SG11201608293YA - Retaining ring having inner surfaces with facets - Google Patents

Retaining ring having inner surfaces with facets

Info

Publication number
SG11201608293YA
SG11201608293YA SG11201608293YA SG11201608293YA SG11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA SG 11201608293Y A SG11201608293Y A SG 11201608293YA
Authority
SG
Singapore
Prior art keywords
facets
retaining ring
inner surfaces
retaining
ring
Prior art date
Application number
SG11201608293YA
Other languages
English (en)
Inventor
Jeonghoon Oh
Steven M Zuniga
Andrew J Nagengast
Samuel Chu-Chiang Hsu
Gautam Shashank Dandavate
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG11201608293YA publication Critical patent/SG11201608293YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG11201608293YA 2014-04-22 2015-04-15 Retaining ring having inner surfaces with facets SG11201608293YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/259,089 US9368371B2 (en) 2014-04-22 2014-04-22 Retaining ring having inner surfaces with facets
PCT/US2015/026004 WO2015164149A1 (en) 2014-04-22 2015-04-15 Retaining ring having inner surfaces with facets

Publications (1)

Publication Number Publication Date
SG11201608293YA true SG11201608293YA (en) 2016-11-29

Family

ID=54322619

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608293YA SG11201608293YA (en) 2014-04-22 2015-04-15 Retaining ring having inner surfaces with facets

Country Status (8)

Country Link
US (4) US9368371B2 (zh)
EP (1) EP3134915B1 (zh)
JP (1) JP6797690B2 (zh)
KR (1) KR102416432B1 (zh)
CN (2) CN106233431B (zh)
SG (1) SG11201608293YA (zh)
TW (2) TW201930012A (zh)
WO (1) WO2015164149A1 (zh)

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US9368371B2 (en) 2014-04-22 2016-06-14 Applied Materials, Inc. Retaining ring having inner surfaces with facets
US9530655B2 (en) * 2014-09-08 2016-12-27 Taiwan Semiconductor Manufacting Company, Ltd. Slurry composition for chemical mechanical polishing of Ge-based materials and devices
JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
US10500695B2 (en) * 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
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CN209615159U (zh) * 2018-11-28 2019-11-12 凯斯科技股份有限公司 化学机械式研磨装置用承载头的卡环及具备其的承载头
KR102702996B1 (ko) 2018-12-10 2024-09-04 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
JP2020163529A (ja) * 2019-03-29 2020-10-08 株式会社荏原製作所 基板を保持するための研磨ヘッドおよび基板処理装置
US11691244B2 (en) 2020-07-08 2023-07-04 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring
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US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
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Also Published As

Publication number Publication date
US20230290645A1 (en) 2023-09-14
US9368371B2 (en) 2016-06-14
TW201542319A (zh) 2015-11-16
CN111451929A (zh) 2020-07-28
EP3134915B1 (en) 2020-12-09
WO2015164149A1 (en) 2015-10-29
US20210249276A1 (en) 2021-08-12
CN106233431A (zh) 2016-12-14
CN106233431B (zh) 2020-05-01
EP3134915A1 (en) 2017-03-01
EP3134915A4 (en) 2017-12-13
US20160151879A1 (en) 2016-06-02
TWI680829B (zh) 2020-01-01
US11056350B2 (en) 2021-07-06
KR102416432B1 (ko) 2022-07-01
JP6797690B2 (ja) 2020-12-09
JP2017514310A (ja) 2017-06-01
US12033865B2 (en) 2024-07-09
US11682561B2 (en) 2023-06-20
TW201930012A (zh) 2019-08-01
CN111451929B (zh) 2022-07-19
US20150303070A1 (en) 2015-10-22
KR20160145786A (ko) 2016-12-20

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