SG11201500235XA - Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices - Google Patents

Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices

Info

Publication number
SG11201500235XA
SG11201500235XA SG11201500235XA SG11201500235XA SG11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA SG 11201500235X A SG11201500235X A SG 11201500235XA
Authority
SG
Singapore
Prior art keywords
devices
micromachines
composition
integrated circuit
manufacturing integrated
Prior art date
Application number
SG11201500235XA
Other languages
English (en)
Inventor
Andreas Klipp
Andrei Honciuc
Pancera Sabrina Montero
Zoltan Baan
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG11201500235XA publication Critical patent/SG11201500235XA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201500235XA 2012-07-16 2013-07-12 Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices SG11201500235XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261671806P 2012-07-16 2012-07-16
PCT/IB2013/055728 WO2014013396A2 (en) 2012-07-16 2013-07-12 Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices

Publications (1)

Publication Number Publication Date
SG11201500235XA true SG11201500235XA (en) 2015-02-27

Family

ID=49949313

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500235XA SG11201500235XA (en) 2012-07-16 2013-07-12 Composition for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices

Country Status (11)

Country Link
US (1) US20150192854A1 (zh)
EP (1) EP2875406A4 (zh)
JP (1) JP6328630B2 (zh)
KR (1) KR102107370B1 (zh)
CN (1) CN104471487B (zh)
IL (1) IL236457B (zh)
MY (1) MY171072A (zh)
RU (1) RU2015104902A (zh)
SG (1) SG11201500235XA (zh)
TW (1) TWI665177B (zh)
WO (1) WO2014013396A2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015028576A (ja) * 2013-07-01 2015-02-12 富士フイルム株式会社 パターン形成方法
KR102374206B1 (ko) 2017-12-05 2022-03-14 삼성전자주식회사 반도체 장치 제조 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4628023A (en) * 1981-04-10 1986-12-09 Shipley Company Inc. Metal ion free photoresist developer composition with lower alkyl quaternary ammonium hydrozide as alkalai agent and a quaternary ammonium compound as surfactant
JP3707856B2 (ja) * 1996-03-07 2005-10-19 富士通株式会社 レジストパターンの形成方法
JPH11218932A (ja) * 1997-10-31 1999-08-10 Nippon Zeon Co Ltd ポリイミド系感光性樹脂組成物用現像液
US6403289B1 (en) * 1997-10-31 2002-06-11 Nippon Zeon Co., Ltd. Developer for photosensitive polyimide resin composition
JP4265741B2 (ja) * 2003-02-28 2009-05-20 日本カーリット株式会社 レジスト剥離剤
JP3993549B2 (ja) * 2003-09-30 2007-10-17 株式会社東芝 レジストパターン形成方法
US7157213B2 (en) * 2004-03-01 2007-01-02 Think Laboratory Co., Ltd. Developer agent for positive type photosensitive compound
TWI391793B (zh) * 2005-06-13 2013-04-01 Tokuyama Corp 光阻顯影液、及使用該顯影液之基板的製造方法
JP5206304B2 (ja) * 2008-10-15 2013-06-12 東ソー株式会社 第四級アンモニウム塩の回収方法
EP2406212B1 (de) * 2009-03-12 2013-05-15 Basf Se Verfahren zur herstellung von 1-adamantyltrimethylammoniumhydroxid
RU2551841C2 (ru) * 2009-05-07 2015-05-27 Басф Се Композиции для удаления резиста и способы изготовления электрических устройств
TWI420571B (zh) * 2009-06-26 2013-12-21 羅門哈斯電子材料有限公司 形成電子裝置的方法
CN101993377A (zh) * 2009-08-07 2011-03-30 出光兴产株式会社 具有金刚烷骨架的胺类和季铵盐的制造方法
JP2011145557A (ja) * 2010-01-15 2011-07-28 Tokyo Ohka Kogyo Co Ltd フォトリソグラフィ用現像液
JP6213296B2 (ja) * 2013-04-10 2017-10-18 信越化学工業株式会社 現像液を用いたパターン形成方法

Also Published As

Publication number Publication date
KR20150042796A (ko) 2015-04-21
KR102107370B1 (ko) 2020-05-07
JP2015524577A (ja) 2015-08-24
MY171072A (en) 2019-09-24
US20150192854A1 (en) 2015-07-09
WO2014013396A3 (en) 2014-03-06
IL236457B (en) 2020-04-30
IL236457A0 (en) 2015-02-26
EP2875406A4 (en) 2016-11-09
RU2015104902A (ru) 2016-09-10
CN104471487B (zh) 2019-07-09
EP2875406A2 (en) 2015-05-27
TWI665177B (zh) 2019-07-11
CN104471487A (zh) 2015-03-25
WO2014013396A2 (en) 2014-01-23
TW201425279A (zh) 2014-07-01
JP6328630B2 (ja) 2018-05-23

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