SG11201708709QA - Memory cell, semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device - Google Patents

Memory cell, semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Info

Publication number
SG11201708709QA
SG11201708709QA SG11201708709QA SG11201708709QA SG11201708709QA SG 11201708709Q A SG11201708709Q A SG 11201708709QA SG 11201708709Q A SG11201708709Q A SG 11201708709QA SG 11201708709Q A SG11201708709Q A SG 11201708709QA SG 11201708709Q A SG11201708709Q A SG 11201708709QA
Authority
SG
Singapore
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
memory cell
manufacturing semiconductor
Prior art date
Application number
SG11201708709QA
Other languages
English (en)
Inventor
Fukuo Owada
Yasuhiko Kawashima
Shinji Yoshida
Yasuhiro Taniguchi
Kosuke Okuyama
Original Assignee
Floadia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Floadia Corp filed Critical Floadia Corp
Publication of SG11201708709QA publication Critical patent/SG11201708709QA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0425—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/40—EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0413—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having charge-trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H10D30/694—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/696—IGFETs having charge trapping gate insulators, e.g. MNOS transistors characterised by the shapes, relative sizes or dispositions of the gate electrodes having at least one additional gate, e.g. program gate, erase gate or select gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/383—Quantum effect devices, e.g. of devices using quantum reflection, diffraction or interference effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/031—Manufacture or treatment of data-storage electrodes
    • H10D64/037—Manufacture or treatment of data-storage electrodes comprising charge-trapping insulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0147—Manufacturing their gate sidewall spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
SG11201708709QA 2015-05-01 2016-04-26 Memory cell, semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device SG11201708709QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015094287A JP5951069B1 (ja) 2015-05-01 2015-05-01 半導体集積回路装置、および半導体集積回路装置の製造方法
PCT/JP2016/063074 WO2016178392A1 (ja) 2015-05-01 2016-04-26 メモリセル、半導体集積回路装置、および半導体集積回路装置の製造方法

Publications (1)

Publication Number Publication Date
SG11201708709QA true SG11201708709QA (en) 2017-11-29

Family

ID=56375200

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708709QA SG11201708709QA (en) 2015-05-01 2016-04-26 Memory cell, semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Country Status (9)

Country Link
US (1) US10276727B2 (he)
EP (1) EP3291292B1 (he)
JP (1) JP5951069B1 (he)
KR (1) KR102390249B1 (he)
CN (1) CN107533980B (he)
IL (1) IL255339B (he)
SG (1) SG11201708709QA (he)
TW (1) TWI613760B (he)
WO (1) WO2016178392A1 (he)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5905630B1 (ja) * 2015-08-13 2016-04-20 株式会社フローディア 半導体集積回路装置の製造方法、および半導体集積回路装置
JP6800057B2 (ja) * 2017-03-15 2020-12-16 キオクシア株式会社 記憶装置
JP6789576B2 (ja) * 2018-08-02 2020-11-25 株式会社フローディア 積和演算装置
CN110854119A (zh) * 2019-11-12 2020-02-28 上海华力微电子有限公司 一种1.5t sonos存储器结构及制造方法
KR20230052035A (ko) * 2021-10-12 2023-04-19 삼성전자주식회사 반도체 장치
CN117690955A (zh) * 2022-09-01 2024-03-12 长鑫存储技术有限公司 半导体结构及其形成方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531350B2 (en) 2001-02-22 2003-03-11 Halo, Inc. Twin MONOS cell fabrication method and array organization
CN1244145C (zh) 2001-11-21 2006-03-01 哈娄利公司 双monos单元制造方法及集成电路组件
CN1481015A (zh) 2002-09-06 2004-03-10 茂德科技股份有限公司 接触孔的形成方法
JP2004266203A (ja) * 2003-03-04 2004-09-24 Renesas Technology Corp 半導体装置及びその製造方法
JP2005142354A (ja) * 2003-11-06 2005-06-02 Matsushita Electric Ind Co Ltd 不揮発性半導体記憶装置及びその駆動方法及びその製造方法
JP5613506B2 (ja) * 2009-10-28 2014-10-22 ルネサスエレクトロニクス株式会社 半導体装置
JP5538828B2 (ja) * 2009-11-11 2014-07-02 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2011129816A (ja) * 2009-12-21 2011-06-30 Renesas Electronics Corp 半導体装置
JP5538024B2 (ja) * 2010-03-29 2014-07-02 ルネサスエレクトロニクス株式会社 不揮発性半導体記憶装置
TWI467745B (zh) * 2012-05-07 2015-01-01 Ememory Technology Inc 非揮發性記憶體及其製作方法

Also Published As

Publication number Publication date
EP3291292B1 (en) 2021-09-29
IL255339B (he) 2022-02-01
KR20180002694A (ko) 2018-01-08
EP3291292A4 (en) 2018-08-29
US20180308990A1 (en) 2018-10-25
WO2016178392A1 (ja) 2016-11-10
US10276727B2 (en) 2019-04-30
CN107533980B (zh) 2019-07-09
TWI613760B (zh) 2018-02-01
KR102390249B1 (ko) 2022-04-22
JP2016213292A (ja) 2016-12-15
JP5951069B1 (ja) 2016-07-13
CN107533980A (zh) 2018-01-02
IL255339A0 (he) 2017-12-31
TW201642395A (zh) 2016-12-01
EP3291292A1 (en) 2018-03-07

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