2009-08-05 上海华虹Nec电子有限公司 Apparatus and method for measuring Image field flexural distribution of photo-etching machine
JP5245261B2 (en) * 2007-03-02 2013-07-24 株式会社ニコン Scanning exposure apparatus, exposure method, and device manufacturing method
DE102008001892A1 (en) * 2008-05-21 2009-11-26 Carl Zeiss Smt Ag Optical system for microlithography
JP2010039347A (en) * 2008-08-07 2010-02-18 Mejiro Precision:Kk Projection exposure apparatus
JP5536401B2 (en) * 2008-10-16 2014-07-02 ギガフォトン株式会社 Laser device and extreme ultraviolet light source device
JP5704525B2 (en) * 2010-08-19 2015-04-22 株式会社ブイ・テクノロジー Scan exposure equipment using microlens array
NL2009222A (en) * 2011-08-30 2013-03-04 Asml Netherlands Bv Lithographic apparatus, method of setting up a lithographic apparatus and device manufacturing method.
JP2013130642A (en) * 2011-12-20 2013-07-04 Nikon Corp Exposure method, device manufacturing method, and exposure device
JP2013219089A (en) * 2012-04-04 2013-10-24 Canon Inc Optical system, exposure apparatus and device manufacturing method
CN203444239U (en) * 2013-07-12 2014-02-19 上海微电子装备有限公司 Focal plane adjusting device
CN105549327B (en) * 2014-10-29 2018-03-02 上海微电子装备（集团）股份有限公司 The adjusting apparatus and method of adjustment of exposure device

Also Published As

Publication number Publication date
TWI611273B (en) 2018-01-11
KR20180008713A (en) 2018-01-24
CN106292188B (en) 2019-01-18
US10197921B2 (en) 2019-02-05
US20180157177A1 (en) 2018-06-07
WO2016188358A1 (en) 2016-12-01
JP6505947B2 (en) 2019-04-24
JP2018522287A (en) 2018-08-09
KR102048619B1 (en) 2019-11-25
TW201642047A (en) 2016-12-01
CN106292188A (en) 2017-01-04

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