SG11201703854TA - Flux reservoir device - Google Patents

Flux reservoir device

Info

Publication number
SG11201703854TA
SG11201703854TA SG11201703854TA SG11201703854TA SG11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA SG 11201703854T A SG11201703854T A SG 11201703854TA
Authority
SG
Singapore
Prior art keywords
reservoir device
flux reservoir
flux
reservoir
Prior art date
Application number
SG11201703854TA
Other languages
English (en)
Inventor
Kohei Seyama
Shoji Wada
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201703854TA publication Critical patent/SG11201703854TA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/082Flux dispensers; Apparatus for applying flux
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/20Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203Fluxing, i.e. applying flux onto surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG11201703854TA 2014-11-11 2015-08-26 Flux reservoir device SG11201703854TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014229026 2014-11-11
PCT/JP2015/074104 WO2016075982A1 (ja) 2014-11-11 2015-08-26 フラックス溜め装置

Publications (1)

Publication Number Publication Date
SG11201703854TA true SG11201703854TA (en) 2017-06-29

Family

ID=55954077

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703854TA SG11201703854TA (en) 2014-11-11 2015-08-26 Flux reservoir device

Country Status (7)

Country Link
US (1) US10137519B2 (ja)
JP (1) JP6286729B2 (ja)
KR (1) KR101995771B1 (ja)
CN (1) CN107107227B (ja)
SG (1) SG11201703854TA (ja)
TW (1) TWI564105B (ja)
WO (1) WO2016075982A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102260077B1 (ko) * 2017-11-09 2021-06-03 가부시키가이샤 신가와 플럭스 전사 장치
US11318549B2 (en) * 2019-06-13 2022-05-03 Illinois Tool Works Inc. Solder paste bead recovery system and method
US11351804B2 (en) 2019-06-13 2022-06-07 Illinois Tool Works Inc. Multi-functional print head for a stencil printer
US11247286B2 (en) 2019-06-13 2022-02-15 Illinois Tool Works Inc. Paste dispensing transfer system and method for a stencil printer
WO2023162105A1 (ja) * 2022-02-24 2023-08-31 株式会社Fuji 液体転写装置、液体膜の形成方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5176312A (en) * 1991-08-12 1993-01-05 Brian Lowenthal Selective flow soldering apparatus
JP2001345543A (ja) 2000-05-31 2001-12-14 Sanyo Electric Co Ltd フラックス転写装置
US7032807B2 (en) * 2003-12-23 2006-04-25 Texas Instruments Incorporated Solder contact reworking using a flux plate and squeegee
JP4841967B2 (ja) * 2006-02-17 2011-12-21 Juki株式会社 フラックス膜形成装置及びフラックス転写装置
JP5037084B2 (ja) * 2006-10-12 2012-09-26 Juki株式会社 フラックスの成膜装置
JP5098434B2 (ja) * 2007-05-21 2012-12-12 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP2009113104A (ja) * 2007-11-09 2009-05-28 Juki Corp フラックス膜形成装置
KR20110030759A (ko) * 2009-09-18 2011-03-24 한미반도체 주식회사 반도체 패키지 제조용 플럭스 공급장치
JP2012199326A (ja) * 2011-03-18 2012-10-18 Hitachi High-Tech Instruments Co Ltd フラックス転写装置
CN102990183B (zh) * 2011-09-09 2014-10-01 中国航天科工集团第三研究院第八三五七研究所 一种bga器件返修过程中转移膏状助焊剂的方法
JP6225334B2 (ja) * 2014-01-29 2017-11-08 パナソニックIpマネジメント株式会社 部品実装装置及び部品実装方法
JP6324772B2 (ja) * 2014-03-14 2018-05-16 ファスフォードテクノロジ株式会社 ダイボンダ用ディッピング機構及びフリップチップボンダ

Also Published As

Publication number Publication date
CN107107227A (zh) 2017-08-29
CN107107227B (zh) 2019-11-05
JPWO2016075982A1 (ja) 2017-08-31
WO2016075982A1 (ja) 2016-05-19
KR20170082597A (ko) 2017-07-14
TWI564105B (zh) 2017-01-01
KR101995771B1 (ko) 2019-07-03
TW201622861A (zh) 2016-07-01
US20170297131A1 (en) 2017-10-19
US10137519B2 (en) 2018-11-27
JP6286729B2 (ja) 2018-03-07

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