CN110509173A - A kind of polishing fluid recyclable device and its control method - Google Patents
A kind of polishing fluid recyclable device and its control method Download PDFInfo
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- CN110509173A CN110509173A CN201910831069.1A CN201910831069A CN110509173A CN 110509173 A CN110509173 A CN 110509173A CN 201910831069 A CN201910831069 A CN 201910831069A CN 110509173 A CN110509173 A CN 110509173A
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- 238000005498 polishing Methods 0.000 title claims abstract description 387
- 239000012530 fluid Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 19
- 239000007788 liquid Substances 0.000 claims abstract description 322
- 238000005496 tempering Methods 0.000 claims abstract description 80
- 238000004064 recycling Methods 0.000 claims abstract description 46
- 238000011084 recovery Methods 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 47
- 238000012797 qualification Methods 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 8
- 238000001914 filtration Methods 0.000 claims description 6
- 230000008676 import Effects 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 26
- 229910052710 silicon Inorganic materials 0.000 abstract description 26
- 239000010703 silicon Substances 0.000 abstract description 26
- 238000013461 design Methods 0.000 abstract description 8
- 238000007517 polishing process Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000012544 monitoring process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000000084 colloidal system Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910020489 SiO3 Inorganic materials 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- -1 silicate ion Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/01—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
- B01D29/03—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements self-supporting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D29/00—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
- B01D29/50—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition
- B01D29/56—Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
- F24H9/1809—Arrangement or mounting of grates or heating means for water heaters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/20—Arrangement or mounting of control or safety devices
- F24H9/2007—Arrangement or mounting of control or safety devices for water heaters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
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- Mechanical Engineering (AREA)
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- Thermal Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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Abstract
The present invention provides a kind of polishing fluid recyclable device, including rough polishing unit and recovery unit, and rough polishing unit includes rough polishing liquid tempering tank and rough polishing liquid buffer barrel, and rough polishing liquid buffer barrel input terminal is connected to rough polishing liquid tempering tank, and output end is connected to polishing machine；Recovery unit includes rough polishing liquid recycling bin, PH detector, turning barrel and KOH original liquid box in rough polishing liquid, rough polishing liquid recycling bin is connected to polishing machine output end, PH detector input terminal is connected to rough polishing liquid recycling bin output end, and PH detector output end is connected to the input terminal of turning barrel in rough polishing liquid tempering tank and rough polishing liquid respectively；KOH original liquid box output end is connected to turning barrel in rough polishing liquid and rough polishing tempering tank input terminal respectively.The present invention also proposes a kind of control method of polishing fluid recyclable device.The rough polishing liquid recyclable device that the present invention designs, reasonable in design and controllability is high, and rough polishing liquid PH is stable and recovery utilization rate is high, and silicon chip surface flatness consistency is good, high degree of automation, high production efficiency.
Description
Technical field
The invention belongs to semi-conductor silicon chip polissoir technical field, more particularly, to a kind of polishing fluid recyclable device and its
Control method.
Background technique
The semi-conductor silicon chip of existing production is all conventional small size, and size range is within 200mm, and with semiconductor
The raising that technology requires cost control and product technology gradually researches and develops large-sized silicon wafers and substitutes existing small size silicon wafer, greatly
The size of size silicon wafer is 200mm and 300mm.Existing common polishing mode is chemically mechanical polishing, and rough polishing liquid is polished
First procedure of journey can generally recycle use, fine polishing liquid and surfactant because usage amount is small, make because usage amount is big
With rear general direct emission.And with the increase of die size, the allocation ratio of the rough polishing liquid needed is more accurate, rough polishing liquid
PH directly affects the particle size of silica colloid particle in polishing fluid, and the partial size of colloidal solid is direct during the polishing process
The flatness of silicon wafer is influenced, it is most important during the polishing process.The feeding mechanism of existing polishing fluid takes up a large area and rough polishing
The recovery structure of liquid designs the effective monitoring that unreasonable and process is cumbersome, when lacking for the recycling of rough polishing liquid, leads to rough polishing
Liquid recovery utilization rate is low and PH is unstable, and the unstable partial size that will lead to the silica colloid particle in polishing fluid of PH becomes
Change, and silica colloid particle change of size, silicon chip surface flatness can be caused to change, and then silicon chip surface is caused to be thrown
The flatness consistency of light is poor, causes rough polishing liquid usage amount larger, and waste is serious, not can guarantee the configuration precision of rough polishing liquid,
Seriously affect product quality.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of polishing fluid recyclable device and its control method, it is especially adapted for use in big
The recycling of size silicon wafer rough polishing liquid configures, and solving recovery structure in the prior art, to design unreasonable and process cumbersome, lacks pair
Effective monitoring when rough polishing liquid is recycled, leads to that rough polishing liquid recovery utilization rate is low and PH is unstable, PH is unstable to be will lead to
The partial size of silica colloid particle in polishing fluid changes, and then can cause the flatness one so that silicon chip surface polishing
Cause property is poor, causes rough polishing liquid usage amount larger, wastes serious technical problem.
In order to solve the above technical problems, the technical solution adopted by the present invention is that:
A kind of polishing fluid recyclable device, including rough polishing unit and recovery unit, the rough polishing unit include the mixing of rough polishing liquid
Bucket and rough polishing liquid buffer barrel, the rough polishing liquid buffer barrel input terminal are connected to the rough polishing liquid tempering tank, output end and polishing machine
Connection；The recovery unit includes rough polishing liquid recycling bin, PH detector, turning barrel and KOH original liquid box in rough polishing liquid, the rough polishing liquid
Recycling bin is connected to the polishing machine output end, and the PH detector input terminal is connected to the rough polishing liquid recycling bin output end,
The PH detector output end is connected to the input terminal of turning barrel in the rough polishing liquid tempering tank and the rough polishing liquid respectively；It is described
KOH original liquid box output end is connected to turning barrel in the rough polishing liquid and the rough polishing tempering tank input terminal respectively.
Further, the rough polishing stoste group further includes rough polishing original liquid box and pure water source, the rough polishing original liquid box and described
Pure water source output terminal is connected to the rough polishing tempering tank input terminal.
Further, it is equipped with circulating pump in the rough polishing liquid tempering tank, starts to drip after pure water source configuration
When determining the stoste in the rough polishing original liquid box, synchronous start to work of the circulating pump simultaneously continues to keep working condition.
Further, heater and temperature sensor, institute are equipped between the rough polishing liquid buffer barrel and the polishing machine
Stating heter temperature is 22-26 DEG C.
Further, it is equipped in the rough polishing tempering tank, the rough polishing liquid buffer barrel and the rough polishing liquid recycling bin
Liquid level sensor；The rough polishing tempering tank, the rough polishing liquid buffer barrel, the rough polishing liquid recycling bin, the KOH original liquid box,
The output end of the rough polishing original liquid box is equipped with unidirectional quantitative feed pump and control valve.
Further, filter device is additionally provided in the rough polishing liquid recycling bin, the filter device is located at the rough polishing
The upper end of liquid recycling bin.
It further, further include that essence throws unit and surface-active unit, the essence is thrown unit and is connected to the polishing machine, uses
It is used in the mixed configuration fine polishing liquid and fine polishing liquid is delivered in polishing machine；The surface-active unit and the polishing machine
Connection is used for the mixed configuration surfactant and surfactant is delivered in polishing machine.
A kind of polishing fluid recyclable device control method, using recyclable device as described above, including successively by the pure water
Source, the rough polishing original liquid box and the KOH original liquid box are input to rough polishing liquid described in the rough polishing liquid tempering tank mixed configuration, and protect
Demonstrate,prove pure water source, the volume ratio of rough polishing stoste and KOH stoste are as follows: (15-30): 1:(0.1-0.9)；The rough polishing liquid is followed by institute
It states to enter in the polishing machine after rough polishing liquid buffer barrel and the heater and use.
Further, it imports from the useless rough polishing liquid that the polishing machine flows out to the rough polishing liquid recycling bin, passes through
Rough polishing liquid, which enters, after the filter device filtering carries out PH detection in the PH detector, the rough polishing liquid of PH qualification flows directly into institute
It states in rough polishing liquid tempering tank.
Further, the underproof rough polishing liquid of PH imports in the rough polishing liquid in turning barrel, then in the KOH original liquid box
The KOH stoste mixing, and make the mixed rough polishing liquid PH 10.5-11.5, then flow into the rough polishing liquid tempering tank.
Compared with prior art, the present invention proposes a kind of polishing fluid recyclable device, and structure design is simple and controllable, by returning
Receive unit and recycle used rough polishing liquid, at the same using PH detector can judge in advance rough polishing mixed liquor after the recovery PH whether
Reach standard requirements, if qualification continues to use, if it is unqualified, then by being flowed into rough polishing with after KOH stoste mixed configuration again
In liquid tempering tank, all process safeties and automatic monitoring can guarantee the quality of rough polishing liquid used in circulation and stress, in turn completely
It can ensure that the consistency of silicon chip surface flatness.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of polishing fluid recyclable device of the embodiment of the present invention one；
Fig. 2 is the structural schematic diagram of the filter device of the embodiment of the present invention one.
In figure:
100, rough polishing unit 101, rough polishing tempering tank 102, rough polishing original liquid box
103, KOH original liquid box 104, rough polishing liquid buffer barrel 105, circulating pump
106, heater 107, temperature sensor 200, essence throw unit
201, essence throws tempering tank 202, essence throws original liquid box 203, circulating pump
300, surface-active unit 301, surface-active tempering tank 302, surface-active original liquid box
303, circulating pump 400, pure water source 401, pure water pipe
402, pure water pipe 403, pure water pipe 500, polishing machine
600, recovery unit 601, rough polishing liquid recycling bin 602, PH detector
603, turning barrel 604, filter device 6041, gross porosity diameter filter screen in rough polishing liquid
6042, fine pore filter screen 700, liquid level sensor
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
A kind of polishing fluid recyclable device, as shown in Figure 1, including rough polishing unit 100, recovery unit 600 and pure water source 400.
Rough polishing unit 100 is for mixed configuration by the rough polishing stoste in rough polishing original liquid box 102, the KOH stoste in KOH original liquid box 103
The rough polishing liquid being mixed to form with the pure water exported by pure water source 400, and mixed rough polishing liquid is delivered to polishing machine 500
Middle use, the volume ratio of pure water, rough polishing stoste and KOH stoste are as follows: (15-30): 1:(0.1-0.9), and guarantee that rough polishing liquid PH is
10.5-11.5.Rough polishing unit 100 includes rough polishing tempering tank 101, rough polishing original liquid box 102, KOH original liquid box 103 and rough polishing liquid buffering
The quantity of bucket 104, rough polishing original liquid box 102 and KOH original liquid box 103 is one, rough polishing original liquid box 102 and KOH original liquid box 103
Output end passes through pipeline respectively and is connected to the input terminal of rough polishing tempering tank 101, in pure water source 400 output end of pure water pipe 401 with
The input terminal of rough polishing tempering tank 101 is connected to, and the output end of rough polishing tempering tank 101 is connected to rough polishing buffer barrel 104, rough polishing buffer barrel
104 output end is connected to polishing machine 500.
Heater 106 and temperature sensor 107, heater are equipped between rough polishing liquid buffer barrel 104 and polishing machine 500
106 for heating the rough polishing liquid exported from rough polishing liquid buffer barrel 104, and 106 temperature of heater is 22-26 DEG C, temperature sensor 107
To detect the temperature of rough polishing liquid.In rough polishing unit 100, the temperature of rough polishing liquid is affected to entire polishing process, therefore needs
One heater 106 of special setting heats the rough polishing liquid that rough polishing unit 100 is delivered in polishing machine 500, while passing through temperature
Degree sensor 107 is monitored the temperature of rough polishing liquid, and constant guarantee rough polishing liquid temperature is 22-26 DEG C, at this temperature slightly
Throwing liquid can make silicon chip surface have complete lattice, higher flatness and cleanliness, guarantee silicon chip surface quality.
In the present embodiment, pure water is first first inputted in rough polishing liquid tempering tank 101, is opened after pure water amount reaches standard requirements
Begin the KOH stoste inputted in rough polishing stoste and KOH original liquid box in rough polishing original liquid box 102, while being arranged in rough polishing liquid tempering tank
Circulating pump 105 in 101, which synchronizes, starts the cycle over work, and is always maintained at unlatching work in mixed configuration and production process hereafter
Make state, the use of circulating pump 105 can guarantee the rough polishing liquid stirring in rough polishing liquid tempering tank sufficiently, and then guarantee the equal of rough polishing liquid
One and stability.After the completion of rough polishing stoste and KOH stoste are inputted according to allocation ratio, rough polishing liquid mixed configuration is finished.Mixing
Rough polishing liquid afterwards is temporary in rough polishing liquid buffer barrel 104 from flowing into rough polishing liquid tempering tank 101 through piping, then heated device 106
It is used by pipeline into polishing machine 500 after heating.In the present embodiment, the model of circulating pump 105 can be according to tempering tank
Size depending on, do not require herein.
Recovery unit 600 includes turning barrel 603 and KOH original liquid box in rough polishing liquid recycling bin 601, PH detector 602, rough polishing liquid
103, rough polishing liquid recycling bin 601 is connected to the output end of polishing machine 500, the input terminal and rough polishing liquid recycling bin of PH detector 602
601 output end connection, the output end of PH detector 602 respectively in rough polishing liquid tempering tank 101 and rough polishing liquid turning barrel 603 it is defeated
Enter end connection.The output end of KOH original liquid box 103 is connected to the input terminal of turning barrel 603 in rough polishing liquid respectively.
The useless rough polishing liquid exported from polishing machine 500 is set the filter device 604 in 601 upper end of rough polishing liquid recycling bin
It is flowed into after filtering in rough polishing liquid recycling bin 601, filter device 604 is multistage filtering net, as shown in Fig. 2, including setting up and down
Gross porosity diameter filter screen 6041 and fine pore filter screen 6042.Because during the polishing process, silicon and hydroxide ion react life
At silicate ion, and silicate example can be adsorbed by the colloid in coarse granule, therefore in waste liquid, only exist the different glue of partial size
Body particle.Gross porosity diameter filter screen 6041 may filter that the colloidal solid of the bulky grain diameter in waste liquid, in gross porosity diameter filter screen 6041
Aperture be 50-100 mesh；Fine pore filter screen 6042 may filter that the colloidal solid of waste liquid small particles diameter, only remaining filtering
Rough polishing liquid stream afterwards enters in rough polishing liquid recycling bin 601, and the aperture in fine pore filter screen 6042 is 200-300 mesh.
During the polishing process, the silicon of silicon chip surface, in rough polishing liquid hydroxide ion and water participation react, reaction from
Sub- equation are as follows:
Si+2OH-+H2O→SiO3 2-+2H2↑
Progress with polishing process can be learnt by reaction equation, hydroxide ion is gradually consumed, polishes at this time
The PH of process will weaken, and the polishing speed of polishing fluid reduces, and the PH of polishing fluid will change, and the partial size of polishing fluid also will therewith
Become larger.Therefore need to be determined with PH detector real-time monitoring hydroxyl from the waste liquid that 601 output end of rough polishing liquid recycling bin exports from
Whether sub- concentration is in the range of 10.5-11.5.If the result for the PH that PH detector 602 is tested is qualified, directly will be after qualification
Waste liquid flow into rough polishing liquid tempering tank 101；If the result for the PH that PH detector 602 is tested is unqualified, PH detector 602
Test result information is fed back in external controller (figure omits), controller calculates need according to the calculation formula that system is arranged
The content for the KOH to be configured, this is setting commonly used in the art, and transmission of feedback information to setting is supplied in KOH original liquid box 103
In pump, 103 supply pump of KOH original liquid box is mixed further according to needing to carry out input KOH stoste in turning barrel 604 into rough polishing liquid in time
It closes, mixed rough polishing liquid is flowed into again in rough polishing liquid tempering tank 101.In the present embodiment, the model of PH detector 602 used
CPM223-MR0005。
PH detector 602 summarizes in removal process is always maintained at open state, and the PH of real-time monitoring recovered liquid simultaneously leads in time
It crosses controller and feeds back to 103 supply pump of KOH original liquid box, input it quantitatively in turning barrel 603 into underproof recycling rough polishing liquid
KOH stoste to be supplemented guarantees the PH of the rough polishing liquid flowed into rough polishing liquid tempering tank 101 within the scope of 10.5-11.5.
Have above-mentioned it is found that the setting of rough polishing liquid buffer barrel 604 can alleviate the waste liquid because recycling in rough polishing liquid recycling bin 601
The mixed liquor in subsequent inflow rough polishing liquid tempering tank 101 is caused not supply rough polishing liquid to polishing machine 500 in time because PH is unqualified,
The rough polishing production for preventing from influencing silicon wafer, rough polishing liquid buffer barrel 604 is arranged before polishing machine 500 in advance can guarantee inflow polishing machine
The duration that rough polishing liquid uses in 500.
Further, it is in test rough polishing tempering tank 101 that 700 purpose of liquid level sensor is equipped in rough polishing tempering tank 101
Whether the height of pure water solvent meets the requirements, and when configuring rough polishing liquid stoste, the pure water injected in rough polishing liquid tempering tank 101 reaches
When to standard requirements, pure water source 400 stops supplying water, and it is former to start titration input rough polishing stoste and KOH into rough polishing liquid tempering tank 101
Liquid.Liquid level sensor 700 is equipped in rough polishing liquid buffer barrel 104 and rough polishing liquid recycling bin 601, purpose controls rough polishing liquid buffering
Bucket 104 and rough polishing liquid recycling bin 601 in liquid level whether within the scope of calibrated altitude, if be lower than minimum liquid level face, stop to
Outer output solution stops inputting solution into bucket if being higher than highest night non-face, is ensuring that rough polishing liquid buffer barrel 104 and thick
Solution in throwing liquid recycling bin 601 within the scope of safe volume, avoids the occurrence of overflow or appearance lacks, and then guarantee production process always
Duration.In the present embodiment, common common model can be selected in liquid level sensor 700, and specific the application no longer limits.
It is returned in rough polishing tempering tank 101, rough polishing original liquid box 102, KOH original liquid box 103, rough polishing liquid buffer barrel 104 and rough polishing liquid
The output end for receiving bucket 601 is equipped with unidirectional quantitative feed pump and control valve, and supply pump and control valve can be with the corresponding buckets of real-time control
The working condition of liquid.In the present embodiment, all supply pumps are unidirectional quantitative feed pump, prevent medical fluid from flowing back, and pollute feed flow
System.It is additionally provided with control valve in pure water pipe 401, inputs opening for pure water to rough polishing tempering tank 101 to control pure water source 400
Stop.In the present embodiment, supply pump and control valve are common spare and accessory parts, herein not concrete restriction.
The application recyclable device is additionally provided with external controller (figure omits), is the PLC controller of polishing machine 500, and setting exists
On the housing wall of polishing machine (figure omits), it is connect with all supply pumps, control valve, circulating pump and liquid level sensor 700.
Further, this recyclable device further includes that essence throws unit and surface-active unit.Specifically, essence is thrown unit 200 and is used
It is used in mixed configuration fine polishing liquid and fine polishing liquid is delivered in polishing machine 500, including essence throws tempering tank 201 and essence throws original liquid box
202, essence throws the output end of original liquid box 202 and essence is thrown tempering tank 201 and is connected to, and essence throws the output end and polishing machine 500 of tempering tank 201
It is connected to, the output end of pure water pipe 402 is thrown tempering tank 201 with essence and is connected in pure water source 400.Surface-active unit 300 is for mixing
Configuration surface activating agent and surfactant is delivered in polishing machine 500 uses, including surface-active tempering tank 301 and surface
Active original liquid box 302, the output end and surface-active tempering tank 301 of surface-active original liquid box 302, surface-active tempering tank 301
Output end be connected to polishing machine 500, the output end of pure water pipe 403 is connected to surface-active tempering tank 301 in pure water source 400.
In the present embodiment, essence throws the allocation ratio of stoste and pure water and the configuration ratio of surface-active stoste and pure water
Example omit, according to the actual situation depending on.Meanwhile it is less to the usage amount of fine polishing liquid and surfactant because chemically-mechanicapolish polishing,
Using rear direct emission, it is not recycled.It is respectively equipped in fine polishing liquid tempering tank 201 and surfactant tempering tank 301
Circulating pump 203 and circulating pump 303, function and effect are identical as circulating pump 105；In fine polishing liquid tempering tank 201 and surfactant
Liquid level sensor 700, the effect of purpose and the liquid level sensor 700 in rough polishing liquid tempering tank 101 are respectively equipped in tempering tank 301
Fruit is identical, and this will not be detailed here.The configuration for throwing unit 200 and surface-active unit 300 for essence is identical as rough polishing unit 100,
It omits herein.
The recyclable device occupied area of the application design is small, and recovery process structure simplifies, reduce the recycling of rough polishing liquid at
This.Rough polishing liquid configures high degree of automation, reduces operator's workload and improves the proportion accuracy of rough polishing liquid, guarantees silicon wafer table
The quality of face polishing.The PH of the rough polishing liquid of recycling and the stabilization of rough polishing liquid partial size are kept simultaneously.Improving yield
The homogeneity for guaranteeing product simultaneously, provides consistency high raw material for the processing of silicon wafer polishing, improves the one of polishing geometric parameter
Cause property, and guarantee product qualification rate.
A kind of polishing fluid recyclable device control method, using recyclable device as described above, specific steps include:
Step 1: configuration rough polishing liquid mixed solution
Including successively by the pure water of pure water source 400, the KOH of the rough polishing stoste of rough polishing original liquid box 102 and KOH original liquid box 103
Stoste is input in rough polishing liquid tempering tank 101 and mixes, and guarantees the volume ratio of pure water, rough polishing stoste and KOH stoste are as follows: (15-
30): 1:(0.1-0.9).
Specifically, the control valve 14 and 15 of the pure water pipe 401 in controller control pure water source 400 is open state, will be pure
Aqueous solvent is input in rough polishing tempering tank 101；Rough polishing original liquid box 102, KOH original liquid box 103, rough polishing tempering tank 101 and thick at this time
Liquid buffer barrel 104 is thrown to be in off state.Controller controls the pure water of the output of pure water pipe 401 thick by liquid level sensor 700
The height in tempering tank 101 is thrown whether within the scope of calibrated altitude, when pure water reaches normal volume, stops pure water source 400
It supplies water, closes control valve K14 and control valve K15.
Further, by the synchronous supply pump 106 and control valve K2 opened in rough polishing original liquid box 102 of controller, and
Supply pump and control valve K1 in KOH original liquid box 103 start to input with liquid volume ratio into rough polishing tempering tank 101 according to standard
Rough polishing stoste and KOH stoste are started to work at this point, circulating pump 104 is synchronous, and circulating pump 104 and control valve K10 are protected ever since
Hold working condition, it is therefore an objective to guarantee that the rough polishing liquid in rough polishing tempering tank 101 is uniformly mixed, be sufficiently stirred, to keep rough polishing liquid mixed
The uniformity and stability of conjunction.After rough polishing stoste and KOH stoste supply, 106 He of supply pump in rough polishing original liquid box 102
Supply pump in KOH original liquid box 103 stops working, and control valve K1 and control valve K2 is disconnected.
Step 2: rough polishing liquid followed by after rough polishing liquid buffer barrel 104 and heater 106 enter polishing machine 500 in use.
Specifically, the circulating pump 104 in rough polishing tempering tank 101 recycles the supply of rough polishing tempering tank 101 after a certain period of time
Pump and control valve K9 are open-minded, and mixed rough polishing liquid stream enters in rough polishing liquid buffer barrel 104, meanwhile, the confession of rough polishing liquid tempering tank 104
It is opened to pump and control valve K11, heater 106 is started to work, and the rough polishing liquid exported to rough polishing liquid tempering tank 104 heats,
And guaranteeing that the temperature of heater 106 is set in 22-26 DEG C, rough polishing liquid becomes temperature constant state when flowing through heater 106 by pipeline
Polishing fluid, then through pipeline flow into polishing machine 500 use.
In the present embodiment, the allocation ratio of rough polishing stoste and KOH stoste and pure water, according to the actual situation depending on, In
This is not particularly limited；How long stirring need to be recycled accordingly for mixed rough polishing liquid, need the configuration according to rough polishing liquid
Ratio is set, and is herein omitted.
Step 3: useless rough polishing liquid is recycled
The useless rough polishing liquid flowed out from polishing machine 500 is imported to rough polishing liquid recycling bin 601, after the filtering of filter device 604
Rough polishing liquid, which enters, carries out PH detection in PH detector 602, the rough polishing liquid of PH qualification flows directly into rough polishing liquid tempering tank 101.
Specifically, control valve K12 is opened, and useless rough polishing liquid is flow to through pipeline is arranged in 601 upper end of rough polishing liquid recycling bin
On filter device 604, useless rough polishing liquid successively after gross porosity diameter filter screen 6041, fine pore filter screen 6042 filter, imports rough polishing
In liquid recycling bin 601；When filtered waste liquid is below minimum level or more than highest liquid level, control valve K6 is to close shape
State, when liquid level is between minimum level and highest liquid level, signal is passed to controller, controller by liquid level sensor 700
The supply pump and control valve K6 for controlling rough polishing liquid recycling bin 601 again are opened, meanwhile, PH tester starts to carry out the waste liquid of outflow
Real time monitoring test.
If PH, within the scope of 10.5-11.5, control valve K8 is opened, the waste liquid after qualification directly flows into slightly through pipeline again
It throws in liquid tempering tank 101.If PH is unqualified, that is, it is lower than 10.5, then, test result is passed to controller by PH tester 604, control
The content for the KOH that device processed configures required for calculating further according to the calculation formula that system is set, and extremely by transmission of feedback information
It is arranged in 103 supply pump of KOH original liquid box, at this point, 103 supply pump of KOH original liquid box, control valve K1 and K3 are opened, control valve K4
Continue to close, further according to needing in time, into rough polishing liquid, input KOH stoste carries out the supply pump of KOH original liquid box 103 in turning barrel 604
Mixing.After KOH stoste inputs, 103 supply pump of KOH original liquid box, control valve K1 and K3 are closed, turning barrel 603 in rough polishing liquid
Supply pump and control valve K5 are opened, and mixed rough polishing liquid flows into rough polishing liquid tempering tank 101 through pipeline again, are continued to be mixed and be stirred
It mixes, reuses again.
Mixed rough polishing liquid successively passes through rough polishing liquid buffer barrel 104 and heater 106, stream from rough polishing liquid tempering tank 101
Enter and used in polishing machine 500, this process is not repeated herein as described in step 1.
The advantages and positive effects of the present invention are:
1, compared with prior art, the present invention proposes a kind of polishing fluid recyclable device, and structure design is simple and controllable, passes through
Recovery unit recycles used rough polishing liquid, while can judge that the PH of rough polishing mixed liquor after the recovery is in advance using PH detector
It is no to reach standard requirements, if qualification continues to use, if it is unqualified, then by again be flowed into after KOH stoste mixed configuration it is thick
It throws in liquid tempering tank, all process safeties and automatic monitoring can guarantee the quality of rough polishing liquid used in circulation and stress completely, into
And it can ensure that the consistency activating agent of silicon chip surface flatness.
2, the setting of rough polishing liquid buffer barrel can be alleviated because the waste liquid recycled in rough polishing liquid recycling bin causes because PH is unqualified
The subsequent mixed liquor flowed into rough polishing liquid tempering tank can not supply rough polishing liquid to polishing machine in time, prevent the rough polishing for influencing silicon wafer raw
It produces, rough polishing liquid buffer barrel is arranged before polishing machine in advance can guarantee the duration for flowing into that rough polishing liquid uses in polishing machine.
3, circulating pump is added in rough polishing liquid tempering tank, when starting to input rough polishing stoste, circulating pump is started to work, and
It is continuously circulated work ever since, the use of circulating pump can guarantee the rough polishing liquid stirring in rough polishing liquid tempering tank sufficiently, Jin Erbao
Demonstrate,prove the uniform and stability of rough polishing liquid.
4, PH detector is always maintained at open state in removal process, the PH of real-time monitoring recovered liquid and timely feedback to
KOH original liquid box supply pump keeps it quantitative and inputs KOH stoste to be supplemented in turning barrel into recycling rough polishing liquid, guarantees to flow into rough polishing
Rough polishing liquid PH in liquid tempering tank is met the requirements of the standard.
5, the temperature of rough polishing liquid is affected to entire polishing process in rough polishing unit, therefore specially one heater of setting is to thick
Throwing unit exports the rough polishing liquid into polishing machine and is heated, while being supervised by temperature of the temperature sensor to rough polishing liquid
Control, guarantee rough polishing liquid temperature it is constant be 22-26 DEG C, at this temperature rough polishing liquid can make silicon chip surface have complete lattice,
Higher flatness and cleanliness guarantee silicon chip surface quality.
6, the recyclable device occupied area of the application design is small, and recovery process structure simplifies, and reduces the recycling of rough polishing liquid
Cost.Rough polishing liquid configures high degree of automation, reduces operator's workload and improves the proportion accuracy of rough polishing liquid, guarantees silicon wafer
The quality of surface polishing.The PH of the rough polishing liquid of recycling and the stabilization of rough polishing liquid partial size are kept simultaneously.Improving yield
While guarantee the homogeneity of product, provide consistency high raw material for the processing of silicon wafer polishing, raising polishes geometric parameter
Consistency, and guarantee product qualification rate.
The embodiments of the present invention have been described in detail above, content is only the preferred embodiment of the present invention, no
It can be believed to be used to limit the scope of the invention.Any changes and modifications in accordance with the scope of the present application,
It should still fall within the scope of the patent of the present invention.
Claims (10)
1. a kind of polishing fluid recyclable device, which is characterized in that including rough polishing unit and recovery unit, the rough polishing unit includes thick
It throws liquid tempering tank and rough polishing liquid buffer barrel, the rough polishing liquid buffer barrel input terminal is connected to the rough polishing liquid tempering tank, output end
It is connected to polishing machine；The recovery unit includes rough polishing liquid recycling bin, PH detector, turning barrel and KOH original liquid box in rough polishing liquid, institute
It states rough polishing liquid recycling bin to be connected to the polishing machine output end, the PH detector input terminal and the rough polishing liquid recycling bin export
End connection, the PH detector output end connect with the input terminal of turning barrel in the rough polishing liquid tempering tank and the rough polishing liquid respectively
It is logical；The KOH original liquid box output end is connected to turning barrel in the rough polishing liquid and the rough polishing tempering tank input terminal respectively.
2. a kind of polishing fluid recyclable device according to claim 1, which is characterized in that the rough polishing stoste group further includes thick
Original liquid box and pure water source are thrown, the rough polishing original liquid box and the pure water source output terminal connect with the rough polishing tempering tank input terminal
It is logical.
3. a kind of polishing fluid recyclable device according to claim 2, which is characterized in that set in the rough polishing liquid tempering tank
There is circulating pump, when starting to titrate the stoste in the rough polishing original liquid box after pure water source configuration, the circulating pump is same
Step starts to work and continues to keep working condition.
4. a kind of polishing fluid recyclable device according to claim 3, which is characterized in that in the rough polishing liquid buffer barrel and institute
It states and is equipped with heater and temperature sensor between polishing machine, the heter temperature is 22-26 DEG C.
5. a kind of polishing fluid recyclable device according to claim 1-4, which is characterized in that mixed in the rough polishing
Liquid level sensor is equipped in bucket, the rough polishing liquid buffer barrel and the rough polishing liquid recycling bin；In the rough polishing tempering tank, described
Rough polishing liquid buffer barrel, the rough polishing liquid recycling bin, the KOH original liquid box, the rough polishing original liquid box output end be equipped with unidirectionally
Quantitative feed pump and control valve.
6. a kind of polishing fluid recyclable device according to claim 5, which is characterized in that in the rough polishing liquid recycling bin also
Equipped with filter device, the filter device is located at the upper end of the rough polishing liquid recycling bin.
7. a kind of polishing fluid recyclable device according to claim 6, which is characterized in that further include that essence throwing unit and surface are living
Property unit, it is described essence throw unit be connected to the polishing machine, be delivered to throwing for mixed configuration fine polishing liquid and by the fine polishing liquid
It is used in ray machine；The surface-active unit is connected to the polishing machine, for mixed configuration surfactant and by the table
Face activating agent, which is delivered in polishing machine, to be used.
8. a kind of polishing fluid recyclable device control method, which is characterized in that using such as the described in any item recycling of claim 1-7
Device, including the pure water source, the rough polishing original liquid box and the KOH original liquid box are successively input to the rough polishing liquid tempering tank
Rough polishing liquid described in mixed configuration, and guarantee the volume ratio of pure water source, rough polishing stoste and KOH stoste are as follows: (15-30): 1:(0.1-
0.9)；The rough polishing liquid followed by after the rough polishing liquid buffer barrel and the heater enter the polishing machine in use.
9. a kind of polishing fluid recyclable device control method according to claim 8, which is characterized in that from the polishing machine stream
The useless rough polishing liquid out is imported to the rough polishing liquid recycling bin, after filter device filtering described in the entrance of rough polishing liquid
PH detection is carried out in PH detector, the rough polishing liquid of PH qualification flows directly into the rough polishing liquid tempering tank.
10. a kind of polishing fluid recyclable device control method according to claim 9, which is characterized in that PH is underproof thick
It throws liquid to import in the rough polishing liquid in turning barrel, then is mixed with the KOH stoste in the KOH original liquid box, and make mixed
The rough polishing liquid PH is 10.5-11.5, then is flowed into the rough polishing liquid tempering tank.
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| CN114083441A (en) * | 2022-01-17 | 2022-02-25 | 杭州中欣晶圆半导体股份有限公司 | Mortar barrel of sheet grinding machine and operation method |
| CN114851083A (en) * | 2022-04-29 | 2022-08-05 | 无锡恒大电子科技有限公司 | Device for supplying stable SLURRY grinding fluid for CMP process |
| CN115282692A (en) * | 2022-07-19 | 2022-11-04 | 江阴萃科智能制造技术有限公司 | Grinding fluid filtering and circulating method of grinding and polishing equipment |
| CN115505339A (en) * | 2022-10-31 | 2022-12-23 | 上海新昇半导体科技有限公司 | Recycling method of coarse polishing solution |
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