SG11201602207QA - Multi-layered polishing pads - Google Patents

Multi-layered polishing pads

Info

Publication number
SG11201602207QA
SG11201602207QA SG11201602207QA SG11201602207QA SG11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA SG 11201602207Q A SG11201602207Q A SG 11201602207QA
Authority
SG
Singapore
Prior art keywords
polishing pads
layered polishing
layered
pads
polishing
Prior art date
Application number
SG11201602207QA
Other languages
English (en)
Inventor
Paul S Lugg
Duy K Lehuu
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201602207QA publication Critical patent/SG11201602207QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
SG11201602207QA 2013-09-25 2014-09-23 Multi-layered polishing pads SG11201602207QA (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361882369P 2013-09-25 2013-09-25
US201361918369P 2013-12-19 2013-12-19
US201462019068P 2014-06-30 2014-06-30
PCT/US2014/056966 WO2015048011A1 (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Publications (1)

Publication Number Publication Date
SG11201602207QA true SG11201602207QA (en) 2016-04-28

Family

ID=52744387

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201602207QA SG11201602207QA (en) 2013-09-25 2014-09-23 Multi-layered polishing pads

Country Status (8)

Country Link
US (1) US10071459B2 (es)
EP (1) EP3050082B1 (es)
JP (1) JP6703939B2 (es)
KR (1) KR102252673B1 (es)
CN (1) CN105579194B (es)
SG (1) SG11201602207QA (es)
TW (1) TWI699257B (es)
WO (1) WO2015048011A1 (es)

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US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
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WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
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WO2019152222A1 (en) 2018-02-05 2019-08-08 Applied Materials, Inc. Piezo-electric end-pointing for 3d printed cmp pads
SG11202010448TA (en) 2018-05-07 2020-11-27 Applied Materials Inc Hydrophilic and zeta potential tunable chemical mechanical polishing pads
US11738423B2 (en) * 2018-07-31 2023-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
WO2020066671A1 (ja) * 2018-09-28 2020-04-02 株式会社フジミインコーポレーテッド 研磨パッド、及びそれを用いた研磨方法
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US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN112429803A (zh) * 2020-11-02 2021-03-02 湖南长科诚享石化科技有限公司 破乳反应器
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
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Also Published As

Publication number Publication date
TW201532731A (zh) 2015-09-01
KR102252673B1 (ko) 2021-05-18
WO2015048011A1 (en) 2015-04-02
JP6703939B2 (ja) 2020-06-03
EP3050082A1 (en) 2016-08-03
CN105579194B (zh) 2019-04-26
US10071459B2 (en) 2018-09-11
EP3050082B1 (en) 2021-05-05
JP2016538139A (ja) 2016-12-08
TWI699257B (zh) 2020-07-21
US20160229023A1 (en) 2016-08-11
KR20160060691A (ko) 2016-05-30
CN105579194A (zh) 2016-05-11
EP3050082A4 (en) 2017-05-17

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