SG11201702570TA - Position accuracy inspecting method, position accuracy inspecting apparatus, and position inspecting unit - Google Patents

Position accuracy inspecting method, position accuracy inspecting apparatus, and position inspecting unit

Info

Publication number
SG11201702570TA
SG11201702570TA SG11201702570TA SG11201702570TA SG11201702570TA SG 11201702570T A SG11201702570T A SG 11201702570TA SG 11201702570T A SG11201702570T A SG 11201702570TA SG 11201702570T A SG11201702570T A SG 11201702570TA SG 11201702570T A SG11201702570T A SG 11201702570TA
Authority
SG
Singapore
Prior art keywords
inspecting
position accuracy
unit
accuracy
accuracy inspecting
Prior art date
Application number
SG11201702570TA
Other languages
English (en)
Inventor
Kenta Saiki
Toshihiko Tanaka
Muneaki Tamura
Kazuhiko Koshimizu
Shinji Akaike
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11201702570TA publication Critical patent/SG11201702570TA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/27—Testing of devices without physical removal from the circuit of which they form part, e.g. compensating for effects surrounding elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG11201702570TA 2014-09-30 2015-08-19 Position accuracy inspecting method, position accuracy inspecting apparatus, and position inspecting unit SG11201702570TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014200912A JP6462296B2 (ja) 2014-09-30 2014-09-30 位置精度検査方法、位置精度検査装置及び位置検査ユニット
PCT/JP2015/073923 WO2016052012A1 (ja) 2014-09-30 2015-08-19 位置精度検査方法、位置精度検査装置及び位置検査ユニット

Publications (1)

Publication Number Publication Date
SG11201702570TA true SG11201702570TA (en) 2017-04-27

Family

ID=55630058

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201702570TA SG11201702570TA (en) 2014-09-30 2015-08-19 Position accuracy inspecting method, position accuracy inspecting apparatus, and position inspecting unit

Country Status (7)

Country Link
US (1) US10006941B2 (zh)
JP (1) JP6462296B2 (zh)
KR (1) KR101865887B1 (zh)
CN (1) CN107078072B (zh)
SG (1) SG11201702570TA (zh)
TW (1) TWI697970B (zh)
WO (1) WO2016052012A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603410B (zh) * 2016-06-14 2017-10-21 豪威科技股份有限公司 用於重組晶圓之測試系統及其方法
CN108627096A (zh) * 2017-05-10 2018-10-09 新疆畜牧科学院畜牧业质量标准研究所 毛绒细度长度测量专用毛绒样品成像扫描仪
JP6999321B2 (ja) * 2017-07-31 2022-01-18 東京エレクトロン株式会社 検査装置、検査方法及び記憶媒体
TWI652483B (zh) * 2017-12-12 2019-03-01 穩懋半導體股份有限公司 用於晶圓針測系統之非均質性接收器與非等向性發射器之對位方法
JP7018784B2 (ja) * 2018-02-23 2022-02-14 東京エレクトロン株式会社 コンタクト精度保証方法および検査装置
TWI694537B (zh) * 2018-07-08 2020-05-21 香港商康代影像技術方案香港有限公司 用於失準補償之系統及方法
CN109239422B (zh) * 2018-10-24 2023-11-21 安徽爱意爱机电科技有限公司 厚膜混合电路烧结后电阻阻值调节过程中使用的探针卡
KR102111095B1 (ko) * 2018-11-09 2020-05-15 (주)에이앤아이 전력전달유닛을 포함하는 무선 로터리 검사장치
CN111223786B (zh) * 2018-11-27 2023-10-27 东京毅力科创株式会社 检查装置系统
JP7220554B2 (ja) * 2018-12-04 2023-02-10 東京エレクトロン株式会社 プローブ装置、及び、プローブ装置の調整方法
JP2020092140A (ja) * 2018-12-04 2020-06-11 東京エレクトロン株式会社 位置測定装置、及び、位置測定方法
JP7108527B2 (ja) * 2018-12-10 2022-07-28 東京エレクトロン株式会社 解析装置及び画像生成方法
KR20200106774A (ko) 2019-03-05 2020-09-15 세메스 주식회사 반도체 소자 검사 방법 및 장치
KR20200107132A (ko) 2019-03-06 2020-09-16 세메스 주식회사 척 구조물 및 이를 포함하는 프로브 스테이션
JP7218909B2 (ja) * 2019-05-09 2023-02-07 株式会社昭和真空 プローブピン位置合せ装置及びプローブピン位置合せ装置を使用した電子デバイスの製造方法
KR102199108B1 (ko) * 2019-12-03 2021-01-06 티아이에스 주식회사 웨이퍼 검사장치
TWI759902B (zh) * 2020-10-13 2022-04-01 豪勉科技股份有限公司 點測裝置
JP2022186039A (ja) 2021-06-04 2022-12-15 株式会社東京精密 プローバ制御装置、プローバ制御方法、及びプローバ
CN113985246A (zh) * 2021-10-21 2022-01-28 武汉光谷信息光电子创新中心有限公司 一种芯片的测试与封装工装及系统
CN114325351A (zh) * 2022-03-15 2022-04-12 武汉普赛斯电子技术有限公司 激光器芯片测试装置和激光器芯片测试方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63305525A (ja) * 1987-06-05 1988-12-13 Tokyo Kasoode Kenkyusho:Kk 半導体ウエハ検査におけるプロ−ブヘツドの位置合わせ方法
US5416592A (en) 1992-03-23 1995-05-16 Tokyo Electron Kabushiki Kaisha Probe apparatus for measuring electrical characteristics of objects
JP3156192B2 (ja) 1994-04-19 2001-04-16 東京エレクトロン株式会社 プローブ方法及びその装置
US6549649B1 (en) * 1999-03-04 2003-04-15 Electroglas, Inc. Apparatus and method for projecting an alignment image
US6710798B1 (en) * 1999-03-09 2004-03-23 Applied Precision Llc Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card
JP3473685B2 (ja) * 1999-11-29 2003-12-08 横河電機株式会社 半導体製造装置
JP4267796B2 (ja) * 2000-03-21 2009-05-27 株式会社ヨコオ コンタクトプローブの位置調整装置
US8466703B2 (en) * 2003-03-14 2013-06-18 Rudolph Technologies, Inc. Probe card analysis system and method
JP4908138B2 (ja) * 2005-12-09 2012-04-04 ルネサスエレクトロニクス株式会社 プローブ検査装置
JP4996119B2 (ja) * 2006-03-30 2012-08-08 東京エレクトロン株式会社 プローブの先端位置の検出方法、この方法を記録した記憶媒体、及びプローブ装置
US8159243B2 (en) * 2008-11-13 2012-04-17 Dcg Systems, Inc. Probe tip to device pad alignment in obscured view probing applications
JP2010182874A (ja) * 2009-02-05 2010-08-19 Oki Semiconductor Co Ltd プローブカードのメンテナンス方法

Also Published As

Publication number Publication date
JP2016072455A (ja) 2016-05-09
US10006941B2 (en) 2018-06-26
JP6462296B2 (ja) 2019-01-30
US20170219625A1 (en) 2017-08-03
CN107078072A (zh) 2017-08-18
CN107078072B (zh) 2019-02-05
TW201631678A (zh) 2016-09-01
KR101865887B1 (ko) 2018-06-08
KR20170061135A (ko) 2017-06-02
WO2016052012A1 (ja) 2016-04-07
TWI697970B (zh) 2020-07-01

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