SG11201606865RA - Method for manufacturing semiconductor device, semiconductor device, and wire bonding device - Google Patents

Method for manufacturing semiconductor device, semiconductor device, and wire bonding device

Info

Publication number
SG11201606865RA
SG11201606865RA SG11201606865RA SG11201606865RA SG11201606865RA SG 11201606865R A SG11201606865R A SG 11201606865RA SG 11201606865R A SG11201606865R A SG 11201606865RA SG 11201606865R A SG11201606865R A SG 11201606865RA SG 11201606865R A SG11201606865R A SG 11201606865RA
Authority
SG
Singapore
Prior art keywords
semiconductor device
wire bonding
manufacturing semiconductor
manufacturing
bonding device
Prior art date
Application number
SG11201606865RA
Other languages
English (en)
Inventor
Naoki Sekine
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201606865RA publication Critical patent/SG11201606865RA/en

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Classifications

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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
SG11201606865RA 2014-02-21 2015-02-10 Method for manufacturing semiconductor device, semiconductor device, and wire bonding device SG11201606865RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014032217 2014-02-21
PCT/JP2015/053666 WO2015125670A1 (ja) 2014-02-21 2015-02-10 半導体装置の製造方法、半導体装置及びワイヤボンディング装置

Publications (1)

Publication Number Publication Date
SG11201606865RA true SG11201606865RA (en) 2016-10-28

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ID=53878175

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201606865RA SG11201606865RA (en) 2014-02-21 2015-02-10 Method for manufacturing semiconductor device, semiconductor device, and wire bonding device

Country Status (7)

Country Link
US (1) US9887174B2 (ja)
JP (1) JP6166458B2 (ja)
KR (1) KR101867921B1 (ja)
CN (1) CN106165077B (ja)
SG (1) SG11201606865RA (ja)
TW (1) TWI585927B (ja)
WO (1) WO2015125670A1 (ja)

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TW201533877A (zh) 2015-09-01
CN106165077B (zh) 2019-01-01
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