CN110449081A - A kind of polishing fluid configuration device and its control method - Google Patents
A kind of polishing fluid configuration device and its control method Download PDFInfo
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- CN110449081A CN110449081A CN201910831071.9A CN201910831071A CN110449081A CN 110449081 A CN110449081 A CN 110449081A CN 201910831071 A CN201910831071 A CN 201910831071A CN 110449081 A CN110449081 A CN 110449081A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/80—After-treatment of the mixture
- B01F23/811—Heating the mixture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F33/00—Other mixers; Mixing plants; Combinations of mixers
- B01F33/80—Mixing plants; Combinations of mixers
- B01F33/81—Combinations of similar mixers, e.g. with rotary stirring devices in two or more receptacles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/22—Control or regulation
- B01F35/2201—Control or regulation characterised by the type of control technique used
- B01F35/2206—Use of stored recipes for controlling the computer programs, e.g. for manipulation, handling, production or composition in mixing plants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/22—Control or regulation
- B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
- B01F35/2212—Level of the material in the mixer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/20—Measuring; Control or regulation
- B01F35/22—Control or regulation
- B01F35/221—Control or regulation of operational parameters, e.g. level of material in the mixer, temperature or pressure
- B01F35/2215—Temperature
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/716—Feed mechanisms characterised by the relative arrangement of the containers for feeding or mixing the components
- B01F35/7164—Feed mechanisms characterised by the relative arrangement of the containers for feeding or mixing the components the containers being placed in parallel before contacting the contents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/717—Feed mechanisms characterised by the means for feeding the components to the mixer
- B01F35/7176—Feed mechanisms characterised by the means for feeding the components to the mixer using pumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
- B01F35/717—Feed mechanisms characterised by the means for feeding the components to the mixer
- B01F35/71805—Feed mechanisms characterised by the means for feeding the components to the mixer using valves, gates, orifices or openings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/75—Discharge mechanisms
- B01F35/754—Discharge mechanisms characterised by the means for discharging the components from the mixer
- B01F35/7544—Discharge mechanisms characterised by the means for discharging the components from the mixer using pumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/75—Discharge mechanisms
- B01F35/754—Discharge mechanisms characterised by the means for discharging the components from the mixer
- B01F35/7547—Discharge mechanisms characterised by the means for discharging the components from the mixer using valves, gates, orifices or openings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
It includes rough polishing stoste group and rough polishing tempering tank that the present invention, which provides a kind of polishing fluid configuration device and its control method, rough polishing unit, and rough polishing stoste group is connected to rough polishing tempering tank, and rough polishing tempering tank is connected to polishing machine；It includes that essence throwing stoste group and essence throw tempering tank that essence, which throws unit, and essence throwing stoste group is thrown tempering tank with essence and is connected to, and essence is thrown tempering tank and is connected to polishing machine；Surface-active unit includes surface-active stoste group and surface-active tempering tank, and surface-active stoste group is connected to surface-active tempering tank, and surface-active tempering tank is connected to polishing machine；Pure water unit throws tempering tank with rough polishing tempering tank, essence and surface-active tempering tank is connected to；It is thrown in tempering tank and surface-active tempering tank in rough polishing tempering tank, essence and is equipped with circulating pump, circulating pump starts the cycle over work when starting to titrate stoste solute after the configuration of pure water solvent.The present invention can be automatically controled polishing fluid allocation ratio, improve silicon chip surface quality, high degree of automation, high production efficiency.
Description
Technical field
The invention belongs to semi-conductor silicon chip polishing technology fields, more particularly, to a kind of polishing fluid configuration device and its control
Method.
Background technique
Existing polishing fluid causes feeding mechanism overall cost because feeding mechanism takes up a large area and supply process is cumbersome
It is higher；Automatization level with liquid is low, mainly or manually matches liquid, not only will increase the workload of operator but also can not protect
The configuration precision for demonstrate,proving polishing fluid, seriously affects product quality, is unable to satisfy existing manufacturing requirements, restrict pushing away for batch production
Extensively, cause production cost higher.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of polishing fluid configuration device and its control methods, are especially adapted for use in silicon
The configuration device of polishing fluid in piece polishing process, solves in the prior art that polishing fluid configuration process is cumbersome, and the degree of automation is low
And the technical issues of configuration low precision, in order to improve silicon chip surface quality, reduce production cost, improve product matter
Amount.
In order to solve the above technical problems, the technical solution adopted by the present invention is that:
A kind of polishing fluid configuration device, comprising:
Rough polishing unit: including rough polishing stoste group and rough polishing tempering tank, for mixed configuration rough polishing liquid and will it is mixed slightly
Throwing liquid, which is delivered in polishing machine, to be used；The rough polishing stoste group is connected to the rough polishing tempering tank, the rough polishing tempering tank and institute
State polishing machine connection；
Essence throws unit: throwing stoste group including essence and essence throws tempering tank, for mixed configuration fine polishing liquid and by mixed essence
Throwing liquid, which is delivered in polishing machine, to be used；The essence is thrown stoste group and is connected to the essence throwing tempering tank, and the essence throws tempering tank and institute
State polishing machine connection；
Surface-active unit: including surface-active stoste group and surface-active tempering tank, it is used for mixed configuration surface-active
Agent and mixed surfactant is delivered in polishing machine uses；The surface-active stoste group and the surface-active are mixed
Bucket connection is closed, the surface-active tempering tank is connected to the polishing machine；
Pure water unit: it is connected to, is used for the rough polishing tempering tank, the essence throwing tempering tank and the surface-active tempering tank
Tempering tank is thrown to the rough polishing tempering tank, the essence and the surface-active tempering tank provides pure water solvent；
Stoste group, the surface-active stoste group, the rough polishing tempering tank, institute are thrown in the rough polishing stoste group, the essence
The output end for stating essence throwing tempering tank and the surface-active tempering tank is equipped with supply pump and control valve；
It throws in tempering tank and the surface-active tempering tank in the rough polishing tempering tank, the essence and is equipped with circulating pump, when
The circulating pump starts the cycle over work when starting to titrate stoste solute after the pure water solvent configuration；
Controller: connecting with the supply pump, the control valve and the circulating pump, for control the rough polishing unit,
The essence throws the working condition of unit, the surface-active unit and the pure water unit.
Further, the rough polishing stoste group includes rough polishing original liquid box and KOH original liquid box, the rough polishing original liquid box and described
KOH original liquid box is connected to the rough polishing tempering tank respectively.
Further, heater is equipped between the rough polishing tempering tank and polishing machine, it is mixed from the rough polishing for heating
Close the rough polishing liquid of bucket output.
Further, temperature sensor is equipped at the heater, the temperature sensor is connect with the controller,
To detect the temperature of the heater.
Further, the heter temperature is 22-26 DEG C.
Further, it throws in tempering tank and the surface-active tempering tank and is equipped in the rough polishing tempering tank, the essence
Liquid level sensor, to incude the rough polishing tempering tank, the essence throws pure water described in tempering tank and the surface-active tempering tank
Solvent levels.
Further, it includes that essence throws original liquid box that the essence, which throws stoste group, and it is one that the essence, which throws original liquid box quantity, and described
Essence throws tempering tank connection.
Further, the surface-active stoste group includes surface-active original liquid box, the surface-active original liquid box quantity
It is one, is connected to the surface-active tempering tank.
Further, the supply pump is unidirectional quantitative feed pump.
A kind of control method of polishing fluid configuration device, using described in any item configuration devices as above, steps are as follows:
S1: the rough polishing unit is configured；
S11: the pure water unit is input to the rough polishing tempering tank, and it is molten to control the pure water by the liquid level sensor
Height of the agent in the rough polishing tempering tank stops the pure water unit when pure water solvent reaches standard requirements and supplies water；
S12: the rough polishing original liquid box starts to input rough polishing stoste into the rough polishing tempering tank, while the circulating pump is opened
Beginning work；After rough polishing stoste supply, the KOH original liquid box starts to input KOH original into the rough polishing tempering tank
Liquid, the circulating pump keep working condition；
S2: the configuration essence throws unit；
S21: the pure water unit is input to the essence and throws tempering tank, and it is molten to control the pure water by the liquid level sensor
Agent throws the height in tempering tank in the essence, stops the pure water unit when pure water solvent reaches standard requirements and supplies water；
S22: the essence throwing original liquid box starts to throw input essence throwing stoste in tempering tank to the essence, while the circulating pump is opened
Beginning work；After to rough polishing stoste supply, the circulating pump keeps working condition；
S3: the surface-active unit is configured；
S31: the pure water unit is input to the surface-active tempering tank, is controlled by the liquid level sensor described pure
Height of the aqueous solvent in the surface-active tempering tank, stops the pure water list when pure water solvent reaches standard requirements
Member supplies water；
S32: the surface-active original liquid box starts to input surface-active stoste into the surface-active tempering tank, simultaneously
The circulating pump is started to work；After to surface-active stoste supply, the circulating pump keeps working condition.
The advantages and positive effects of the present invention are:
1, compared with prior art, the present invention proposes a kind of polishing fluid configuration device, by rationally designing rough polishing unit, essence
The configuration flow for throwing unit and surface-active unit, can be with the allocation ratio of whole-process automatic control polishing fluid, high degree of automation
And it is safely controllable, it can guarantee rough polishing liquid, fine polishing liquid and surfactant used in polishing machine completely, meet production standard need
It wants.
2, the temperature of rough polishing liquid is affected to entire polishing process in rough polishing unit, therefore specially one heater of setting is to thick
Throwing unit exports the rough polishing liquid into polishing machine and is heated, while being supervised by temperature of the temperature sensor to rough polishing liquid
Control, guarantee rough polishing liquid temperature it is constant be 22-26 DEG C, at this temperature rough polishing liquid can make silicon chip surface have complete lattice,
Higher flatness and cleanliness guarantee silicon chip surface quality.
Detailed description of the invention
Fig. 1 is a kind of polishing fluid configuration device of the embodiment of the present invention one.
In figure:
100, rough polishing unit 101, rough polishing tempering tank 102, rough polishing original liquid box
103, KOH original liquid box 104, circulating pump 105, supply pump
106, supply pump 107, supply pump 108, liquid level sensor
109, heater 110, temperature sensor 200, essence throw unit
201, essence throws tempering tank 202, essence throws original liquid box 203, circulating pump
204, supply pump 205, supply pump 206, liquid level sensor
300, surface-active unit 301, surface-active tempering tank 302, surface-active original liquid box
303, circulating pump 304, supply pump 305, supply pump
306, liquid level sensor 400, pure water unit 401, pure water pipe
402, pure water pipe 403, pure water pipe 500, polishing machine
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
A kind of polishing fluid configuration device, as shown in Figure 1, including rough polishing unit 100, essence throwing unit 200, surface-active unit
300, pure water unit 400 and controller.Wherein, rough polishing unit 100 includes rough polishing stoste group and rough polishing tempering tank 101, and rough polishing is former
Liquid group includes rough polishing original liquid box 102 and KOH original liquid box 103, and the quantity of rough polishing original liquid box 102 and KOH original liquid box 103 is one
It is a, and rough polishing original liquid box 102 and KOH original liquid box 103 are connected to by pipeline with rough polishing tempering tank 101 respectively.In pure water unit 400
The output end of pure water pipe 401 is connected to rough polishing tempering tank 101, the output end of rough polishing original liquid box 102 and KOH original liquid box 103 with
Rough polishing tempering tank 101 is connected to, and the output end of rough polishing tempering tank 101 is connected to polishing machine 500.Rough polishing unit 100 is matched for mixing
It sets by the KOH stoste mixing group in the rough polishing stoste and a certain amount of KOH original liquid box 103 in a certain amount of rough polishing original liquid box 102
At rough polishing solute, be mixed to form rough polishing liquid with a certain amount of pure water solvent is exported by pure water unit 400, and will be after mixing
Rough polishing liquid be delivered in polishing machine 500 and use.
It includes that essence throwing stoste group and essence throw tempering tank 201 that essence, which throws unit 200, and essence throwing stoste group includes that an essence throws original liquid box
202, essence throws the output end of original liquid box 202 and essence is thrown tempering tank 201 and is connected to, and essence throws the output end and polishing machine 500 of tempering tank 201
It is connected to, the output end of pure water pipe 402 is thrown tempering tank 201 with essence and is connected in pure water unit 400.Essence is thrown unit 200 and is matched for mixing
Set by it is a certain amount of essence throw original liquid box 202 in essence throw stoste is formed essence throwing solute with exported by pure water unit 400 it is a certain amount of
Pure water solvent carry out being mixed to form fine polishing liquid, and mixed fine polishing liquid is delivered in polishing machine 500 and is used.
Surface-active unit 300 includes surface-active stoste group and surface-active tempering tank 301, surface-active stoste group packet
Include a surface-active original liquid box 302, the output end and surface-active tempering tank 301 of surface-active original liquid box 302, surface-active
The output end of tempering tank 301 is connected to polishing machine 500, and the output end of pure water pipe 403 is mixed with surface-active in pure water unit 400
Bucket 301 is connected to.Surface-active unit 300 is for mixed configuration by the surface-active in a certain amount of surface-active stoste logical 302
The surface-active solute and a certain amount of pure water solvent is exported by pure water unit 400 carry out being mixed to form surface-active that stoste is formed
Agent, and mixed surfactant is delivered in polishing machine 500 and is used.
Pure water unit 400 respectively by pure water pipe 401, pure water pipe 402 and pure water pipe 403 successively with rough polishing tempering tank 101,
Essence is thrown tempering tank 201 and is connected to surface-active tempering tank 301, is additionally provided in pure water pipe 401, pure water pipe 402 and pure water pipe 403
Control valve, to control, pure water unit 400 throws tempering tank 201 to rough polishing tempering tank 101, essence and surface-active tempering tank 301 is defeated
Enter the start and stop of pure water solvent.It is thrown in tempering tank 201 and surface-active tempering tank 301 in rough polishing tempering tank 101, essence and is successively arranged liquid
Level sensor 108, liquid level sensor 206 and liquid level sensor 306 are respectively induced rough polishing tempering tank 101, essence throws tempering tank 201
Whether meet the requirements with pure water solvent levels in surface-active tempering tank 301.
In the present embodiment, rough polishing original liquid box 102, KOH original liquid box 103, essence throw original liquid box 202, surface-active original liquid box
302, rough polishing tempering tank 101, essence throw tempering tank 201 and the output end of surface-active tempering tank 301 is equipped with supply pump and control
Valve, supply pump and control valve can be with the working conditions of the corresponding bucket liquid of real-time control.
It is thrown in tempering tank 201 and surface-active tempering tank 301 in rough polishing tempering tank 101, essence and is successively arranged circulating pump
104, circulating pump 203 and circulating pump 303, circulating pump 104, circulating pump 203 and circulating pump 303 pass through solenoid valve control start and stop,
Circulating pump starts the cycle over work when starting to titrate stoste solute after the pure water solvent configuration in tempering tank.
Controller is the PLC controller (figure omits) of polishing machine 500, and (figure omits) is arranged on the housing wall of polishing machine,
Connect with all supply pumps, control valve, circulating pump and liquid level sensor, for control rough polishing unit 100, essence throw unit 200,
The working condition of surface-active unit 300 and pure water unit 400.
Further, heater 109 is equipped between rough polishing tempering tank 101 and polishing machine 500, it is mixed from rough polishing for heating
Close the rough polishing liquid that bucket 101 exports.Temperature sensor 110 is equipped at heater 109, temperature sensor 110 is connect with controller, is used
To detect the temperature of heater 109, and then control the temperature for the rough polishing liquid being delivered in polishing machine 500.In rough polishing unit 100
In, the temperature of rough polishing liquid is affected to entire polishing process, therefore it is defeated to rough polishing unit 100 that a heater 109 need to specially be arranged
It send the rough polishing liquid into polishing machine 500 to be heated, while being monitored by temperature of the temperature sensor 110 to rough polishing liquid,
Guarantee rough polishing liquid temperature it is constant be 22-26 DEG C, rough polishing liquid can make silicon chip surface have complete lattice, higher at this temperature
Flatness and cleanliness, guarantee silicon chip surface quality.
In the present embodiment, all supply pumps are unidirectional quantitative feed pump, prevent solution occur because of artificial maloperation
Reflux.Wherein, supply pump, control valve and liquid level sensor are common spare and accessory parts, and the model of circulating pump can be according to each tempering tank
Size depending on, equal not concrete restriction herein.
A kind of control method of polishing fluid configuration device, for described in any item configuration devices as above, steps are as follows:
S1: configuration rough polishing unit 100
When configuring the rough polishing liquid in rough polishing unit, essence, which throws unit 200 and surface-active unit 300, to be matched simultaneously
It sets, but need to guarantee that essence throws the control valve of the control valve of the output end of tempering tank 201 and the output end of surface-active tempering tank 301
It is in off state, the configuration for throwing unit 200 and surface-active unit 300 for essence can be described in detail later, omit herein.Rough polishing list
Member 100 configuration specifically:
S11: the control valve that controller controls the pure water pipe 401 in pure water unit 400 is open state, and pure water solvent is defeated
Enter into rough polishing tempering tank 101；The supply pump 106 of rough polishing original liquid box 102 and output end control valve and KOH original liquid box at this time
103 supply pump 107 and output end control valve is in off state, while the circulating pump 104 in rough polishing tempering tank 101, supply
Pump 106 and output end control valve are in off state.Controller controls the pure of the output of pure water pipe 401 by liquid level sensor 108
Aqueous solvent is within the scope of the calibrated altitude in rough polishing tempering tank 101, when pure water solvent reaches a certain amount of, stops pure water unit
The corresponding control valve of pure water pipe 401 is closed in the water supply of pure water pipe 401 in 400.
S12: controller controls supply pump 106 and the unlatching of its control valve in rough polishing original liquid box 102, starts to mix to rough polishing
Rough polishing stoste is inputted in bucket 101, circulating pump 104 is synchronous to start to work, and circulating pump 104 keeps working condition, purpose ever since
It is to guarantee that the rough polishing liquid in rough polishing tempering tank 101 is uniformly mixed, is sufficiently stirred, with the uniformity and stabilization for keeping rough polishing liquid to mix
Property.After supply pump 106 supplies the rough polishing stoste in rough polishing original liquid box 102 according to allocation ratio, supply pump 106 stops work
Make and corresponding control valve disconnects；At this point, the supply pump 107 of KOH original liquid box 103 is opened, start to input into rough polishing tempering tank 101
KOH stoste, after supply pump 107 supplies the KOH stoste in KOH original liquid box 103 according to allocation ratio, supply pump 107 is stopped
It only works and corresponding control valve disconnects.The recycling of circulating pump 104 in rough polishing tempering tank 101 can be used after a certain period of time.In
In the present embodiment, the allocation ratio of rough polishing stoste and KOH stoste and pure water, according to the actual situation depending on, do not do herein specific
Limitation；How long stirring need to be recycled accordingly for mixed rough polishing liquid, need to be set according to the allocation ratio of rough polishing liquid
It is fixed, it omits herein.
After to the configuration of rough polishing liquid, when rough polishing liquid being begun to use to be polished, controller opens supply pump 105 and its control
Valve processed, while heater 109 and temperature sensor 110 are opened and guarantee that the temperature of heater 109 is set in 22-26 DEG C, rough polishing
Liquid becomes the polishing fluid of temperature constant state when flowing through heater 109 by pipeline, then flows into polishing machine through pipeline and use, circulating pump
104 are always maintained at open state.Constant rough polishing liquid temperature is 22-26 DEG C, and rough polishing liquid can be such that silicon chip surface has at this temperature
There are complete lattice, higher flatness and cleanliness, guarantees silicon chip surface quality.
S2: configuration essence throws unit 200
When configuration essence throws the fine polishing liquid in unit 200, specifically:
S21: the control valve that controller controls the pure water pipe 402 in pure water unit 400 is open state, and pure water solvent is defeated
Enter to essence and throws in tempering tank 201；Essence throws the supply pump 205 of original liquid box 202 at this time and output end control valve is in off state, simultaneously
Circulating pump 203, supply pump 204 and the output end control valve that essence is thrown in tempering tank 201 are in off state.Controller passes through liquid level
Sensor 206 controls the pure water solvent that pure water pipe 401 exports and throws the calibrated altitude in tempering tank 201 in essence, reaches to pure water solvent
When to a certain range, stop the water supply of pure water pipe 402 in pure water unit 400, closes the corresponding control valve of pure water pipe 402.
S22: after the control valve of pure water pipe 402 is closed, while controller control essence throws the supply pump 205 in original liquid box 202
It is opened with its control valve, starts to throw input essence in tempering tank 201 to essence and throw stoste, circulating pump 203 is synchronous to start to work, circulating pump
203 keep working condition ever since, it is therefore an objective to guarantee that essence throws the fine polishing liquid in tempering tank 201 and is uniformly mixed and stablizes.Supply
After essence is thrown the essence throwing stoste supply in original liquid box 202 according to allocation ratio by pump 205, supply pump 205 stops working and phase
Control valve is answered to disconnect.At this point, essence throws the recycling of circulating pump 203 in tempering tank 201 after a certain period of time, that is, can be used.In this reality
It applies in example, essence throws the allocation ratio of stoste and pure water and need to recycle how long stirring omits to mixed fine polishing liquid, according to
Depending on actual conditions.
After to fine polishing liquid configuration, when fine polishing liquid being begun to use to be polished, controller opens supply pump 204 and its control
Valve processed, while the control valve of the output end of rough polishing unit 100 and surface-active unit 300 is in off state, because of polishing machine 500
To the equal no requirement (NR) of the temperature of fine polishing liquid and surfactant, so there is no need to which heater is arranged, the fine polishing liquid in tempering tank 201 is thrown from essence
Polishing machine 500 is flowed into through pipeline to use.After knowing that the configuration flow of fine polishing liquid simplifies process, configuration structure design is simple and easy
Control automatically configures fine polishing liquid and the allocation ratio of fine polishing liquid is made to comply fully with requirement, meets production needs, also improves production effect
Rate, economize on resources waste, thereby reduces production cost.
S3: configuration surface activity unit 300
Specifically:
S31: the control valve that controller controls pure water pipe 403 is open state, and pure water solvent is input to surface-active and is mixed
It closes in bucket 301；The supply pump 305 of surface-active original liquid box 302 and output end control valve are in off state at this time, while surface is living
Circulating pump 303, supply pump 304 and output end control valve in property tempering tank 301 are in off state.Controller is passed by liquid level
Sensor 306 controls calibrated altitude of the pure water solvent of the output of pure water pipe 403 in surface-active tempering tank 301, to pure water solvent
When reaching a certain range, stop the water supply of pure water pipe 403 in pure water unit 400, closes the corresponding control valve of pure water pipe 403.
S32: after the control valve of pure water pipe 403 is closed, while the supply pump in controller control surface-active original liquid box 302
305 open with its control valve, start to input surface-active stoste into surface-active tempering tank 301, circulating pump 303, which synchronizes, to be started
Work, circulating pump 303 keep working condition ever since, it is therefore an objective to guarantee the surfactant in surface-active tempering tank 301
It is uniformly mixed and stablizes.Supply pump 305 is according to allocation ratio by the surface-active stoste in surface-active original liquid box 302 for giving
Bi Hou, supply pump 305 stops working and corresponding control valve disconnects.At this point, the circulating pump 203 in surface-active tempering tank 301 is again
Circulation after a certain period of time, can begin to use.In the present embodiment, the allocation ratio of surface-active stoste and pure water and to mixed
Surfactant after conjunction need to recycle stirring how long omit, according to the actual situation depending on.
After to surfactant configuration, when surfactant being begun to use to be polished, controller opens supply pump
304 and its control valve, while the control valve of rough polishing unit 100 and the essence output end of throwing unit 200 is in off state, from surface
Surfactant in active tempering tank 301 flows into polishing machine 500 through pipeline and uses.Know the configuration flow of surfactant
Simple and controllable, the surfactant automatically configured complies fully with production standard requirements, has not only prevented artificial maloperation and has generated
Security risk, and also ensure the quality of production, shorten setup time, improve production efficiency.
The advantages and positive effects of the present invention are:
1, compared with prior art, the present invention proposes a kind of polishing fluid configuration device, by rationally designing rough polishing unit, essence
The configuration flow for throwing unit and surface-active unit, can be with the allocation ratio of whole-process automatic control polishing fluid, high degree of automation
And it is safely controllable, it can guarantee rough polishing liquid, fine polishing liquid and surfactant used in polishing machine completely, meet production standard need
It wants.
2, the temperature of rough polishing liquid is affected to entire polishing process in rough polishing unit, therefore specially one heater of setting is to thick
Throwing unit exports the rough polishing liquid into polishing machine and is heated, while being supervised by temperature of the temperature sensor to rough polishing liquid
Control, guarantee rough polishing liquid temperature it is constant be 22-26 DEG C, at this temperature rough polishing liquid can make silicon chip surface have complete lattice,
Higher flatness and cleanliness guarantee silicon chip surface quality.
The embodiments of the present invention have been described in detail above, content is only the preferred embodiment of the present invention, no
It can be believed to be used to limit the scope of the invention.Any changes and modifications in accordance with the scope of the present application,
It should still fall within the scope of the patent of the present invention.
Claims (10)
1. a kind of polishing fluid configuration device characterized by comprising
Rough polishing unit: including rough polishing stoste group and rough polishing tempering tank, for mixed configuration rough polishing liquid and by mixed rough polishing liquid
It is delivered in polishing machine and uses；The rough polishing stoste group is connected to the rough polishing tempering tank, the rough polishing tempering tank and the throwing
Ray machine connection；
Essence throws unit: throwing stoste group including essence and essence throws tempering tank, for mixed configuration fine polishing liquid and by mixed fine polishing liquid
It is delivered in polishing machine and uses；The essence is thrown stoste group and is connected to the essence throwing tempering tank, and the essence throws tempering tank and the throwing
Ray machine connection；
Surface-active unit: including surface-active stoste group and surface-active tempering tank, simultaneously for mixed configuration surfactant
Mixed surfactant is delivered in polishing machine and is used；The surface-active stoste group and the surface-active tempering tank
Connection, the surface-active tempering tank are connected to the polishing machine；
Pure water unit: it is connected to, is used for institute with the rough polishing tempering tank, the essence throwing tempering tank and the surface-active tempering tank
State rough polishing tempering tank, the essence throws tempering tank and the surface-active tempering tank provides pure water solvent；
Stoste group, the surface-active stoste group, the rough polishing tempering tank, the essence are thrown in the rough polishing stoste group, the essence
The output end for throwing tempering tank and the surface-active tempering tank is equipped with supply pump and control valve；
It throws in tempering tank and the surface-active tempering tank in the rough polishing tempering tank, the essence and is equipped with circulating pump, when described
The circulating pump starts the cycle over work when starting to titrate stoste solute after the configuration of pure water solvent；
Controller: connecting with the supply pump, the control valve and the circulating pump, for controlling the rough polishing unit, described
Essence throws the working condition of unit, the surface-active unit and the pure water unit.
2. a kind of polishing fluid configuration device according to claim 1, which is characterized in that the rough polishing stoste group includes rough polishing
Original liquid box and KOH original liquid box, the rough polishing original liquid box and the KOH original liquid box are connected to the rough polishing tempering tank respectively.
3. a kind of polishing fluid configuration device according to claim 2, which is characterized in that in the rough polishing tempering tank and polishing
Heater is equipped between machine, for heating the rough polishing liquid exported from the rough polishing tempering tank.
4. a kind of polishing fluid configuration device according to claim 3, which is characterized in that be equipped with temperature at the heater
Sensor, the temperature sensor are connect with the controller, to detect the temperature of the heater.
5. a kind of polishing fluid configuration device according to claim 4, which is characterized in that the heter temperature is 22-26
℃。
6. a kind of polishing fluid configuration device according to claim 1-5, which is characterized in that mixed in the rough polishing
Bucket, the essence throw in tempering tank and the surface-active tempering tank and are equipped with liquid level sensor, with incude the rough polishing tempering tank,
The essence throws pure water solvent levels described in tempering tank and the surface-active tempering tank.
7. a kind of polishing fluid configuration device according to claim 6, which is characterized in that it includes that essence is thrown that the essence, which throws stoste group,
Original liquid box, it is one that the essence, which throws original liquid box quantity, throws tempering tank with the essence and is connected to.
8. a kind of polishing fluid configuration device according to claim 7, which is characterized in that the surface-active stoste group includes
Surface-active original liquid box, the surface-active original liquid box quantity are one, are connected to the surface-active tempering tank.
9. -5, a kind of described in any item polishing fluid configuration devices of 7-8 according to claim 1, which is characterized in that the supply pump
For unidirectional quantitative feed pump.
10. a kind of control method of polishing fluid configuration device, using configuration device as claimed in any one of claims 1-9 wherein,
It is characterized in that, steps are as follows:
S1: the rough polishing unit is configured；
S11: the pure water unit is input to the rough polishing tempering tank, controls the pure water solvent by the liquid level sensor and exists
Height in the rough polishing tempering tank stops the pure water unit when pure water solvent reaches standard requirements and supplies water；
S12: the rough polishing original liquid box starts to input rough polishing stoste into the rough polishing tempering tank, while the circulating pump starts work
Make；After rough polishing stoste supply, the KOH original liquid box starts to input KOH stoste, institute into the rough polishing tempering tank
It states circulating pump and keeps working condition；
S2: the configuration essence throws unit；
S21: the pure water unit is input to the essence and throws tempering tank, controls the pure water solvent by the liquid level sensor and exists
The essence throws the height in tempering tank, stops the pure water unit when pure water solvent reaches standard requirements and supplies water；
S22: the essence throwing original liquid box starts to throw input essence throwing stoste in tempering tank to the essence, while the circulating pump starts work
Make；After to rough polishing stoste supply, the circulating pump keeps working condition；S3: the surface-active unit is configured；
S31: the pure water unit is input to the surface-active tempering tank, and it is molten to control the pure water by the liquid level sensor
Height of the agent in the surface-active tempering tank stops the pure water unit when pure water solvent reaches standard requirements and supplies
Water；
S32: the surface-active original liquid box starts to input surface-active stoste into the surface-active tempering tank, while described
Circulating pump is started to work；After to surface-active stoste supply, the circulating pump keeps working condition.
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| CN201910831071.9A CN110449081A (en) | 2019-09-04 | 2019-09-04 | A kind of polishing fluid configuration device and its control method |
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| CN201910831071.9A CN110449081A (en) | 2019-09-04 | 2019-09-04 | A kind of polishing fluid configuration device and its control method |
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| US20210170545A1 (en) * | 2019-12-09 | 2021-06-10 | Ebara Corporation | System for adjusting pad surface temperature and polishing apparatus |
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