SG11201702917RA - Method for manufacturing magnetic-disk substrate, and grindstone for grinding - Google Patents

Method for manufacturing magnetic-disk substrate, and grindstone for grinding

Info

Publication number
SG11201702917RA
SG11201702917RA SG11201702917RA SG11201702917RA SG11201702917RA SG 11201702917R A SG11201702917R A SG 11201702917RA SG 11201702917R A SG11201702917R A SG 11201702917RA SG 11201702917R A SG11201702917R A SG 11201702917RA SG 11201702917R A SG11201702917R A SG 11201702917RA
Authority
SG
Singapore
Prior art keywords
grindstone
grinding
disk substrate
manufacturing magnetic
magnetic
Prior art date
Application number
SG11201702917RA
Other languages
English (en)
Inventor
Hiroaki Ozawa
Takeyoshi Takahashi
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of SG11201702917RA publication Critical patent/SG11201702917RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
SG11201702917RA 2014-12-31 2015-12-29 Method for manufacturing magnetic-disk substrate, and grindstone for grinding SG11201702917RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014267108 2014-12-31
PCT/JP2015/086583 WO2016108286A1 (ja) 2014-12-31 2015-12-29 磁気ディスク用基板の製造方法、及び研削用砥石

Publications (1)

Publication Number Publication Date
SG11201702917RA true SG11201702917RA (en) 2017-05-30

Family

ID=56284440

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702917RA SG11201702917RA (en) 2014-12-31 2015-12-29 Method for manufacturing magnetic-disk substrate, and grindstone for grinding

Country Status (5)

Country Link
JP (2) JP6001815B1 (zh)
CN (2) CN107004431B (zh)
MY (1) MY183917A (zh)
SG (1) SG11201702917RA (zh)
WO (1) WO2016108286A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201908015QA (en) 2017-03-31 2019-10-30 Hoya Corp Non-magnetic substrate for magnetic disk, and magnetic disk
CN109732471B (zh) * 2017-10-31 2020-07-28 湖南大学 一种化学机械-机械化学协同微细磨削加工方法与复合磨粒型微小磨具
JP7133209B2 (ja) 2018-10-31 2022-09-08 株式会社タニタ 温度計

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3099216B2 (ja) * 1994-08-22 2000-10-16 旭栄研磨加工株式会社 ドーナツ状基板の研削工具
JP3325854B2 (ja) * 1999-04-09 2002-09-17 ナオイ精機株式会社 円形ワ−クの研削装置
JP2005059194A (ja) * 2003-07-25 2005-03-10 Hamai Co Ltd 研削砥石および形状加工機
JP4406752B2 (ja) * 2005-05-27 2010-02-03 日本電気硝子株式会社 ガラス基板の端面加工装置及び端面加工方法
JP4756242B2 (ja) * 2005-12-06 2011-08-24 株式会社ノリタケカンパニーリミテド 研削砥石
JP4252093B2 (ja) * 2007-01-18 2009-04-08 昭和電工株式会社 円盤状基板の研削方法、研削装置
KR20090063804A (ko) * 2007-12-14 2009-06-18 주식회사 실트론 연삭 휠 트루잉 공구 및 그 제작방법, 이를 이용한 트루잉장치, 연삭 휠의 제작방법, 및 웨이퍼 에지 연삭장치
JP2010005772A (ja) * 2008-06-30 2010-01-14 Hoya Corp 磁気ディスク用ガラス基板の加工方法、磁気ディスク用ガラス基板の製造方法、及び磁気ディスク用ガラス基板、並びに磁気ディスクの製造方法
JP2010211882A (ja) * 2009-03-11 2010-09-24 Showa Denko Kk 磁気記録媒体用円盤状基板の研削装置、円盤状基板の製造方法および円盤状基板の研削用砥石
JP5356606B2 (ja) * 2010-09-30 2013-12-04 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の製造方法
FR2975027B1 (fr) * 2011-05-10 2014-04-18 Snecma Outil de percage de trous dans une piece, notamment en materiau composite a matrice organique, procede de percage correspondant
JP5787702B2 (ja) * 2011-09-30 2015-09-30 Hoya株式会社 磁気ディスク用ガラス基板の製造方法、磁気ディスクの製造方法及びガラス基板
CN203141327U (zh) * 2012-09-21 2013-08-21 珠海市巨海科技有限公司 组合式金刚石砂轮
JP5994022B2 (ja) * 2013-04-30 2016-09-21 Hoya株式会社 研削砥石、磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法

Also Published As

Publication number Publication date
JP6645935B2 (ja) 2020-02-14
CN107004431A (zh) 2017-08-01
JP6001815B1 (ja) 2016-10-05
CN110450009B (zh) 2021-08-13
MY183917A (en) 2021-03-17
JPWO2016108286A1 (ja) 2017-04-27
WO2016108286A1 (ja) 2016-07-07
JP2016212946A (ja) 2016-12-15
CN110450009A (zh) 2019-11-15
CN107004431B (zh) 2019-09-13

Similar Documents

Publication Publication Date Title
EP3120379A4 (en) Abrasive pad and glass substrate abrading method
EP3127655A4 (en) Polishing pad and process for producing same
EP3240656A4 (en) Abrasive articles and methods for forming same
SG11201801790UA (en) Polishing liquid, polishing liquid set, and substrate polishing method
EP3216562A4 (en) Polishing method and composition for polishing
SG11201607359XA (en) Polishing composition, polishing method, and method for producing substrate
EP3103851A4 (en) Polishing abrasive particle, production method therefor, polishing method, polishing device, and slurry
SG11201609296XA (en) Polishing pad and method for manufacturing the same
SG11201702215RA (en) Polishing composition, method for manufacturing same, and polishing method
EP3095556A4 (en) Double-head surface-grinding apparatus and grinding method
SG10201506731PA (en) Buffing apparatus, and substrate processing apparatus
SG11201607115QA (en) Manufacturing method of carrier for double-side polishing apparatus,carrier for double-side polishing apparatus, and double-side polishing method
EP3159915A4 (en) Method for polishing silicon wafer, polishing composition, and polishing composition set
SG10201801928PA (en) Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate
EP3125297A4 (en) Silicon carbide semiconductor device, and method for manufacturing same
EP3239262A4 (en) Polishing composition, polishing method, and method for manufacturing ceramic component
EP3235404A4 (en) Seat pad and method for manufacturing seat pad
EP3203528A4 (en) Silicon carbide semiconductor device, method for manufacturing silicon carbide semiconductor device, and method for designing silicon carbide semiconductor device
EP3196272A4 (en) Polishing material, composition for polishing, and polishing method
EP3326751A4 (en) Polishing pad and polishing method
EP3239263A4 (en) Polishing composition, polishing method, and method for manufacturing ceramic component
EP3103898A4 (en) Diamond substrate and method for manufacturing diamond substrate
SG11201604185PA (en) Carrier for polishing processing, method for manufacturing carrier for polishing processing, and method for manufacturingmagnetic-disk substrate
EP3213869A4 (en) Grinding tool and manufacturing method therefor
EP3240655A4 (en) Abrasive articles and methods for forming same