SG11201508356SA - Testing head of electronic devices - Google Patents

Testing head of electronic devices

Info

Publication number
SG11201508356SA
SG11201508356SA SG11201508356SA SG11201508356SA SG11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA SG 11201508356S A SG11201508356S A SG 11201508356SA
Authority
SG
Singapore
Prior art keywords
electronic devices
testing head
testing
head
electronic
Prior art date
Application number
SG11201508356SA
Other languages
English (en)
Inventor
Stefano Felici
Raffaele Vallauri
Roberto Crippa
Original Assignee
Technoprobe Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technoprobe Spa filed Critical Technoprobe Spa
Publication of SG11201508356SA publication Critical patent/SG11201508356SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing, Inspecting, Measuring Of Stereoscopic Televisions And Televisions (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
SG11201508356SA 2013-04-09 2014-04-08 Testing head of electronic devices SG11201508356SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000561A ITMI20130561A1 (it) 2013-04-09 2013-04-09 Testa di misura di dispositivi elettronici
PCT/IB2014/000528 WO2014167410A2 (en) 2013-04-09 2014-04-08 Testing head of electronic devices

Publications (1)

Publication Number Publication Date
SG11201508356SA true SG11201508356SA (en) 2015-11-27

Family

ID=48579233

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201508356SA SG11201508356SA (en) 2013-04-09 2014-04-08 Testing head of electronic devices

Country Status (11)

Country Link
US (1) US9829508B2 (zh)
EP (1) EP2984492B1 (zh)
JP (1) JP6416205B2 (zh)
KR (1) KR102146512B1 (zh)
CN (1) CN105102990A (zh)
IT (1) ITMI20130561A1 (zh)
MY (1) MY177726A (zh)
PH (1) PH12015502354B1 (zh)
SG (1) SG11201508356SA (zh)
TW (1) TWI636259B (zh)
WO (1) WO2014167410A2 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6245876B2 (ja) * 2013-07-26 2017-12-13 株式会社日本マイクロニクス プローブカード
TW201625962A (zh) * 2014-12-04 2016-07-16 技術探測股份有限公司 包括垂直探針之測試頭
WO2016107859A1 (en) * 2014-12-30 2016-07-07 Technoprobe S.P.A. Manufacturing method of contact probes for a testing head
US10151774B2 (en) * 2015-06-10 2018-12-11 Asm Technology Singapore Pte Ltd Electrical contact having electrical isolated members for contacting an electrical component
CN105353260B (zh) * 2015-12-25 2019-01-08 东莞市海轮电子科技有限公司 一种连接端子的测试装置及测试方法
IT201600079694A1 (it) * 2016-07-28 2018-01-28 Technoprobe Spa Testa di misura di dispositivi elettronici e relativa scheda di misura
IT201600079679A1 (it) 2016-07-28 2018-01-28 Technoprobe Spa Scheda di misura di dispositivi elettronici
IT201600084921A1 (it) * 2016-08-11 2018-02-11 Technoprobe Spa Sonda di contatto e relativa testa di misura di un’apparecchiatura di test di dispositivi elettronici
US20200124664A1 (en) * 2017-04-03 2020-04-23 Kes Systems & Service (1993) Pte, Ltd. Electrical test apparatus having adjustable contact pressure
IT201700046645A1 (it) * 2017-04-28 2018-10-28 Technoprobe Spa Scheda di misura per un’apparecchiatura di test di dispositivi elettronici
TWI663407B (zh) * 2018-06-06 2019-06-21 中華精測科技股份有限公司 探針卡裝置及其立體式信號轉接結構
IT201900014208A1 (it) 2019-08-07 2021-02-07 Technoprobe Spa Testa di misura di dispositivi elettronici e relativa scheda di misura
CN111122927A (zh) * 2019-12-24 2020-05-08 杭州易正科技有限公司 一种集成电路测试探针座
KR102174269B1 (ko) * 2020-09-22 2020-11-04 주식회사 새한마이크로텍 칩 부품 검사용 프로브 조립체
JP2022108835A (ja) * 2021-01-14 2022-07-27 株式会社日本マイクロニクス 電気的接続装置および電気的接続装置の製造方法
IT202100022508A1 (it) * 2021-08-30 2023-03-02 Dmi S R L Testina di misura diametri conici con doppio parallelogramma
KR20230152313A (ko) * 2022-04-27 2023-11-03 (주)티에스이 프로브의 돌출길이가 조정되는 프로브 헤드
KR20230152314A (ko) * 2022-04-27 2023-11-03 (주)티에스이 프로브의 돌출길이가 조정되는 프로브 헤드

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
US5175496A (en) * 1990-08-31 1992-12-29 Cray Research, Inc. Dual contact beam assembly for an IC test fixture
JPH04115167A (ja) * 1990-09-06 1992-04-16 Nec Corp 布線検査機用ピンヘッド
US5376889A (en) * 1991-10-10 1994-12-27 Hughes Aircraft Company System and method for detecting and locating flaws on or beneath a surface
JPH05340966A (ja) * 1992-06-05 1993-12-24 Fujitsu Ltd プローブカード
JP2799973B2 (ja) * 1995-07-06 1998-09-21 日本電子材料株式会社 垂直作動式プローブカード
KR0150334B1 (ko) * 1995-08-17 1998-12-01 남재우 수직형니들을 가지는 프로브카드 및 그 제조방법
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
JPH1138044A (ja) * 1997-07-17 1999-02-12 Mitsubishi Electric Corp 垂直型プローブカード装置
US6927586B2 (en) * 2000-03-06 2005-08-09 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device
JP3486841B2 (ja) * 2000-08-09 2004-01-13 日本電子材料株式会社 垂直型プローブカード
US20040135594A1 (en) * 2003-01-14 2004-07-15 Beaman Brian Samuel Compliant interposer assembly for wafer test and "burn-in" operations
CN100595598C (zh) * 2003-11-14 2010-03-24 温特沃斯实验室公司 带有集成装配辅助装置的模头
CN101019473A (zh) * 2004-05-20 2007-08-15 纳米纳克斯公司 具有快速制作周期的高密度互连系统
US20060066328A1 (en) * 2004-09-30 2006-03-30 Probelogic, Inc. Buckling beam probe test assembly
JP4860242B2 (ja) * 2005-11-11 2012-01-25 東京エレクトロン株式会社 プローブ装置
US7345492B2 (en) * 2005-12-14 2008-03-18 Microprobe, Inc. Probe cards employing probes having retaining portions for potting in a retention arrangement
US7365553B2 (en) 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
DE102007054187B4 (de) * 2006-11-27 2018-08-02 Feinmetall Gmbh Kontaktiervorrichtung zum Kontaktieren eines zu prüfenden elektrischen Prüflings sowie entsprechendes Kontaktierverfahren
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
KR101108726B1 (ko) 2010-01-26 2012-02-29 삼성전기주식회사 수평도 조절부재
KR101120405B1 (ko) * 2010-02-12 2012-03-20 리노공업주식회사 프로브 블록 조립체
JP2012103125A (ja) 2010-11-10 2012-05-31 Micronics Japan Co Ltd プローブカード

Also Published As

Publication number Publication date
TWI636259B (zh) 2018-09-21
WO2014167410A2 (en) 2014-10-16
MY177726A (en) 2020-09-23
TW201500740A (zh) 2015-01-01
EP2984492B1 (en) 2017-01-04
JP6416205B2 (ja) 2018-10-31
WO2014167410A3 (en) 2015-04-30
KR20150140774A (ko) 2015-12-16
PH12015502354A1 (en) 2016-02-22
CN105102990A (zh) 2015-11-25
EP2984492A2 (en) 2016-02-17
JP2016520816A (ja) 2016-07-14
PH12015502354B1 (en) 2016-02-22
KR102146512B1 (ko) 2020-08-24
ITMI20130561A1 (it) 2014-10-10
US9829508B2 (en) 2017-11-28
US20150309076A1 (en) 2015-10-29

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