SG10201407810YA - Bonding device - Google Patents
Bonding deviceInfo
- Publication number
- SG10201407810YA SG10201407810YA SG10201407810YA SG10201407810YA SG10201407810YA SG 10201407810Y A SG10201407810Y A SG 10201407810YA SG 10201407810Y A SG10201407810Y A SG 10201407810YA SG 10201407810Y A SG10201407810Y A SG 10201407810YA SG 10201407810Y A SG10201407810Y A SG 10201407810YA
- Authority
- SG
- Singapore
- Prior art keywords
- bonding device
- bonding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
- B29C65/1629—Laser beams characterised by the way of heating the interface
- B29C65/1664—Laser beams characterised by the way of heating the interface making use of several radiators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75261—Laser
- H01L2224/75263—Laser in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
- H01L2224/78745—Suction holding means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
- H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body
- H01L2924/401—LASER
- H01L2924/402—Type
- H01L2924/4035—Type being a fiber hosted LASER
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Laser Beam Processing (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013257282A JP6311858B2 (en) | 2013-12-12 | 2013-12-12 | Bonding equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201407810YA true SG10201407810YA (en) | 2015-07-30 |
Family
ID=53369442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201407810YA SG10201407810YA (en) | 2013-12-12 | 2014-11-25 | Bonding device |
Country Status (5)
Country | Link |
---|---|
US (1) | US9437571B2 (en) |
JP (1) | JP6311858B2 (en) |
KR (1) | KR102210166B1 (en) |
SG (1) | SG10201407810YA (en) |
TW (1) | TWI616960B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9981336B2 (en) * | 2015-11-04 | 2018-05-29 | Kulicke And Soffa Industries, Inc. | Ribbon bonding tools, and methods of designing ribbon bonding tools |
KR102429619B1 (en) | 2015-11-18 | 2022-08-04 | 삼성전자주식회사 | Bonding stage and bonding apparatus comprising the same |
KR101950725B1 (en) * | 2016-10-20 | 2019-02-21 | 크루셜머신즈 주식회사 | Optical homogenization device and laser bonding apparatus containing the same |
TWI693119B (en) * | 2019-03-06 | 2020-05-11 | 台灣愛司帝科技股份有限公司 | Laser heating device for fixing led |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5942066A (en) * | 1995-07-28 | 1999-08-24 | Canon Kabushiki Kaisha | Process for producing liquid crystal device |
US6188044B1 (en) * | 1998-04-27 | 2001-02-13 | Cvc Products, Inc. | High-performance energy transfer system and method for thermal processing applications |
JP2000277893A (en) * | 1999-03-23 | 2000-10-06 | Seiko Epson Corp | Head for thermocompression bonding, and thermocompression bonding apparatus provided with the same |
US6284088B1 (en) * | 1999-08-26 | 2001-09-04 | Rockwell Collins | Method and apparatus for bonding optical films in precision alignment |
JP2002134906A (en) * | 2000-10-20 | 2002-05-10 | Matsushita Electric Ind Co Ltd | Thermocompression bonding device for electronic component and thermocompression bonding method |
JP4354873B2 (en) * | 2004-06-04 | 2009-10-28 | パナソニック株式会社 | Electronic component mounting tool |
JP5120751B2 (en) * | 2008-01-31 | 2013-01-16 | 澁谷工業株式会社 | Bonding equipment |
JP5126712B2 (en) * | 2007-10-01 | 2013-01-23 | 澁谷工業株式会社 | Bonding equipment |
JP4880561B2 (en) * | 2007-10-03 | 2012-02-22 | 新光電気工業株式会社 | Flip chip mounting device |
JP2009224394A (en) * | 2008-03-13 | 2009-10-01 | Omron Corp | Jointing apparatus and jointing method |
JP5343534B2 (en) | 2008-11-28 | 2013-11-13 | 澁谷工業株式会社 | Bonding head |
JP2012199358A (en) * | 2011-03-22 | 2012-10-18 | Nec Corp | Chip heating head |
-
2013
- 2013-12-12 JP JP2013257282A patent/JP6311858B2/en active Active
-
2014
- 2014-09-04 KR KR1020140117623A patent/KR102210166B1/en active IP Right Grant
- 2014-09-23 TW TW103132822A patent/TWI616960B/en active
- 2014-11-19 US US14/547,912 patent/US9437571B2/en active Active
- 2014-11-25 SG SG10201407810YA patent/SG10201407810YA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20150171048A1 (en) | 2015-06-18 |
US9437571B2 (en) | 2016-09-06 |
KR102210166B1 (en) | 2021-01-29 |
JP2015115497A (en) | 2015-06-22 |
TWI616960B (en) | 2018-03-01 |
TW201523758A (en) | 2015-06-16 |
KR20150068890A (en) | 2015-06-22 |
JP6311858B2 (en) | 2018-04-18 |
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