SG11201605465SA - Composite sheet for protective-film formation - Google Patents
Composite sheet for protective-film formationInfo
- Publication number
- SG11201605465SA SG11201605465SA SG11201605465SA SG11201605465SA SG11201605465SA SG 11201605465S A SG11201605465S A SG 11201605465SA SG 11201605465S A SG11201605465S A SG 11201605465SA SG 11201605465S A SG11201605465S A SG 11201605465SA SG 11201605465S A SG11201605465S A SG 11201605465SA
- Authority
- SG
- Singapore
- Prior art keywords
- protective
- film formation
- composite sheet
- composite
- sheet
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
- 239000002131 composite material Substances 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014001848 | 2014-01-08 | ||
PCT/JP2014/084226 WO2015105002A1 (ja) | 2014-01-08 | 2014-12-25 | 保護膜形成用複合シート |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201605465SA true SG11201605465SA (en) | 2016-08-30 |
Family
ID=53523839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201605465SA SG11201605465SA (en) | 2014-01-08 | 2014-12-25 | Composite sheet for protective-film formation |
Country Status (8)
Country | Link |
---|---|
US (1) | US20160326403A1 (ja) |
JP (1) | JP6600872B2 (ja) |
KR (1) | KR102258918B1 (ja) |
CN (1) | CN105899631A (ja) |
PH (1) | PH12016501335B1 (ja) |
SG (1) | SG11201605465SA (ja) |
TW (1) | TWI651207B (ja) |
WO (1) | WO2015105002A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6710457B2 (ja) * | 2016-06-01 | 2020-06-17 | 株式会社ディスコ | エキスパンドシート、エキスパンドシートの製造方法、及びエキスパンドシートの拡張方法 |
JP6870974B2 (ja) | 2016-12-08 | 2021-05-12 | 株式会社ディスコ | 被加工物の分割方法 |
JP6938212B2 (ja) * | 2017-05-11 | 2021-09-22 | 株式会社ディスコ | 加工方法 |
JP7044780B2 (ja) * | 2017-07-06 | 2022-03-30 | リンテック株式会社 | 樹脂膜形成用フィルム及び樹脂膜形成用複合シート |
JP6778328B2 (ja) * | 2017-08-10 | 2020-10-28 | 株式会社寺岡製作所 | 接着シート |
JP7182603B2 (ja) * | 2018-03-09 | 2022-12-02 | リンテック株式会社 | 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法 |
SG11202012966XA (en) * | 2018-09-11 | 2021-02-25 | Lintec Corp | Film for protective film formation, composite sheet for protective film formation, test method, and identification method |
JP7382173B2 (ja) * | 2019-08-21 | 2023-11-16 | 株式会社ディスコ | 環状フレーム |
JP2022146907A (ja) * | 2021-03-22 | 2022-10-05 | リンテック株式会社 | 治具固定用粘着シート、保護膜形成用複合シート、及び保護膜付きチップの製造方法 |
JP7114013B1 (ja) * | 2021-03-22 | 2022-08-05 | リンテック株式会社 | 治具固定用粘着シート、保護膜形成用複合シート、及び保護膜付きチップの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020082914A1 (en) * | 2000-12-26 | 2002-06-27 | Gil Beyda | Hybrid network based advertising system and method |
WO2005057644A1 (ja) * | 2003-12-15 | 2005-06-23 | The Furukawa Electric Co., Ltd. | ウェハ加工用テープおよびその製造方法 |
JP2005203749A (ja) * | 2003-12-15 | 2005-07-28 | Furukawa Electric Co Ltd:The | ウェハ加工用テープおよびその製造方法 |
KR101356093B1 (ko) * | 2005-03-28 | 2014-01-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 안트라센 유도체, 발광소자용 재료, 발광소자, 발광장치 및전자기기 |
JP5683794B2 (ja) * | 2008-06-30 | 2015-03-11 | リンテック株式会社 | ウェハ加工用テープ |
JP5456440B2 (ja) | 2009-01-30 | 2014-03-26 | 日東電工株式会社 | ダイシングテープ一体型ウエハ裏面保護フィルム |
JP5503342B2 (ja) * | 2010-03-10 | 2014-05-28 | 古河電気工業株式会社 | ダイシング・ダイボンディングテープ |
CN102959688B (zh) * | 2010-06-18 | 2016-04-06 | 日立化成株式会社 | 粘接片 |
JP5592811B2 (ja) | 2011-01-27 | 2014-09-17 | 日東電工株式会社 | 半導体装置の製造方法 |
US9786541B2 (en) | 2011-09-30 | 2017-10-10 | Lintec Corporation | Dicing sheet with protective film forming layer and chip fabrication method |
JP5865044B2 (ja) * | 2011-12-07 | 2016-02-17 | リンテック株式会社 | 保護膜形成層付ダイシングシートおよびチップの製造方法 |
JP5865045B2 (ja) * | 2011-12-07 | 2016-02-17 | リンテック株式会社 | 保護膜形成層付ダイシングシートおよびチップの製造方法 |
EP2979864B1 (en) * | 2013-03-28 | 2020-10-14 | LINTEC Corporation | Protective film formation composite sheet and method for fabricating a chip equipped with a protective film |
-
2014
- 2014-12-25 CN CN201480072301.3A patent/CN105899631A/zh active Pending
- 2014-12-25 SG SG11201605465SA patent/SG11201605465SA/en unknown
- 2014-12-25 WO PCT/JP2014/084226 patent/WO2015105002A1/ja active Application Filing
- 2014-12-25 US US15/109,803 patent/US20160326403A1/en not_active Abandoned
- 2014-12-25 JP JP2015556766A patent/JP6600872B2/ja active Active
- 2014-12-25 KR KR1020167017970A patent/KR102258918B1/ko active IP Right Grant
- 2014-12-29 TW TW103145986A patent/TWI651207B/zh active
-
2016
- 2016-07-05 PH PH12016501335A patent/PH12016501335B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI651207B (zh) | 2019-02-21 |
TW201532837A (zh) | 2015-09-01 |
PH12016501335A1 (en) | 2016-08-15 |
KR20160106588A (ko) | 2016-09-12 |
CN105899631A (zh) | 2016-08-24 |
KR102258918B1 (ko) | 2021-06-02 |
US20160326403A1 (en) | 2016-11-10 |
PH12016501335B1 (en) | 2016-08-15 |
WO2015105002A1 (ja) | 2015-07-16 |
JPWO2015105002A1 (ja) | 2017-03-23 |
JP6600872B2 (ja) | 2019-11-06 |
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