SG11201700675UA - Implant masking and alignment - Google Patents

Implant masking and alignment

Info

Publication number
SG11201700675UA
SG11201700675UA SG11201700675UA SG11201700675UA SG11201700675UA SG 11201700675U A SG11201700675U A SG 11201700675UA SG 11201700675U A SG11201700675U A SG 11201700675UA SG 11201700675U A SG11201700675U A SG 11201700675UA SG 11201700675U A SG11201700675U A SG 11201700675UA
Authority
SG
Singapore
Prior art keywords
alignment
implant masking
masking
implant
Prior art date
Application number
SG11201700675UA
Other languages
English (en)
Inventor
Babak Adibi
Vinay Prabhakar
Terry Bluck
Original Assignee
Intevac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intevac Inc filed Critical Intevac Inc
Publication of SG11201700675UA publication Critical patent/SG11201700675UA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • H01J37/3045—Object or beam position registration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/202—Movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/204—Means for introducing and/or outputting objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/31701—Ion implantation
    • H01J2237/31706—Ion implantation characterised by the area treated
    • H01J2237/3171—Ion implantation characterised by the area treated patterned
    • H01J2237/31711—Ion implantation characterised by the area treated patterned using mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201700675UA 2014-08-05 2015-08-05 Implant masking and alignment SG11201700675UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462033104P 2014-08-05 2014-08-05
PCT/US2015/043884 WO2016022728A1 (fr) 2014-08-05 2015-08-05 Masquage et alignement d'implant

Publications (1)

Publication Number Publication Date
SG11201700675UA true SG11201700675UA (en) 2017-02-27

Family

ID=55264529

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700675UA SG11201700675UA (en) 2014-08-05 2015-08-05 Implant masking and alignment

Country Status (7)

Country Link
US (1) US9543114B2 (fr)
JP (1) JP6607923B2 (fr)
CN (1) CN106688088B (fr)
MY (1) MY183097A (fr)
SG (1) SG11201700675UA (fr)
TW (1) TWI662646B (fr)
WO (1) WO2016022728A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
JP6068491B2 (ja) 2011-11-08 2017-01-25 インテヴァック インコーポレイテッド 基板処理システムおよび基板処理方法
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US10679883B2 (en) * 2012-04-19 2020-06-09 Intevac, Inc. Wafer plate and mask arrangement for substrate fabrication
EP2852469B1 (fr) 2012-04-26 2019-04-24 Intevac, Inc. Architecture de système de traitement sous vide
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
SG11201700675UA (en) 2014-08-05 2017-02-27 Intevac Inc Implant masking and alignment
US10559710B2 (en) * 2017-07-19 2020-02-11 Intevac, Inc. System of height and alignment rollers for precise alignment of wafers for ion implantation
US10854772B2 (en) * 2017-07-19 2020-12-01 Intevac, Inc. Multi-piece substrate holder and alignment mechanism
EP3704519A4 (fr) 2017-11-01 2021-08-04 Nitto Denko Corporation Structure et élément de distribution de lumière, procédé et utilisations associés
KR20210094119A (ko) * 2018-12-17 2021-07-28 어플라이드 머티어리얼스, 인코포레이티드 기판 상에 디바이스들을 형성하는 방법
CN110993615A (zh) * 2019-11-28 2020-04-10 信利(仁寿)高端显示科技有限公司 一种tft基板的离子注入方法和制作方法
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US20230377834A1 (en) * 2022-05-19 2023-11-23 Fei Company Systems and methods for pre-aligning samples for more efficient processing of multiple samples with a broad ion beam (bib) system

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SG11201700675UA (en) 2014-08-05 2017-02-27 Intevac Inc Implant masking and alignment

Also Published As

Publication number Publication date
JP6607923B2 (ja) 2019-11-20
CN106688088B (zh) 2020-01-10
MY183097A (en) 2021-02-13
TW201606921A (zh) 2016-02-16
US9543114B2 (en) 2017-01-10
TWI662646B (zh) 2019-06-11
US20160042913A1 (en) 2016-02-11
JP2017532759A (ja) 2017-11-02
WO2016022728A1 (fr) 2016-02-11
CN106688088A (zh) 2017-05-17

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