SG11201705393QA - Pre-alignment measuring device and method - Google Patents

Pre-alignment measuring device and method

Info

Publication number
SG11201705393QA
SG11201705393QA SG11201705393QA SG11201705393QA SG11201705393QA SG 11201705393Q A SG11201705393Q A SG 11201705393QA SG 11201705393Q A SG11201705393Q A SG 11201705393QA SG 11201705393Q A SG11201705393Q A SG 11201705393QA SG 11201705393Q A SG11201705393Q A SG 11201705393QA
Authority
SG
Singapore
Prior art keywords
measuring device
alignment measuring
alignment
measuring
Prior art date
Application number
SG11201705393QA
Other languages
English (en)
Inventor
Rong Du
Dawei Yu
Chenhui Yu
Original Assignee
Shanghai Micro Electronics Equipment (Group) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment (Group) Co Ltd filed Critical Shanghai Micro Electronics Equipment (Group) Co Ltd
Publication of SG11201705393QA publication Critical patent/SG11201705393QA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
    • G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Multimedia (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
SG11201705393QA 2014-12-31 2015-12-30 Pre-alignment measuring device and method SG11201705393QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410845231.2A CN105807579B (zh) 2014-12-31 2014-12-31 一种硅片和基板预对准测量装置和方法
PCT/CN2015/099749 WO2016107573A1 (zh) 2014-12-31 2015-12-30 一种预对准测量装置和方法

Publications (1)

Publication Number Publication Date
SG11201705393QA true SG11201705393QA (en) 2017-08-30

Family

ID=56284297

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201705393QA SG11201705393QA (en) 2014-12-31 2015-12-30 Pre-alignment measuring device and method

Country Status (7)

Country Link
US (1) US10197390B2 (zh)
JP (1) JP6502504B2 (zh)
KR (1) KR101962830B1 (zh)
CN (1) CN105807579B (zh)
SG (1) SG11201705393QA (zh)
TW (1) TWI585550B (zh)
WO (1) WO2016107573A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107976875B (zh) * 2016-10-24 2020-09-29 上海微电子装备（集团）股份有限公司 一种基片对准装置及对准方法
TWI629468B (zh) * 2017-06-08 2018-07-11 中國鋼鐵股份有限公司 Steel strip trimming quality detecting device and detecting method thereof
US11263755B2 (en) * 2020-07-17 2022-03-01 Nanya Technology Corporation Alert device and alert method thereof

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JPH05152186A (ja) * 1991-05-01 1993-06-18 Canon Inc 測定装置及び露光装置及び露光装置の位置決め方法
JPH0653117A (ja) * 1992-07-29 1994-02-25 Hitachi Ltd アライメント方法及びその装置
JPH0766120A (ja) * 1993-08-26 1995-03-10 Canon Inc 面位置検出装置及びそれを用いた半導体素子の製造方法
US5625453A (en) * 1993-10-26 1997-04-29 Canon Kabushiki Kaisha System and method for detecting the relative positional deviation between diffraction gratings and for measuring the width of a line constituting a diffraction grating
US6046812A (en) * 1997-05-29 2000-04-04 Korea Atomic Energy Research Institute Shape-measuring laser apparatus using anisotropic magnification optics
JP3286246B2 (ja) * 1998-03-31 2002-05-27 住友重機械工業株式会社 変形フレネルゾーンプレートを用いた位置検出方法及び位置検出装置
US6366690B1 (en) 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
JP2002286429A (ja) * 2001-03-22 2002-10-03 Konica Corp 表面検査方法及び装置
JP3903889B2 (ja) * 2001-09-13 2007-04-11 株式会社日立製作所 欠陥検査方法及びその装置並びに撮像方法及びその装置
EP1326273B1 (en) * 2001-12-28 2012-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2003098668A2 (en) * 2002-05-16 2003-11-27 Asyst Technologies, Inc. Pre-aligner
JP3994223B2 (ja) * 2002-12-13 2007-10-17 株式会社ニコン 重ね合わせ測定装置および重ね合わせ測定方法
KR100598263B1 (ko) * 2003-12-31 2006-07-07 동부일렉트로닉스 주식회사 노광 장치 및 이를 이용한 샷 정렬 방법
KR20080022193A (ko) 2005-06-13 2008-03-10 에이에스엠엘 네델란즈 비.브이. 리소그래피 투영 시스템 및 투영 렌즈 편광 센서
WO2007027960A2 (en) * 2005-08-30 2007-03-08 Photon Dynamics, Inc. Substrate alignment using linear array sensor
KR20070052054A (ko) * 2005-11-16 2007-05-21 주식회사 하이닉스반도체 반도체 리소그래피 장치
JP4773329B2 (ja) * 2005-12-22 2011-09-14 パナソニック株式会社 界面位置測定方法および測定装置、層厚測定方法および測定装置、並びに、光ディスクの製造方法および製造装置
JP4512627B2 (ja) * 2007-10-03 2010-07-28 キヤノン株式会社 測定装置、露光装置及びデバイス製造方法
JP5043630B2 (ja) * 2007-12-18 2012-10-10 株式会社ディスコ レーザー加工機
JP2010010240A (ja) * 2008-06-25 2010-01-14 Nikon Corp 面位置検出装置、露光装置、およびデバイス製造方法
CN102540778B (zh) * 2010-12-22 2014-07-16 上海微电子装备有限公司 一种测量系统及使用该测量系统的光刻设备
CN102087483B (zh) * 2010-12-27 2013-04-03 中国科学院光电技术研究所 一种用于投影光刻中焦面检测的光学系统
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CN103543610B (zh) * 2012-07-12 2015-09-30 上海微电子装备有限公司 一种调焦调平光斑位置校准方法

Also Published As

Publication number Publication date
US20170350696A1 (en) 2017-12-07
US10197390B2 (en) 2019-02-05
KR101962830B1 (ko) 2019-03-27
JP6502504B2 (ja) 2019-04-17
TW201624149A (zh) 2016-07-01
CN105807579B (zh) 2018-10-16
JP2018508811A (ja) 2018-03-29
WO2016107573A1 (zh) 2016-07-07
TWI585550B (zh) 2017-06-01
KR20170105024A (ko) 2017-09-18
CN105807579A (zh) 2016-07-27

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