TW359014B - Anti-stripping IC bonding pad structure - Google Patents

Anti-stripping IC bonding pad structure

Info

Publication number
TW359014B
TW359014B TW086113410A TW86113410A TW359014B TW 359014 B TW359014 B TW 359014B TW 086113410 A TW086113410 A TW 086113410A TW 86113410 A TW86113410 A TW 86113410A TW 359014 B TW359014 B TW 359014B
Authority
TW
Taiwan
Prior art keywords
conductive layer
stripping
bonding pad
pad structure
layer
Prior art date
Application number
TW086113410A
Other languages
Chinese (zh)
Inventor
Chin-Jong Chan
Shiou-Shin Jung
Ruei-Wei Lin
Original Assignee
Winbond Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winbond Electronics Corp filed Critical Winbond Electronics Corp
Priority to TW086113410A priority Critical patent/TW359014B/en
Application granted granted Critical
Publication of TW359014B publication Critical patent/TW359014B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

An anti-stripping IC bonding pad structure, disposed on the substrate of a semiconductor, including: an insulation layer, formed on the substrate; a conductive layer, formed on the insulation layer; a coating, covering the perimeter of the conductive layer and overlapping the metal layer, being the conductive layer not be covered a connection region; and a plurality of island objects, formed between the insulation layer under the bonding region and the conductive layer, in connection with the conductive layer interlockedly.
TW086113410A 1997-09-15 1997-09-15 Anti-stripping IC bonding pad structure TW359014B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086113410A TW359014B (en) 1997-09-15 1997-09-15 Anti-stripping IC bonding pad structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086113410A TW359014B (en) 1997-09-15 1997-09-15 Anti-stripping IC bonding pad structure

Publications (1)

Publication Number Publication Date
TW359014B true TW359014B (en) 1999-05-21

Family

ID=57940575

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086113410A TW359014B (en) 1997-09-15 1997-09-15 Anti-stripping IC bonding pad structure

Country Status (1)

Country Link
TW (1) TW359014B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585927B (en) * 2014-02-21 2017-06-01 新川股份有限公司 Method for producing semiconductor apparatus, semiconductor apparatus and wire bonding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI585927B (en) * 2014-02-21 2017-06-01 新川股份有限公司 Method for producing semiconductor apparatus, semiconductor apparatus and wire bonding apparatus
US9887174B2 (en) 2014-02-21 2018-02-06 Shinkawa Ltd. Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees