SG11201707415TA - Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board - Google Patents
Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring boardInfo
- Publication number
- SG11201707415TA SG11201707415TA SG11201707415TA SG11201707415TA SG11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA SG 11201707415T A SG11201707415T A SG 11201707415TA
- Authority
- SG
- Singapore
- Prior art keywords
- resin composition
- photosensitive resin
- film
- wiring board
- cured product
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015066006 | 2015-03-27 | ||
| PCT/JP2016/058167 WO2016158389A1 (ja) | 2015-03-27 | 2016-03-15 | 感光性樹脂組成物、感光性樹脂組成物フィルム、硬化物、絶縁膜および多層配線基板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201707415TA true SG11201707415TA (en) | 2017-10-30 |
Family
ID=57006028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201707415TA SG11201707415TA (en) | 2015-03-27 | 2016-03-15 | Photosensitive resin composition, photosensitive resin composition film, cured product, insulating film and multilayer wiring board |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10474031B2 (ja) |
| EP (1) | EP3276414A1 (ja) |
| JP (1) | JP6740899B2 (ja) |
| KR (1) | KR102613669B1 (ja) |
| CN (1) | CN107407871B (ja) |
| SG (1) | SG11201707415TA (ja) |
| TW (1) | TWI684830B (ja) |
| WO (1) | WO2016158389A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201908559XA (en) * | 2017-03-21 | 2019-10-30 | Toray Industries | Photosensitive resin composition, photosensitive resin composition film, insulating film and electronic component |
| JP2022029427A (ja) | 2020-08-04 | 2022-02-17 | 信越化学工業株式会社 | ネガ型感光性樹脂組成物、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品 |
| WO2022190208A1 (ja) * | 2021-03-09 | 2022-09-15 | 昭和電工マテリアルズ株式会社 | 感光性フィルム、感光性エレメント、及び、積層体の製造方法 |
| CN115826360B (zh) * | 2022-12-23 | 2023-09-12 | 江苏艾森半导体材料股份有限公司 | 感光性聚酰亚胺组合物、图形的制造方法、固化物和电子部件 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04195043A (ja) * | 1990-11-28 | 1992-07-15 | Hitachi Chem Co Ltd | 感光性組成物及びこれを用いたソルダレジストの形成された印刷配線板の製造法 |
| WO2004008252A1 (ja) * | 2002-07-11 | 2004-01-22 | Asahi Kasei Emd Corporation | 高耐熱性ネガ型感光性樹脂組成物 |
| WO2004109403A1 (ja) * | 2003-06-02 | 2004-12-16 | Toray Industries, Inc. | 感光性樹脂組成物およびそれを用いた電子部品ならびに表示装置 |
| WO2006008991A1 (ja) * | 2004-07-16 | 2006-01-26 | Asahi Kasei Emd Corporation | ポリアミド |
| JP2006251562A (ja) | 2005-03-11 | 2006-09-21 | Fuji Photo Film Co Ltd | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
| WO2006098291A1 (ja) * | 2005-03-15 | 2006-09-21 | Toray Industries, Inc. | 感光性樹脂組成物 |
| AU2006201172B2 (en) * | 2005-04-04 | 2010-11-25 | Rohm And Haas Company | Aqueous polymer dispersions |
| JP5098643B2 (ja) * | 2005-08-30 | 2012-12-12 | Ｊｓｒ株式会社 | 感放射線性樹脂組成物およびメッキ造形物の製造方法 |
| JP5013934B2 (ja) * | 2007-04-12 | 2012-08-29 | 旭化成イーマテリアルズ株式会社 | ポリアミドイミド及びネガ型感光性樹脂組成物 |
| KR101214833B1 (ko) * | 2007-12-19 | 2012-12-24 | 다우 코닝 도레이 캄파니 리미티드 | 4-하이드록시페닐알킬아민 유도체 |
| JP5402332B2 (ja) | 2009-07-09 | 2014-01-29 | 東レ株式会社 | 感光性樹脂組成物、感光性樹脂組成物フィルムおよびそれを用いた多層配線基板 |
| JP5854600B2 (ja) * | 2010-12-28 | 2016-02-09 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物 |
| JP5990965B2 (ja) * | 2012-03-23 | 2016-09-14 | 東レ株式会社 | 感光性樹脂組成物およびそれからなるフィルム積層体 |
| JP5681243B2 (ja) * | 2012-03-30 | 2015-03-04 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| JP5315441B1 (ja) * | 2012-03-30 | 2013-10-16 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| EP2871522A4 (en) * | 2012-07-09 | 2016-03-16 | Toray Industries | THE INVENTION PROVIDES A NOZZLE PLATE EXCELLENT IN TERMS OF DURABILITY AGAINST WIPING, AND PROPERTIES FOR REPELLING THE INK EVEN IN CASE OF IMPLEMENTING AN INK EASILY ADHERANT TO THE NOZZLE PLATE. MORE SPECIFICALLY, THE INVENTION INVOLVES A SILICONE CURED FILM FORMATION METHOD FACED WITH NOZZLE PLATE INK DISCHARGE FOR AN INK JET PRINTER, INCLUDING: (1) A PREPARATION STEP A CONDENSED SILICONE COMPOSITION CONTAINING AT LEAST ONE COMPOUND OF A COMPOUND SELECTED FROM A GROUP COMPRISING A BISMUTH COMPOUND AND A CYCLIC AMIDINE COMPOUND; (2) A COATING FILM FORMATION STEP IN WHICH THIS CONDENSED SILICONE COMPOSITION IS APPLIED ON AN INK DISCHARGE FACE OF THE NOZZLE PLATE; AND (3) A HIGH TEMPERATURE CURING STEP OF THIS COATING FILM. |
| JP2014122948A (ja) * | 2012-12-20 | 2014-07-03 | Toray Ind Inc | 感光性樹脂組成物および該感光性組成物より形成された感光性樹脂組成物フィルムならびにそれらを用いたマスクレジスト層付き基板の製造方法およびハンダ突起付き基板の製造方法 |
| US10428253B2 (en) * | 2013-07-16 | 2019-10-01 | Hitachi Chemical Company, Ltd | Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device |
-
2016
- 2016-03-15 SG SG11201707415TA patent/SG11201707415TA/en unknown
- 2016-03-15 KR KR1020177017534A patent/KR102613669B1/ko active IP Right Grant
- 2016-03-15 WO PCT/JP2016/058167 patent/WO2016158389A1/ja active Application Filing
- 2016-03-15 JP JP2016522069A patent/JP6740899B2/ja active Active
- 2016-03-15 CN CN201680016844.2A patent/CN107407871B/zh active Active
- 2016-03-15 EP EP16772272.7A patent/EP3276414A1/en not_active Withdrawn
- 2016-03-15 US US15/559,714 patent/US10474031B2/en active Active
- 2016-03-25 TW TW105109315A patent/TWI684830B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| US10474031B2 (en) | 2019-11-12 |
| KR102613669B1 (ko) | 2023-12-14 |
| JPWO2016158389A1 (ja) | 2018-01-18 |
| TW201642041A (zh) | 2016-12-01 |
| EP3276414A1 (en) | 2018-01-31 |
| CN107407871A (zh) | 2017-11-28 |
| WO2016158389A1 (ja) | 2016-10-06 |
| KR20170131834A (ko) | 2017-11-30 |
| CN107407871B (zh) | 2021-09-03 |
| US20180052391A1 (en) | 2018-02-22 |
| JP6740899B2 (ja) | 2020-08-19 |
| TWI684830B (zh) | 2020-02-11 |
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