SG11201706113TA - Thermally and electrically conductive adhesive composition - Google Patents

Thermally and electrically conductive adhesive composition

Info

Publication number
SG11201706113TA
SG11201706113TA SG11201706113TA SG11201706113TA SG11201706113TA SG 11201706113T A SG11201706113T A SG 11201706113TA SG 11201706113T A SG11201706113T A SG 11201706113TA SG 11201706113T A SG11201706113T A SG 11201706113TA SG 11201706113T A SG11201706113T A SG 11201706113TA
Authority
SG
Singapore
Prior art keywords
thermally
electrically conductive
adhesive composition
conductive adhesive
composition
Prior art date
Application number
SG11201706113TA
Other languages
English (en)
Inventor
Rikia FURUSHO
Shintaro Abe
Takeshi Kondo
Teruki Tanaka
Original Assignee
Tanaka Precious Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Precious Metal Ind filed Critical Tanaka Precious Metal Ind
Publication of SG11201706113TA publication Critical patent/SG11201706113TA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
SG11201706113TA 2015-02-02 2016-01-27 Thermally and electrically conductive adhesive composition SG11201706113TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015018139A JP6091019B2 (ja) 2015-02-02 2015-02-02 熱伝導性導電性接着剤組成物
PCT/JP2016/052245 WO2016125644A1 (ja) 2015-02-02 2016-01-27 熱伝導性導電性接着剤組成物

Publications (1)

Publication Number Publication Date
SG11201706113TA true SG11201706113TA (en) 2017-09-28

Family

ID=56563993

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201706113TA SG11201706113TA (en) 2015-02-02 2016-01-27 Thermally and electrically conductive adhesive composition

Country Status (9)

Country Link
US (1) US10266730B2 (ja)
EP (1) EP3255112B1 (ja)
JP (1) JP6091019B2 (ja)
KR (1) KR102019576B1 (ja)
CN (1) CN107207935B (ja)
MY (1) MY178276A (ja)
SG (1) SG11201706113TA (ja)
TW (1) TWI628253B (ja)
WO (1) WO2016125644A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018047597A1 (ja) * 2016-09-06 2018-03-15 株式会社スリーボンド 熱硬化型導電性接着剤
JP6649628B2 (ja) * 2016-12-09 2020-02-19 トヨタ自動車株式会社 装飾被膜
JP6720862B2 (ja) * 2016-12-28 2020-07-08 三菱ケミカル株式会社 樹脂溶液、それを用いてなる樹脂層および粘着シート
WO2018168187A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 接合用金属ペースト、接合体及びその製造方法、並びに半導体装置及びその製造方法
US11118089B2 (en) * 2017-06-07 2021-09-14 Tanaka Kikinzoku Kogyo K.K. Thermally-conductive and electrically-conductive adhesive composition
KR102525490B1 (ko) * 2017-10-24 2023-04-24 삼성전자주식회사 인쇄 회로 기판, 반도체 패키지 및 반도체 패키지의 제조 방법
JP6877750B2 (ja) * 2017-12-06 2021-05-26 ナミックス株式会社 導電性ペースト
CN107881789A (zh) * 2017-12-23 2018-04-06 芜湖皖江知识产权运营中心有限公司 一种高导热碳纤维复合材料及其制备方法
JP6584543B2 (ja) * 2018-01-23 2019-10-02 田中貴金属工業株式会社 導電性接着剤組成物
WO2020187681A1 (en) * 2019-03-15 2020-09-24 Henkel Ag & Co. Kgaa Sulfone-resin containing gas-barrier adhesive
US11437162B2 (en) 2019-12-31 2022-09-06 Industrial Technology Research Institute Conductive material composition and conductive material prepared therefrom
WO2021251533A1 (ko) * 2020-06-12 2021-12-16 주식회사 대신테크젠 혼합 충전제를 이용한 고 방열성 조성물 및 이의 제조방법
CN111849402A (zh) * 2020-08-04 2020-10-30 天水华洋电子科技股份有限公司 一种半导体引线框架封装用导电银胶及其制备方法
CN112480848B (zh) * 2020-12-08 2021-07-23 深圳市撒比斯科技有限公司 一种用于芯片粘接的导电导热银胶及其制备方法
CN116580870A (zh) * 2023-06-27 2023-08-11 苏州思尔维纳米科技有限公司 一种光伏银浆及其制备方法和应用

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06322350A (ja) 1993-03-17 1994-11-22 Fujitsu Ltd 導電性接着剤及びその製造方法並びに半導体チップの接着方法
JP4355044B2 (ja) * 1999-02-19 2009-10-28 大日本印刷株式会社 硬化性導電ペースト
JP3826104B2 (ja) 2003-03-17 2006-09-27 株式会社ルネサステクノロジ 無溶剤型液状銀ペースト組成物及びそれを用いた半導体装置
JP2008186590A (ja) 2007-01-26 2008-08-14 Teijin Ltd 高熱伝導性導電性組成物、導電性ペースト、導電性接着剤
JP5204454B2 (ja) 2007-10-02 2013-06-05 積水化学工業株式会社 接着剤
CN102174306B (zh) 2011-01-26 2013-09-04 烟台德邦科技有限公司 一种用于led封装的导电胶及其制备方法
BR112013029725A2 (pt) * 2011-05-23 2017-01-17 Kaneka Corp coletor de corrente, bateria, e, bateria bipolar
JP2013175559A (ja) 2012-02-24 2013-09-05 Hitachi Chemical Co Ltd 接着剤層と配線層よりなる複合層及びそれを形成するための印刷用接着剤層形成インク
JP6081231B2 (ja) * 2012-03-05 2017-02-15 ナミックス株式会社 熱伝導性ペースト及びその使用
CN106947409B (zh) * 2012-06-29 2018-12-11 大自达电线股份有限公司 导电胶组成物、导电胶膜、黏合方法及线路基板
JP5859949B2 (ja) * 2012-09-27 2016-02-16 三ツ星ベルト株式会社 導電性組成物
JP5642147B2 (ja) 2012-12-27 2014-12-17 学校法人 関西大学 熱伝導性導電性接着剤組成物
CN103540287B (zh) * 2013-09-27 2016-01-13 长春永固科技有限公司 一种高uph型环氧树脂导电胶及其制备方法

Also Published As

Publication number Publication date
TWI628253B (zh) 2018-07-01
CN107207935B (zh) 2021-02-12
MY178276A (en) 2020-10-07
EP3255112B1 (en) 2020-09-09
WO2016125644A1 (ja) 2016-08-11
EP3255112A4 (en) 2018-07-25
KR102019576B1 (ko) 2019-09-06
JP2016141727A (ja) 2016-08-08
CN107207935A (zh) 2017-09-26
KR20170105546A (ko) 2017-09-19
JP6091019B2 (ja) 2017-03-08
EP3255112A1 (en) 2017-12-13
US10266730B2 (en) 2019-04-23
US20180010020A1 (en) 2018-01-11
TW201643231A (zh) 2016-12-16

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