SG11201602207QA - Multi-layered polishing pads - Google Patents

Multi-layered polishing pads

Info

Publication number
SG11201602207QA
SG11201602207QA SG11201602207QA SG11201602207QA SG11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA
Authority
SG
Singapore
Prior art keywords
polishing pads
layered polishing
layered
pads
polishing
Prior art date
Application number
SG11201602207QA
Other languages
English (en)
Inventor
Paul S Lugg
Duy K Lehuu
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201602207QA publication Critical patent/SG11201602207QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
SG11201602207QA 2013-09-25 2014-09-23 Multi-layered polishing pads SG11201602207QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US201462019068P 2014-06-30 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (1)

Publication Number Publication Date
SG11201602207QA true SG11201602207QA (en) 2016-04-28

Family

ID=52744387

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201602207QA SG11201602207QA (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Country Status (8)

Country Link
US (1) US10071459B2 (es)
EP (1) EP3050082B1 (es)
JP (1) JP6703939B2 (es)
KR (1) KR102252673B1 (es)
CN (1) CN105579194B (es)
SG (1) SG11201602207QA (es)
TW (1) TWI699257B (es)
WO (1) WO2015048011A1 (es)

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US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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JP7300441B2 (ja) * 2017-07-11 2023-06-29 スリーエム イノベイティブ プロパティズ カンパニー 適合性コーティングを含む研磨物品及びそれらからのポリッシングシステム
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US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
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US11738423B2 (en) 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
WO2020066671A1 (ja) * 2018-09-28 2020-04-02 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
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US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112429803A (zh) * 2020-11-02 2021-03-02 湖南长科诚享石化科技有限公司 破乳反应器
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN115157111B (zh) * 2022-07-13 2024-03-15 安徽禾臣新材料有限公司 一种玻璃加工用抛光垫及其制备方法

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Also Published As

Publication number Publication date
CN105579194A (zh) 2016-05-11
JP2016538139A (ja) 2016-12-08
KR102252673B1 (ko) 2021-05-18
JP6703939B2 (ja) 2020-06-03
CN105579194B (zh) 2019-04-26
WO2015048011A1 (en) 2015-04-02
US10071459B2 (en) 2018-09-11
EP3050082A4 (en) 2017-05-17
TW201532731A (zh) 2015-09-01
TWI699257B (zh) 2020-07-21
KR20160060691A (ko) 2016-05-30
EP3050082A1 (en) 2016-08-03
EP3050082B1 (en) 2021-05-05
US20160229023A1 (en) 2016-08-11

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