SG10202012219TA - System for adjusting pad surface temperature and polishing apparatus - Google Patents

System for adjusting pad surface temperature and polishing apparatus

Info

Publication number
SG10202012219TA
SG10202012219TA SG10202012219TA SG10202012219TA SG10202012219TA SG 10202012219T A SG10202012219T A SG 10202012219TA SG 10202012219T A SG10202012219T A SG 10202012219TA SG 10202012219T A SG10202012219T A SG 10202012219TA SG 10202012219T A SG10202012219T A SG 10202012219TA
Authority
SG
Singapore
Prior art keywords
surface temperature
polishing apparatus
pad surface
adjusting pad
adjusting
Prior art date
Application number
SG10202012219TA
Inventor
Shuji Uozumi
Toru Maruyama
Mitsunori Komatsu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202012219TA publication Critical patent/SG10202012219TA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
SG10202012219TA 2019-12-09 2020-12-08 System for adjusting pad surface temperature and polishing apparatus SG10202012219TA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019221931A JP7236990B2 (en) 2019-12-09 2019-12-09 System and polishing equipment for adjusting the surface temperature of the pad

Publications (1)

Publication Number Publication Date
SG10202012219TA true SG10202012219TA (en) 2021-07-29

Family

ID=76209403

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202012219TA SG10202012219TA (en) 2019-12-09 2020-12-08 System for adjusting pad surface temperature and polishing apparatus

Country Status (5)

Country Link
US (1) US11992915B2 (en)
JP (1) JP7236990B2 (en)
KR (1) KR20210072721A (en)
SG (1) SG10202012219TA (en)
TW (1) TW202122208A (en)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6158447A (en) * 1997-09-09 2000-12-12 Tokyo Electron Limited Cleaning method and cleaning equipment
JP4051115B2 (en) * 1997-12-25 2008-02-20 不二越機械工業株式会社 Wafer polishing equipment
JP2001198801A (en) * 2000-01-21 2001-07-24 Matsushita Electric Ind Co Ltd Polishing device and polishing method
DE102007063232B4 (en) * 2007-12-31 2023-06-22 Advanced Micro Devices, Inc. Process for polishing a substrate
DE102009047926A1 (en) * 2009-10-01 2011-04-14 Siltronic Ag Process for polishing semiconductor wafers
JP6030980B2 (en) * 2013-03-26 2016-11-24 株式会社荏原製作所 Polishing apparatus temperature control system and polishing apparatus
JP6161999B2 (en) 2013-08-27 2017-07-12 株式会社荏原製作所 Polishing method and polishing apparatus
JP6198673B2 (en) * 2014-05-15 2017-09-20 株式会社神戸製鋼所 Thermal energy recovery device and control method
JP6263092B2 (en) * 2014-06-23 2018-01-17 株式会社荏原製作所 Temperature control system for polishing pad and substrate processing apparatus provided with the same
JP6929072B2 (en) 2016-02-22 2021-09-01 株式会社荏原製作所 Equipment and methods for adjusting the surface temperature of the polishing pad
JP2018122406A (en) * 2017-02-02 2018-08-09 株式会社荏原製作所 Heat exchanger for adjusting surface temperature of polishing pad, polishing device, polishing method and recording medium in which computer program is recorded
CN207877348U (en) * 2017-12-25 2018-09-18 重庆财信环境资源股份有限公司 Efficient aluminium salt medicine system
JP2019181607A (en) * 2018-04-06 2019-10-24 株式会社荏原製作所 Method for adjustment of surface temperature of abrasive pad, and polishing device
CN209485130U (en) * 2018-12-18 2019-10-11 上海丰律流体技术有限公司 A kind of constant flow water system of plate heat exchanger
CN110449081A (en) * 2019-09-04 2019-11-15 天津中环领先材料技术有限公司 A kind of polishing fluid configuration device and its control method

Also Published As

Publication number Publication date
US11992915B2 (en) 2024-05-28
JP7236990B2 (en) 2023-03-10
KR20210072721A (en) 2021-06-17
TW202122208A (en) 2021-06-16
US20210170545A1 (en) 2021-06-10
JP2021091019A (en) 2021-06-17

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